DE69823400D1 - Überwachung der Luftkühlung von integrierten Schaltungen in elektronischen Geräten - Google Patents

Überwachung der Luftkühlung von integrierten Schaltungen in elektronischen Geräten

Info

Publication number
DE69823400D1
DE69823400D1 DE69823400T DE69823400T DE69823400D1 DE 69823400 D1 DE69823400 D1 DE 69823400D1 DE 69823400 T DE69823400 T DE 69823400T DE 69823400 T DE69823400 T DE 69823400T DE 69823400 D1 DE69823400 D1 DE 69823400D1
Authority
DE
Germany
Prior art keywords
electronic devices
integrated circuits
air cooling
cooling monitoring
monitoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69823400T
Other languages
English (en)
Other versions
DE69823400T2 (de
Inventor
Minoru Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69823400D1 publication Critical patent/DE69823400D1/de
Publication of DE69823400T2 publication Critical patent/DE69823400T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Emergency Alarm Devices (AREA)
  • Measuring Volume Flow (AREA)
DE69823400T 1997-01-31 1998-01-31 Überwachung der Luftkühlung von integrierten Schaltungen in elektronischen Geräten Expired - Fee Related DE69823400T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9033137A JP3011117B2 (ja) 1997-01-31 1997-01-31 冷却系アラーム検出システム
JP3313797 1997-01-31

Publications (2)

Publication Number Publication Date
DE69823400D1 true DE69823400D1 (de) 2004-06-03
DE69823400T2 DE69823400T2 (de) 2005-02-17

Family

ID=12378220

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69823400T Expired - Fee Related DE69823400T2 (de) 1997-01-31 1998-01-31 Überwachung der Luftkühlung von integrierten Schaltungen in elektronischen Geräten

Country Status (5)

Country Link
US (1) US6157897A (de)
EP (1) EP0857012B1 (de)
JP (1) JP3011117B2 (de)
CA (1) CA2228698C (de)
DE (1) DE69823400T2 (de)

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US6487463B1 (en) * 1998-06-08 2002-11-26 Gateway, Inc. Active cooling system for an electronic device
DE59913312D1 (de) * 1998-08-31 2006-05-18 Siemens Ag Verfahren zur begrenzung eines elektrischen stroms durch ein elektrisches bauteil und begrenzungsvorrichtung
US6359565B1 (en) * 1999-06-03 2002-03-19 Fujitsu Network Communications, Inc. Method and system for monitoring the thermal status of a card shelf
US6744586B2 (en) 2000-01-03 2004-06-01 Seagate Technology Llc Method and apparatus for monitoring temperature
US6493224B1 (en) * 2000-08-08 2002-12-10 Lucent Technologies Inc. Method and apparatus to increase convection heat transfer in an electrical system and a method of manufacturing the same
DE10146385A1 (de) * 2001-09-20 2003-04-17 Siemens Ag Anordnung und Verfahren zur Bestimmung eines Austauschkriteriums für ein Luftfilter
EP1554556B1 (de) 2002-10-24 2016-04-27 The Government of the United States of America, as represented by the Secretary, Department of Health & Human Services Verfahren und apparat zum lecktesten eines umgebungsbehälters
WO2005051064A1 (ja) * 2003-11-19 2005-06-02 Fujitsu Limited 電子機器におけるファン回転数制御方法
WO2007019304A2 (en) * 2005-08-05 2007-02-15 Wrd Corporation Adaptive cooling method for computer rack enclosure
US7413343B2 (en) * 2005-09-16 2008-08-19 Kyocera Wireless Corp. Apparatus for determining a temperature sensing element
JP4175383B2 (ja) * 2006-05-15 2008-11-05 セイコーエプソン株式会社 電子機器
CN101191779A (zh) * 2006-12-01 2008-06-04 鸿富锦精密工业（深圳）有限公司 散热器热阻值测量装置
JP4829162B2 (ja) * 2007-03-30 2011-12-07 株式会社東芝 情報処理装置、および冷却性能測定／劣化検出方法
US20090073731A1 (en) * 2007-09-14 2009-03-19 Vijay Phadke Health monitoring of power converter fans and electric motors
US7817051B2 (en) * 2007-09-14 2010-10-19 Astec International Limited Power converter with degraded component alarm
US7830269B2 (en) * 2007-09-14 2010-11-09 Astec International Limited Health monitoring for power converter capacitors
US7804415B2 (en) * 2007-09-14 2010-09-28 Astec International Limited Health monitoring for power converter components
US20090139972A1 (en) * 2007-10-23 2009-06-04 Psion Teklogix Inc. Docking connector
US7698095B2 (en) * 2008-01-30 2010-04-13 International Business Machines Corporation Apparatus, system, and method for detecting fan rotation direction in electronic devices
US8313038B2 (en) * 2008-06-25 2012-11-20 Minebea Co., Ltd. Telecom shelter cooling and control system
JP5218276B2 (ja) * 2009-05-19 2013-06-26 富士通株式会社 空調制御システム、空調制御方法および空調制御プログラム
US8155922B2 (en) * 2009-06-04 2012-04-10 Eaton Corporation Electrical device cooling efficiency monitoring
US20120241140A1 (en) * 2011-03-25 2012-09-27 Macdonald Mark Apparatus, system and method for airflow monitoring and thermal management in a computing device
TW201421217A (zh) * 2012-11-28 2014-06-01 Hon Hai Prec Ind Co Ltd 風扇失效的偵測系統及偵測方法
US20150243428A1 (en) * 2014-02-21 2015-08-27 Varentec, Inc. Methods and systems of field upgradeable transformers
US9945576B2 (en) * 2014-10-08 2018-04-17 Dell Products, Lp System and method for detecting the presence of alternate cooling systems
JP6529760B2 (ja) * 2014-12-26 2019-06-12 株式会社東芝 電子機器、筐体内の空気流量の算出方法、およびプログラム
CN106546357B (zh) * 2015-09-23 2020-06-02 中兴通讯股份有限公司 一种检测环境温度的方法、装置和电子设备
JP7064730B2 (ja) * 2018-04-12 2022-05-11 株式会社Mtl 管理システム
JP7103164B2 (ja) * 2018-10-31 2022-07-20 オムロン株式会社 温度異常検知システム、温度異常検知方法、およびプログラム
RU2716648C1 (ru) * 2019-07-16 2020-03-13 ФЕДЕРАЛЬНОЕ ГОСУДАРСТВЕННОЕ БЮДЖЕТНОЕ ОБРАЗОВАТЕЛЬНОЕ УЧРЕЖДЕНИЕ ВЫСШЕГО ОБРАЗОВАНИЯ "Брянский государственный технический университет" Охлаждаемая лопатка газовой турбины
DE102020128059A1 (de) 2020-10-26 2022-04-28 Diehl Ako Stiftung & Co. Kg Verfahren und Vorrichtung zum Überwachen einer Luftkühlvorrichtung

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US4722669A (en) * 1985-03-25 1988-02-02 Control Resources, Inc. Fan speed controller
US4808009A (en) * 1986-06-05 1989-02-28 Rosemount, Inc. Integrated semiconductor resistance temperature sensor and resistive heater
DE3639435A1 (de) * 1986-11-18 1988-05-26 Hoelter Heinz Volumenstromueberwachung fuer filternde geraete
KR890010539A (ko) * 1987-12-08 1989-08-09 시끼모리야 감열식 유량센서
JPH02123413A (ja) * 1988-11-02 1990-05-10 Fujitsu Ltd 温度異常検出方式
JPH02148296A (ja) * 1988-11-30 1990-06-07 Toshiba Corp 電子機器異常警報装置
JPH02184313A (ja) * 1989-01-10 1990-07-18 Nec Corp 冷却ファン
JPH04295223A (ja) * 1991-03-22 1992-10-20 Fuji Electric Co Ltd 半導体装置の警報回路
US5477417A (en) * 1992-08-28 1995-12-19 Kabushiki Kaisha Toshiba Electronic equipment having integrated circuit device and temperature sensor
WO1995025255A1 (en) * 1992-09-28 1995-09-21 Aavid Engineering, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
US5302022A (en) * 1992-12-22 1994-04-12 Vlsi Technology, Inc. Technique for measuring thermal resistance of semiconductor packages and materials
US5356216A (en) * 1993-05-03 1994-10-18 Industrial Technology Research Institute Apparatus for measuring heat of circuit module
DE4330922C2 (de) * 1993-09-13 1997-03-20 Loh Kg Rittal Werk Vorrichtung zur Überwachung des Luftstromes einer Kühleinrichtung für einen Schaltschrank oder ein Elektronikgehäuse
GB2284261B (en) * 1993-11-29 1997-03-05 Bicc Plc Thermal management of electronics equipment
US5612677A (en) * 1995-09-29 1997-03-18 Baudry; Jean-Jerome C. System to monitor the temperature of an integrated circuit and to dissipate heat generated thereby
US5726874A (en) * 1996-11-13 1998-03-10 Liang; Charles Power supply having a dual air flow control for reducing heat buildup
US5838187A (en) * 1997-02-10 1998-11-17 Lucent Technologies Inc. Integrated circuit thermal shutdown system utilizing a thermal sensor
US5844208A (en) * 1997-04-04 1998-12-01 Unisys Corporation Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature
US5821505A (en) * 1997-04-04 1998-10-13 Unisys Corporation Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink
US5926367A (en) * 1997-12-09 1999-07-20 Intel Corporation Method and apparatus for the thermal management of electronic devices

Also Published As

Publication number Publication date
EP0857012A1 (de) 1998-08-05
CA2228698C (en) 2002-12-31
US6157897A (en) 2000-12-05
DE69823400T2 (de) 2005-02-17
EP0857012B1 (de) 2004-04-28
CA2228698A1 (en) 1998-07-31
JP3011117B2 (ja) 2000-02-21
JPH10222777A (ja) 1998-08-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee