DE69819027T2 - 3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist - Google Patents

3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist Download PDF

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Publication number
DE69819027T2
DE69819027T2 DE69819027T DE69819027T DE69819027T2 DE 69819027 T2 DE69819027 T2 DE 69819027T2 DE 69819027 T DE69819027 T DE 69819027T DE 69819027 T DE69819027 T DE 69819027T DE 69819027 T2 DE69819027 T2 DE 69819027T2
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DE
Germany
Prior art keywords
view
values
image
camera
transparent reticle
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69819027T
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German (de)
English (en)
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DE69819027D1 (de
Inventor
M. Elwin BEATY
P. David MORK
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Beaty Elwin M Minnetonka
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Beaty Elwin M Minnetonka
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Publication of DE69819027D1 publication Critical patent/DE69819027D1/de
Publication of DE69819027T2 publication Critical patent/DE69819027T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE69819027T 1997-05-05 1998-05-04 3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist Expired - Fee Related DE69819027T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US850473 1997-05-05
US08/850,473 US6055054A (en) 1997-05-05 1997-05-05 Three dimensional inspection system
PCT/US1998/008950 WO1998050757A2 (en) 1997-05-05 1998-05-04 Three dimensional inspection system

Publications (2)

Publication Number Publication Date
DE69819027D1 DE69819027D1 (de) 2003-11-20
DE69819027T2 true DE69819027T2 (de) 2004-05-19

Family

ID=25308209

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69819027T Expired - Fee Related DE69819027T2 (de) 1997-05-05 1998-05-04 3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist

Country Status (6)

Country Link
US (1) US6055054A (https=)
EP (1) EP1017962B1 (https=)
JP (2) JP2002515124A (https=)
KR (1) KR20010012293A (https=)
DE (1) DE69819027T2 (https=)
WO (1) WO1998050757A2 (https=)

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DE60027175D1 (de) * 1999-07-13 2006-05-18 Beaty Elwin M Verfahren und apparat für die dreidimensionale inspektion von elektronischen komponenten
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WO2003032252A2 (en) * 2001-10-09 2003-04-17 Dimensional Photonics, Inc. Device for imaging a three-dimensional object
DE10354793A1 (de) * 2002-11-23 2004-06-03 Odas Gmbh Verfahren zur fotografischen Aufnahme eines zylinderförmigen, insbesondere plattenförmigen Gegenstandes
US7340085B2 (en) * 2003-09-03 2008-03-04 Microview Technologies Pte Ltd. Rotating prism component inspection system
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CN102012607B (zh) * 2010-09-29 2011-12-28 卓盈微电子（昆山）有限公司 对柔性线路板成像的装置
JP5854680B2 (ja) * 2011-07-25 2016-02-09 キヤノン株式会社 撮像装置
FR3004571B1 (fr) * 2013-04-11 2015-04-10 Vit Procede de correction d'une image tridimensionnelle d'un circuit electronique
WO2016195726A1 (en) * 2015-06-05 2016-12-08 Kla-Tencor Corporation Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices
WO2017031710A1 (en) 2015-08-26 2017-03-02 Abb Schweiz Ag Object multi-perspective inspection apparatus and method therefor
CN105588841A (zh) * 2016-01-28 2016-05-18 浙江工业大学 基于机器视觉的针脚倾斜缺陷检测装置
JP7194055B2 (ja) * 2019-03-22 2022-12-21 日立Astemo株式会社 接合部の検査方法及び接合部の検査装置
CN112985275B (zh) * 2021-05-14 2021-08-20 苏州鼎纳自动化技术有限公司 一种产品内壁尺寸检测机构

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Also Published As

Publication number Publication date
JP2009156877A (ja) 2009-07-16
JP2002515124A (ja) 2002-05-21
JP4901903B2 (ja) 2012-03-21
EP1017962A2 (en) 2000-07-12
KR20010012293A (ko) 2001-02-15
WO1998050757A2 (en) 1998-11-12
WO1998050757A3 (en) 2002-01-03
EP1017962B1 (en) 2003-10-15
EP1017962A4 (en) 2000-07-26
US6055054A (en) 2000-04-25
DE69819027D1 (de) 2003-11-20

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee