DE69813059D1 - Dunnschicht-Fluoropolymer enthaltendes elektronisches System - Google Patents
Dunnschicht-Fluoropolymer enthaltendes elektronisches SystemInfo
- Publication number
- DE69813059D1 DE69813059D1 DE69813059T DE69813059T DE69813059D1 DE 69813059 D1 DE69813059 D1 DE 69813059D1 DE 69813059 T DE69813059 T DE 69813059T DE 69813059 T DE69813059 T DE 69813059T DE 69813059 D1 DE69813059 D1 DE 69813059D1
- Authority
- DE
- Germany
- Prior art keywords
- thin layer
- electronic system
- system containing
- containing thin
- layer fluoropolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F14/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F14/18—Monomers containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/48—Isomerisation; Cyclisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
- Y10T428/31544—Addition polymer is perhalogenated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1916597 | 1997-01-31 | ||
JP20185297 | 1997-07-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69813059D1 true DE69813059D1 (de) | 2003-05-15 |
DE69813059T2 DE69813059T2 (de) | 2003-11-27 |
Family
ID=26355994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1998613059 Expired - Fee Related DE69813059T2 (de) | 1997-01-31 | 1998-01-30 | Dunnschicht-Fluoropolymer enthaltendes elektronisches System |
Country Status (5)
Country | Link |
---|---|
US (1) | US6203912B1 (de) |
EP (1) | EP0856529B1 (de) |
KR (1) | KR19980070980A (de) |
DE (1) | DE69813059T2 (de) |
TW (1) | TW416260B (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5866711A (en) * | 1996-09-13 | 1999-02-02 | E. I. Du Pont De Nemours And Company | Fluorocyanate and fluorocarbamate monomers and polymers thereof |
JP4547735B2 (ja) * | 1999-07-14 | 2010-09-22 | ダイキン工業株式会社 | 含フッ素重合体の硬化方法 |
JP4343354B2 (ja) * | 1999-11-02 | 2009-10-14 | Agcセイミケミカル株式会社 | 半田用フラックス這い上がり防止剤組成物とその用途 |
WO2002084346A1 (fr) * | 2001-04-10 | 2002-10-24 | Asahi Glass Company, Limited | Guide d'ondes optique |
US7129009B2 (en) * | 2002-05-14 | 2006-10-31 | E. I. Du Pont De Nemours And Company | Polymer-liquid compositions useful in ultraviolet and vacuum ultraviolet uses |
US6956085B2 (en) * | 2003-02-14 | 2005-10-18 | 3M Innovative Properties Company | Fluoroelastomer compositions |
JP2005075880A (ja) | 2003-08-29 | 2005-03-24 | Du Pont Mitsui Fluorochem Co Ltd | 低帯電性熱溶融性フッ素樹脂組成物 |
KR100670778B1 (ko) | 2004-10-11 | 2007-01-17 | 한국전자통신연구원 | 트리아진 그룹을 갖는 유기 반도체 소자용 화합물과, 이를포함하는 유기 반도체 박막 및 유기 반도체 소자와,이들의 제조 방법 |
CN101056946B (zh) * | 2004-11-11 | 2011-05-04 | 株式会社钟化 | 固化性组合物 |
KR101209046B1 (ko) * | 2005-07-27 | 2012-12-06 | 삼성디스플레이 주식회사 | 박막트랜지스터 기판과 박막트랜지스터 기판의 제조방법 |
EP1930385A4 (de) * | 2005-08-30 | 2009-11-11 | Asahi Glass Co Ltd | Wässriges oberflächenbehandlungsmittel und oberflächenbehandelte konstruktion |
US7388054B2 (en) * | 2005-12-23 | 2008-06-17 | 3M Innovative Properties Company | Fluoropolymer curing co-agent compositions |
US20090018275A1 (en) | 2007-01-26 | 2009-01-15 | Greene, Tweed Of Delaware, Inc. | Method of Bonding Perfluoroelastomeric Materials to a Surface |
WO2011046770A1 (en) * | 2009-10-14 | 2011-04-21 | Lockheed Martin Corporation | Serviceable conformal em shield |
US8947889B2 (en) | 2010-10-14 | 2015-02-03 | Lockheed Martin Corporation | Conformal electromagnetic (EM) detector |
WO2013085864A2 (en) | 2011-12-06 | 2013-06-13 | 3M Innovative Properties Company | Fluorinated oligomers having pendant functional groups |
US9528028B2 (en) | 2013-04-30 | 2016-12-27 | Cheil Industries, Inc. | Method for preparing modified silica film and modified silica film prepared from the same |
JP6134576B2 (ja) * | 2013-04-30 | 2017-05-24 | サムスン エスディアイ カンパニー,リミテッドSamsung Sdi Co.,Ltd. | 改質シリカ膜の製造方法、塗工液、及び改質シリカ膜 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4281092A (en) * | 1978-11-30 | 1981-07-28 | E. I. Du Pont De Nemours And Company | Vulcanizable fluorinated copolymers |
JPS5759850A (en) | 1980-09-30 | 1982-04-10 | Daikin Ind Ltd | Polyfluoroallyl ether and its preparation and use |
US4599386A (en) | 1984-10-18 | 1986-07-08 | E. I. Du Pont De Nemours And Company | Heat stable tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymers |
JPH01123849A (ja) * | 1987-11-10 | 1989-05-16 | Asahi Glass Co Ltd | 積層材用樹脂組成物及びその金属箔張積層板 |
JPH04252206A (ja) * | 1991-01-28 | 1992-09-08 | Matsushita Electric Works Ltd | S−トリアジン環含有ポリマーの製法 |
TW222650B (de) | 1991-04-01 | 1994-04-21 | Dow Corning | |
US5498657A (en) * | 1993-08-27 | 1996-03-12 | Asahi Glass Company Ltd. | Fluorine-containing polymer composition |
US5447993A (en) | 1994-04-19 | 1995-09-05 | E. I. Du Pont De Nemours And Company | Perfluoroelastomer curing |
JP3398492B2 (ja) * | 1994-10-21 | 2003-04-21 | 日本メクトロン株式会社 | 含フッ素エラストマー組成物 |
-
1998
- 1998-01-22 TW TW87100873A patent/TW416260B/zh not_active IP Right Cessation
- 1998-01-29 US US09/015,222 patent/US6203912B1/en not_active Expired - Fee Related
- 1998-01-30 EP EP19980101647 patent/EP0856529B1/de not_active Expired - Lifetime
- 1998-01-30 DE DE1998613059 patent/DE69813059T2/de not_active Expired - Fee Related
- 1998-01-31 KR KR1019980002736A patent/KR19980070980A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0856529B1 (de) | 2003-04-09 |
TW416260B (en) | 2000-12-21 |
KR19980070980A (ko) | 1998-10-26 |
US6203912B1 (en) | 2001-03-20 |
DE69813059T2 (de) | 2003-11-27 |
EP0856529A1 (de) | 1998-08-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |