DE69807463T2 - Verbinder mit multi-mode-anpassung und dessen verwendung bei einem auswechselbaren chip-modul - Google Patents

Verbinder mit multi-mode-anpassung und dessen verwendung bei einem auswechselbaren chip-modul

Info

Publication number
DE69807463T2
DE69807463T2 DE69807463T DE69807463T DE69807463T2 DE 69807463 T2 DE69807463 T2 DE 69807463T2 DE 69807463 T DE69807463 T DE 69807463T DE 69807463 T DE69807463 T DE 69807463T DE 69807463 T2 DE69807463 T2 DE 69807463T2
Authority
DE
Germany
Prior art keywords
connectors
chip module
mode adaptation
replaceable chip
replaceable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69807463T
Other languages
English (en)
Other versions
DE69807463D1 (de
Inventor
J Rathburn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gryphics Inc
Original Assignee
Gryphics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/852,116 external-priority patent/US5938451A/en
Priority claimed from US08/955,563 external-priority patent/US5913687A/en
Application filed by Gryphics Inc filed Critical Gryphics Inc
Publication of DE69807463D1 publication Critical patent/DE69807463D1/de
Application granted granted Critical
Publication of DE69807463T2 publication Critical patent/DE69807463T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69807463T 1997-05-06 1998-05-04 Verbinder mit multi-mode-anpassung und dessen verwendung bei einem auswechselbaren chip-modul Expired - Fee Related DE69807463T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/852,116 US5938451A (en) 1997-05-06 1997-05-06 Electrical connector with multiple modes of compliance
US08/955,563 US5913687A (en) 1997-05-06 1997-10-17 Replacement chip module
US6392797P 1997-10-31 1997-10-31
PCT/US1998/009010 WO1998050985A1 (en) 1997-05-06 1998-05-04 Multi-mode compliant connector and replaceable chip module utilizing the same

Publications (2)

Publication Number Publication Date
DE69807463D1 DE69807463D1 (de) 2002-10-02
DE69807463T2 true DE69807463T2 (de) 2003-05-15

Family

ID=27370546

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69807463T Expired - Fee Related DE69807463T2 (de) 1997-05-06 1998-05-04 Verbinder mit multi-mode-anpassung und dessen verwendung bei einem auswechselbaren chip-modul

Country Status (7)

Country Link
US (1) US6247938B1 (de)
EP (1) EP0980594B1 (de)
JP (1) JP3924329B2 (de)
KR (1) KR100509967B1 (de)
AU (1) AU7281698A (de)
DE (1) DE69807463T2 (de)
WO (1) WO1998050985A1 (de)

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409521B1 (en) 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
US6572396B1 (en) 1999-02-02 2003-06-03 Gryphics, Inc. Low or zero insertion force connector for printed circuit boards and electrical devices
WO2000055944A1 (en) * 1999-03-18 2000-09-21 The Boeing Company Aircraft ground power connector
JP4414017B2 (ja) * 1999-05-25 2010-02-10 モレックス インコーポレイテド Icソケット
US6830460B1 (en) 1999-08-02 2004-12-14 Gryphics, Inc. Controlled compliance fine pitch interconnect
WO2001054232A2 (en) * 2000-01-20 2001-07-26 Gryphics, Inc. Flexible compliant interconnect assembly
US6957963B2 (en) * 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
JP2001358474A (ja) * 2000-06-13 2001-12-26 Alps Electric Co Ltd 電気部品のプリント基板への接続構造
US6840777B2 (en) * 2000-11-30 2005-01-11 Intel Corporation Solderless electronics packaging
US6722896B2 (en) 2001-03-22 2004-04-20 Molex Incorporated Stitched LGA connector
US6694609B2 (en) 2001-03-22 2004-02-24 Molex Incorporated Method of making stitched LGA connector
US6406305B1 (en) * 2001-04-20 2002-06-18 Hon Hai Precision Ind. Co., Ltd. Electrical connector having compression terminal module therein
US6604950B2 (en) * 2001-04-26 2003-08-12 Teledyne Technologies Incorporated Low pitch, high density connector
US20060255446A1 (en) * 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US7029288B2 (en) * 2003-03-24 2006-04-18 Che-Yu Li Electrical contact and connector and method of manufacture
US7040902B2 (en) * 2003-03-24 2006-05-09 Che-Yu Li & Company, Llc Electrical contact
US7014479B2 (en) * 2003-03-24 2006-03-21 Che-Yu Li Electrical contact and connector and method of manufacture
EP1642364A1 (de) 2003-07-07 2006-04-05 Gryphics, Inc. Normal geschlossener nullkraftsteckverbinder
CN100459833C (zh) * 2003-07-16 2009-02-04 格瑞费克斯公司 具有联锁接触系统的电互连组件
US7297003B2 (en) * 2003-07-16 2007-11-20 Gryphics, Inc. Fine pitch electrical interconnect assembly
JP4021457B2 (ja) * 2003-07-29 2007-12-12 株式会社アドバンテスト ソケット、及び試験装置
US6945788B2 (en) * 2003-07-31 2005-09-20 Tyco Electronics Corporation Metal contact LGA socket
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
TWM253942U (en) * 2003-09-30 2004-12-21 Hon Hai Prec Ind Co Ltd Electrical connector contact
US7529635B2 (en) * 2004-02-12 2009-05-05 Seagate Technology, Llc Method and apparatus for head gimbal assembly testing
US6981879B2 (en) * 2004-03-18 2006-01-03 International Business Machines Corporation Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture
US7845986B2 (en) * 2004-05-06 2010-12-07 Interconnect Portfolio Llc Torsionally-induced contact-force conductors for electrical connector systems
US7335979B2 (en) 2004-06-28 2008-02-26 Intel Corporation Device and method for tilted land grid array interconnects on a coreless substrate package
US7220132B2 (en) * 2004-06-28 2007-05-22 Intel Corporation Tilted land grid array package and socket, systems, and methods
EP1808936A1 (de) * 2006-01-16 2007-07-18 Lih Duo International Co., Ltd. Gummifederverbinder
US8044502B2 (en) 2006-03-20 2011-10-25 Gryphics, Inc. Composite contact for fine pitch electrical interconnect assembly
CN100413160C (zh) * 2006-05-15 2008-08-20 番禺得意精密电子工业有限公司 一种电连接器的制造方法
US7226295B1 (en) * 2006-06-30 2007-06-05 Lotes Co., Ltd. Electrical connector
US7358603B2 (en) * 2006-08-10 2008-04-15 Che-Yu Li & Company, Llc High density electronic packages
JP2009043591A (ja) 2007-08-09 2009-02-26 Yamaichi Electronics Co Ltd Icソケット
JP5232593B2 (ja) * 2008-10-20 2013-07-10 株式会社日本マイクロニクス 電気的接続装置
JP5029969B2 (ja) * 2008-11-12 2012-09-19 山一電機株式会社 電気接続装置
US7857631B2 (en) * 2008-12-30 2010-12-28 Cascade Microtech, Inc. Socket with a housing with contacts with beams of unequal lengths
WO2010147939A1 (en) 2009-06-17 2010-12-23 Hsio Technologies, Llc Semiconductor socket
US8955215B2 (en) 2009-05-28 2015-02-17 Hsio Technologies, Llc High performance surface mount electrical interconnect
WO2011153298A1 (en) 2010-06-03 2011-12-08 Hsio Technologies, Llc Electrical connector insulator housing
US9276336B2 (en) 2009-05-28 2016-03-01 Hsio Technologies, Llc Metalized pad to electrical contact interface
US9536815B2 (en) 2009-05-28 2017-01-03 Hsio Technologies, Llc Semiconductor socket with direct selective metalization
WO2011139619A1 (en) 2010-04-26 2011-11-10 Hsio Technologies, Llc Semiconductor device package adapter
US9414500B2 (en) 2009-06-02 2016-08-09 Hsio Technologies, Llc Compliant printed flexible circuit
US8987886B2 (en) 2009-06-02 2015-03-24 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
US9613841B2 (en) 2009-06-02 2017-04-04 Hsio Technologies, Llc Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
US8789272B2 (en) 2009-06-02 2014-07-29 Hsio Technologies, Llc Method of making a compliant printed circuit peripheral lead semiconductor test socket
WO2010141266A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit peripheral lead semiconductor package
US9699906B2 (en) 2009-06-02 2017-07-04 Hsio Technologies, Llc Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
WO2011002712A1 (en) 2009-06-29 2011-01-06 Hsio Technologies, Llc Singulated semiconductor device separable electrical interconnect
WO2010141297A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit wafer level semiconductor package
US9196980B2 (en) 2009-06-02 2015-11-24 Hsio Technologies, Llc High performance surface mount electrical interconnect with external biased normal force loading
WO2013036565A1 (en) 2011-09-08 2013-03-14 Hsio Technologies, Llc Direct metalization of electrical circuit structures
WO2010141311A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit area array semiconductor device package
WO2011002709A1 (en) 2009-06-29 2011-01-06 Hsio Technologies, Llc Compliant printed circuit semiconductor tester interface
WO2012078493A1 (en) 2010-12-06 2012-06-14 Hsio Technologies, Llc Electrical interconnect ic device socket
WO2010141264A1 (en) 2009-06-03 2010-12-09 Hsio Technologies, Llc Compliant wafer level probe assembly
US8928344B2 (en) 2009-06-02 2015-01-06 Hsio Technologies, Llc Compliant printed circuit socket diagnostic tool
US8525346B2 (en) 2009-06-02 2013-09-03 Hsio Technologies, Llc Compliant conductive nano-particle electrical interconnect
WO2012074963A1 (en) 2010-12-01 2012-06-07 Hsio Technologies, Llc High performance surface mount electrical interconnect
US9276339B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Electrical interconnect IC device socket
WO2010147934A1 (en) 2009-06-16 2010-12-23 Hsio Technologies, Llc Semiconductor die terminal
US9231328B2 (en) 2009-06-02 2016-01-05 Hsio Technologies, Llc Resilient conductive electrical interconnect
WO2010141298A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Composite polymer-metal electrical contacts
WO2012061008A1 (en) 2010-10-25 2012-05-10 Hsio Technologies, Llc High performance electrical circuit structure
US8988093B2 (en) 2009-06-02 2015-03-24 Hsio Technologies, Llc Bumped semiconductor wafer or die level electrical interconnect
US8618649B2 (en) 2009-06-02 2013-12-31 Hsio Technologies, Llc Compliant printed circuit semiconductor package
US8912812B2 (en) 2009-06-02 2014-12-16 Hsio Technologies, Llc Compliant printed circuit wafer probe diagnostic tool
US8610265B2 (en) 2009-06-02 2013-12-17 Hsio Technologies, Llc Compliant core peripheral lead semiconductor test socket
US9930775B2 (en) 2009-06-02 2018-03-27 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
US9318862B2 (en) 2009-06-02 2016-04-19 Hsio Technologies, Llc Method of making an electronic interconnect
US8981568B2 (en) 2009-06-16 2015-03-17 Hsio Technologies, Llc Simulated wirebond semiconductor package
US8480066B2 (en) * 2009-08-24 2013-07-09 Ronald E. Anderson Head gimbal assembly alignment with compliant alignment pin
US8246387B2 (en) 2010-01-08 2012-08-21 Interconnect Portfolio Llc Connector constructions for electronic applications
US9350093B2 (en) 2010-06-03 2016-05-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
US10159154B2 (en) 2010-06-03 2018-12-18 Hsio Technologies, Llc Fusion bonded liquid crystal polymer circuit structure
US9689897B2 (en) 2010-06-03 2017-06-27 Hsio Technologies, Llc Performance enhanced semiconductor socket
US8758067B2 (en) 2010-06-03 2014-06-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
US9761520B2 (en) 2012-07-10 2017-09-12 Hsio Technologies, Llc Method of making an electrical connector having electrodeposited terminals
US10506722B2 (en) 2013-07-11 2019-12-10 Hsio Technologies, Llc Fusion bonded liquid crystal polymer electrical circuit structure
US10667410B2 (en) 2013-07-11 2020-05-26 Hsio Technologies, Llc Method of making a fusion bonded circuit structure
US9559447B2 (en) 2015-03-18 2017-01-31 Hsio Technologies, Llc Mechanical contact retention within an electrical connector
CN206532926U (zh) * 2017-01-18 2017-09-29 番禺得意精密电子工业有限公司 电连接器
JP6372675B1 (ja) * 2017-12-14 2018-08-15 Smk株式会社 カードエッジ接続装置
US20220211953A1 (en) * 2019-03-21 2022-07-07 Mayo Foundation For Medical Education And Research Fine needle injection therapy device

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1051988A (en) * 1975-05-30 1979-04-03 William S. Scheingold Electrical connector for leadless integrated circuit package
US4189200A (en) 1977-11-14 1980-02-19 Amp Incorporated Sequentially actuated zero insertion force printed circuit board connector
US4165909A (en) 1978-02-09 1979-08-28 Amp Incorporated Rotary zif connector edge board lock
US4468074A (en) 1978-05-22 1984-08-28 Rogers Corporation Solderless connection technique and apparatus
GB2027560A (en) * 1978-08-03 1980-02-20 Avdel Ltd Electrical connector
US4161346A (en) 1978-08-22 1979-07-17 Amp Incorporated Connecting element for surface to surface connectors
JPS56116282A (en) 1980-02-19 1981-09-11 Sharp Kk Electronic part with plural terminals
FR2495846A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de connexion electrique a haute densite de contacts
US4579411A (en) 1983-03-21 1986-04-01 Amp Incorporated Latch system for ZIF card edge connectors
US4498722A (en) 1983-12-05 1985-02-12 Amp Incorporated Latch device for ZIF card edge connectors
US4629270A (en) 1984-07-16 1986-12-16 Amp Incorporated Zero insertion force card edge connector with flexible film circuitry
US4593961A (en) * 1984-12-20 1986-06-10 Amp Incorporated Electrical compression connector
US4575170A (en) 1985-01-04 1986-03-11 Rogers Corporation Solderless connector
US4655524A (en) 1985-01-07 1987-04-07 Rogers Corporation Solderless connection apparatus
US4691972A (en) 1985-03-01 1987-09-08 Rogers Corporation Solderless connection apparatus
US4610495A (en) 1985-03-07 1986-09-09 Rogers Corporation Solderless connector apparatus and method of making the same
US4603928A (en) 1985-03-20 1986-08-05 Amp Incorporated Board to board edge connector
US4793814A (en) * 1986-07-21 1988-12-27 Rogers Corporation Electrical circuit board interconnect
US5227959A (en) 1986-05-19 1993-07-13 Rogers Corporation Electrical circuit interconnection
US4648668A (en) 1986-06-26 1987-03-10 Amp Incorporated Zero insertion force card edge connector
JPS6317550A (ja) 1986-07-10 1988-01-25 Yamaichi Electric Mfg Co Ltd Ic載接形ソケツト
US4789345A (en) 1987-05-15 1988-12-06 Wells Electronics, Inc. Socket device for fine pitch lead and leadless integrated circuit package
US4768971A (en) 1987-07-02 1988-09-06 Rogers Corporation Connector arrangement
US4872853A (en) 1988-12-08 1989-10-10 Amp Incorporated Circuit card retaining device
US4904197A (en) 1989-01-13 1990-02-27 Itt Corporation High density zif edge card connector
US4913656A (en) 1989-04-07 1990-04-03 Rogers Corporation Electrical connector
DE8907845U1 (de) 1989-06-27 1989-08-24 Siemens AG, 1000 Berlin und 8000 München Andruckstellverbinder
US5049084A (en) * 1989-12-05 1991-09-17 Rogers Corporation Electrical circuit board interconnect
US5096426A (en) * 1989-12-19 1992-03-17 Rogers Corporation Connector arrangement system and interconnect element
US5071359A (en) 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5163834A (en) 1990-12-17 1992-11-17 International Business Machines Corporation High density connector
US5061192A (en) 1990-12-17 1991-10-29 International Business Machines Corporation High density connector
US5167512A (en) * 1991-07-05 1992-12-01 Walkup William B Multi-chip module connector element and system
US5248262A (en) * 1992-06-19 1993-09-28 International Business Machines Corporation High density connector
US5338207A (en) 1993-06-09 1994-08-16 The Whitaker Corporation Multi-row right angle connectors
US5427535A (en) * 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
US5395252A (en) 1993-10-27 1995-03-07 Burndy Corporation Area and edge array electrical connectors
US5947749A (en) 1996-07-02 1999-09-07 Johnstech International Corporation Electrical interconnect contact system
US5795172A (en) 1996-12-18 1998-08-18 Intel Corporation Production printed circuit board (PCB) edge connector test connector
US5913687A (en) 1997-05-06 1999-06-22 Gryphics, Inc. Replacement chip module
US5938451A (en) 1997-05-06 1999-08-17 Gryphics, Inc. Electrical connector with multiple modes of compliance

Also Published As

Publication number Publication date
KR20010012202A (ko) 2001-02-15
EP0980594B1 (de) 2002-08-28
DE69807463D1 (de) 2002-10-02
EP0980594A1 (de) 2000-02-23
WO1998050985A1 (en) 1998-11-12
AU7281698A (en) 1998-11-27
JP3924329B2 (ja) 2007-06-06
US6247938B1 (en) 2001-06-19
JP2001524256A (ja) 2001-11-27
KR100509967B1 (ko) 2005-08-25

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