DE69804254T2 - Verkaselungspackung und verfahren zum verpacken von einem elektronisches schaltungsmodul - Google Patents

Verkaselungspackung und verfahren zum verpacken von einem elektronisches schaltungsmodul

Info

Publication number
DE69804254T2
DE69804254T2 DE69804254T DE69804254T DE69804254T2 DE 69804254 T2 DE69804254 T2 DE 69804254T2 DE 69804254 T DE69804254 T DE 69804254T DE 69804254 T DE69804254 T DE 69804254T DE 69804254 T2 DE69804254 T2 DE 69804254T2
Authority
DE
Germany
Prior art keywords
chamber
encapsulation
side wall
circuit module
encapsulation package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69804254T
Other languages
German (de)
English (en)
Other versions
DE69804254D1 (de
Inventor
Stephen Pollack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goodyear Tire and Rubber Co
Original Assignee
Goodyear Tire and Rubber Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goodyear Tire and Rubber Co filed Critical Goodyear Tire and Rubber Co
Application granted granted Critical
Publication of DE69804254D1 publication Critical patent/DE69804254D1/de
Publication of DE69804254T2 publication Critical patent/DE69804254T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B60C23/0491—Constructional details of means for attaching the control device
    • B60C23/0493—Constructional details of means for attaching the control device for attachment on the tyre
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G06K19/041—Constructional details
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/07764—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement making the record carrier attachable to a tyre
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/273—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being between laterally adjacent chips, e.g. walls between chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
DE69804254T 1998-04-14 1998-04-14 Verkaselungspackung und verfahren zum verpacken von einem elektronisches schaltungsmodul Expired - Fee Related DE69804254T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1998/007578 WO1999053740A1 (en) 1998-04-14 1998-04-14 Encapsulation package and method of packaging an electronic circuit module

Publications (2)

Publication Number Publication Date
DE69804254D1 DE69804254D1 (de) 2002-04-18
DE69804254T2 true DE69804254T2 (de) 2002-10-02

Family

ID=22266846

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69804254T Expired - Fee Related DE69804254T2 (de) 1998-04-14 1998-04-14 Verkaselungspackung und verfahren zum verpacken von einem elektronisches schaltungsmodul

Country Status (7)

Country Link
EP (1) EP1078559B1 (https=)
JP (1) JP4119608B2 (https=)
AU (1) AU7120198A (https=)
CA (1) CA2324325A1 (https=)
DE (1) DE69804254T2 (https=)
WO (1) WO1999053740A1 (https=)
ZA (1) ZA992492B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10340551A1 (de) * 2003-09-01 2005-04-14 Siemens Ag Sensorkopf
DE102005059082A1 (de) * 2005-12-10 2007-06-14 Danfoss A/S Verfahren zum Vergießen elektrischer Komponenten und Gehäuseanordnung
DE102017200120A1 (de) * 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektronisches Modul mit erhöhter Sicherheit vor Manipulation

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5971046A (en) 1997-09-17 1999-10-26 Bridgestone/Firestone, Inc. Method and apparatus for bonding an active tag to a patch and a tire
US6030478A (en) 1998-02-10 2000-02-29 Bridgestone/Firestone, Inc. Method and apparatus for removably inserting an electric tire tag into a tire
DE69916115T2 (de) 1998-08-03 2009-10-01 The Goodyear Tire & Rubber Co., Akron Montage von transpondern in luftreifen
US6244104B1 (en) 1998-12-04 2001-06-12 Bridgestone/Firestone Research, Inc. Method for preparing an innerliner of a pneumatic tire for the quick bonding of an electronic monitoring device
US6919799B2 (en) 1999-04-29 2005-07-19 Bridgestone/Firestone North American Tire, Llc Monitoring device and tire combination
US6208244B1 (en) 1999-04-29 2001-03-27 Bridgestone/Firestone Research, Inc. Combination monitoring device and patch for a pneumatic tire and method of installing the same with a coupled antenna
US6688353B1 (en) * 2000-03-31 2004-02-10 Bridgestone/Firestone North American Tire, Llc Attachment patch for mounting an electronic monitoring device to the inside of a pneumatic tire
US6580363B1 (en) * 2000-06-30 2003-06-17 Bridgestone/Firestone North American Tire, Llc Method of encapsulating an electronic tire tag
US7161476B2 (en) 2000-07-26 2007-01-09 Bridgestone Firestone North American Tire, Llc Electronic tire management system
EP2272688B1 (en) * 2000-07-26 2012-02-01 Bridgestone Americas Tire Operations, LLC Electronic tire management system
EP1430563A4 (en) * 2001-01-06 2005-02-09 Telisar Corp INTEGRATED ANTENNA SYSTEM
US20040016487A1 (en) 2002-07-24 2004-01-29 Johnson David Allan Coupled transponder and antenna system and method
US6868358B2 (en) 2002-07-24 2005-03-15 The Goodyear Tire & Rubber Company Method for processing information in a tire pressure monitoring system
JP4183032B2 (ja) * 2002-08-30 2008-11-19 横浜ゴム株式会社 フィルム状電子装置を装着した空気入りタイヤ及びそのフィルム状電子装置の装着方法
US7019711B2 (en) 2002-12-16 2006-03-28 The Goodyear Tire & Rubber Company Coupled transponder and antenna system and method
DE10352268A1 (de) * 2003-11-08 2005-06-16 Hirschmann Austria Gmbh Sensorbox im Fahrwerksbereich eines Fahrzeuges
DE10355334B4 (de) * 2003-11-27 2007-01-25 Bizerba Gmbh & Co. Kg Verkapselung
JP5928935B2 (ja) * 2008-08-29 2016-06-01 カンパニー ジェネラレ デ エスタブリシュメンツ ミシュラン １‐ｄタイヤ用装置
FR2954669B1 (fr) 2009-12-18 2012-03-16 Michelin Soc Tech Procede de fabrication d'un dispositif electronique pour pneumatique
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
DE102010063048A1 (de) * 2010-12-14 2012-06-21 Robert Bosch Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe mit Formkörper
KR20140071423A (ko) * 2011-09-11 2014-06-11 페이닉스 아마테크 테오란타 Ｒｆｉｄ 안테나 모듈 및 그 제조 방법
US9209046B2 (en) * 2013-10-02 2015-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and manufacturing method thereof
JP7241230B2 (ja) * 2019-08-05 2023-03-16 ブリヂストン アメリカズ タイヤ オペレーションズ、 エルエルシー タイヤ電子機器アセンブリ
WO2021107827A1 (en) 2019-11-25 2021-06-03 Husqvarna Ab A hand-held electrically powered work tool
CN115136143B (zh) * 2019-12-28 2026-03-06 艾利丹尼森零售信息服务有限公司 适用于轮胎的射频识别系统
CN116613622B (zh) * 2023-07-19 2024-04-05 青岛泰睿思微电子有限公司 双凹槽光传感器封装结构
WO2025133883A1 (en) * 2023-12-20 2025-06-26 Pirelli Tyre S.P.A. Tyre monitoring device comprising an electronic unit, and tyre comprising such device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2614494B1 (fr) * 1987-04-22 1989-07-07 Power Compact Procede d'assemblage de circuits de puissance et de circuits de commande sur plusieurs niveaux sur un meme module et module ainsi obtenu
JPH03212006A (ja) * 1990-01-17 1991-09-17 Sony Corp 高周波回路用パッケージ
EP0573469B1 (fr) * 1991-02-25 1994-07-27 GUSTAFSON, Ake Procede de fixation d'un bobinage a un circuit electronique
US5218861A (en) * 1991-03-27 1993-06-15 The Goodyear Tire & Rubber Company Pneumatic tire having an integrated circuit transponder and pressure transducer
EP0804806A1 (en) * 1994-12-22 1997-11-05 Benedict G. Pace Device for superheating steam
FR2733104B1 (fr) * 1995-04-12 1997-06-06 Droz Francois Repondeur de petites dimensions et procede de fabrication de tels repondeurs

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10340551A1 (de) * 2003-09-01 2005-04-14 Siemens Ag Sensorkopf
DE102005059082A1 (de) * 2005-12-10 2007-06-14 Danfoss A/S Verfahren zum Vergießen elektrischer Komponenten und Gehäuseanordnung
DE102017200120A1 (de) * 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektronisches Modul mit erhöhter Sicherheit vor Manipulation

Also Published As

Publication number Publication date
EP1078559B1 (en) 2002-03-13
ZA992492B (en) 1999-10-05
JP2002511664A (ja) 2002-04-16
EP1078559A1 (en) 2001-02-28
WO1999053740A1 (en) 1999-10-21
DE69804254D1 (de) 2002-04-18
AU7120198A (en) 1999-11-01
CA2324325A1 (en) 1999-10-21
JP4119608B2 (ja) 2008-07-16

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8339 Ceased/non-payment of the annual fee