DE69802676T2 - Vorrichtung zum beschichten von plattenförmigen substraten, insbesondere von leiterplatten - Google Patents

Vorrichtung zum beschichten von plattenförmigen substraten, insbesondere von leiterplatten

Info

Publication number
DE69802676T2
DE69802676T2 DE69802676T DE69802676T DE69802676T2 DE 69802676 T2 DE69802676 T2 DE 69802676T2 DE 69802676 T DE69802676 T DE 69802676T DE 69802676 T DE69802676 T DE 69802676T DE 69802676 T2 DE69802676 T2 DE 69802676T2
Authority
DE
Germany
Prior art keywords
printed circuit
circuit board
turning station
pcb
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69802676T
Other languages
English (en)
Other versions
DE69802676D1 (de
Inventor
Kaspar Kuster
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Schweiz AG
Ciba SC Holding AG
Original Assignee
Ciba Spezialitaetenchemie Holding AG
Ciba SC Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Spezialitaetenchemie Holding AG, Ciba SC Holding AG filed Critical Ciba Spezialitaetenchemie Holding AG
Application granted granted Critical
Publication of DE69802676D1 publication Critical patent/DE69802676D1/de
Publication of DE69802676T2 publication Critical patent/DE69802676T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1563—Reversing the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69802676T 1997-04-24 1998-04-07 Vorrichtung zum beschichten von plattenförmigen substraten, insbesondere von leiterplatten Expired - Fee Related DE69802676T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP97106808 1997-04-24
PCT/EP1998/002019 WO1998048605A1 (en) 1997-04-24 1998-04-07 Apparatus for the coating of flat-form substrates, especially of printed circuit boards

Publications (2)

Publication Number Publication Date
DE69802676D1 DE69802676D1 (de) 2002-01-10
DE69802676T2 true DE69802676T2 (de) 2002-05-08

Family

ID=8226727

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69802676T Expired - Fee Related DE69802676T2 (de) 1997-04-24 1998-04-07 Vorrichtung zum beschichten von plattenförmigen substraten, insbesondere von leiterplatten

Country Status (11)

Country Link
US (1) US6063191A (de)
EP (1) EP0978225B1 (de)
JP (1) JP2001521679A (de)
KR (1) KR20010012088A (de)
CN (1) CN1253708A (de)
AT (1) ATE209849T1 (de)
CA (1) CA2286017A1 (de)
DE (1) DE69802676T2 (de)
HK (1) HK1023907A1 (de)
TW (1) TW504104U (de)
WO (1) WO1998048605A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1310557B1 (it) * 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronicimultistrato
DE10131808A1 (de) * 2001-06-30 2003-06-05 Patrizius Payarolla Aufnahmevorrichtung für Profilrahmen
US7008483B2 (en) * 2002-04-19 2006-03-07 Hewlett-Packard Development Company, L.P. Curing printed circuit board coatings
US20080261504A1 (en) * 2004-05-02 2008-10-23 Finn Maag Busch System for Inverting Pieces of Meat Having an Irregular Geometrical Shape
US20060273138A1 (en) * 2005-06-07 2006-12-07 Samsung Electronics Co., Ltd. Soldering apparatus for printed circuit board, soldering method for printed circuit board and soldering cream printing unit for soldering printed circuit board
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
KR100988235B1 (ko) * 2008-05-07 2010-10-18 주식회사 유비셀 인쇄회로기판 공급장치
KR100988229B1 (ko) * 2008-05-07 2010-10-18 주식회사 유비셀 인쇄회로기판 공급시스템
JP5553803B2 (ja) * 2011-08-01 2014-07-16 株式会社日立製作所 パネルの印刷装置
JP5242824B1 (ja) * 2012-02-29 2013-07-24 株式会社エヌ・ピー・シー 導電性ペースト塗布機構及びセル配線装置
CN104289380B (zh) * 2014-09-30 2016-09-21 东莞新爱荣机械自动化设备有限公司 一种印制电路板表面喷涂或点胶类的设备
CN104941863B (zh) * 2015-06-03 2017-11-17 喜健环球科技有限公司 一种全自动水平灌涂式pcb板双面涂布机

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3610397A (en) * 1969-03-05 1971-10-05 Epec Systems Corp Method and apparatus for turning over a plate
IT1215384B (it) * 1987-03-13 1990-02-08 Pola E Massa S N C Di Pola C E Dispositivo per il trattamento dipiastre per circuiti stampati, in particolare per pulitura a pomice e sbavatura.
DK0431172T3 (da) * 1989-07-04 1996-09-02 Toppan Printing Co Ltd Apparatur til forberedelse af databærekort
DE3937071A1 (de) * 1989-11-07 1991-05-08 Kopperschmidt Mueller & Co Vorrichtung und verfahren zum beschichten von plattenfoermigen substraten, wie leiterplatten
DE4107464A1 (de) * 1991-03-08 1992-09-10 Schmid Gmbh & Co Geb Verfahren und vorrichtung zum einseitigen behandeln von plattenfoermigen gegenstaenden
US5240104A (en) * 1992-01-31 1993-08-31 Douglas John J Printed circuit board belt conveyor
EP0637561A1 (de) * 1993-08-04 1995-02-08 Siemens Nixdorf Informationssysteme AG Verfahren und Anordnung zum Umsetzen von Leiterplatten von einer ersten Transportebene auf eine zweite mit etwa gleichem Niveau
JPH08127157A (ja) * 1994-10-28 1996-05-21 Nisca Corp 両面プリンタ及び両面印刷方法
JPH08185461A (ja) * 1994-12-28 1996-07-16 Nisca Corp カード作成機における発行不良カードの処理方法及び装置
DE19527264A1 (de) * 1995-07-26 1997-01-30 Heidelberger Druckmasch Ag Druckmaschine mit geradliniger Substratführung und Wendeeinrichtungen dafür
US5927713A (en) * 1997-09-18 1999-07-27 Bell & Howell Mail Processing Systems Apparatus and method for inverting, staging and diverting sheet articles

Also Published As

Publication number Publication date
CA2286017A1 (en) 1998-10-29
HK1023907A1 (en) 2000-09-22
WO1998048605A1 (en) 1998-10-29
TW504104U (en) 2002-09-21
CN1253708A (zh) 2000-05-17
EP0978225A1 (de) 2000-02-09
JP2001521679A (ja) 2001-11-06
KR20010012088A (ko) 2001-02-15
DE69802676D1 (de) 2002-01-10
ATE209849T1 (de) 2001-12-15
US6063191A (en) 2000-05-16
EP0978225B1 (de) 2001-11-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee