DE69800897T2 - Chemisch verstärkte Positiv-Resistzusammensetzung - Google Patents
Chemisch verstärkte Positiv-ResistzusammensetzungInfo
- Publication number
- DE69800897T2 DE69800897T2 DE69800897T DE69800897T DE69800897T2 DE 69800897 T2 DE69800897 T2 DE 69800897T2 DE 69800897 T DE69800897 T DE 69800897T DE 69800897 T DE69800897 T DE 69800897T DE 69800897 T2 DE69800897 T2 DE 69800897T2
- Authority
- DE
- Germany
- Prior art keywords
- resist composition
- positive resist
- chemically enhanced
- enhanced positive
- chemically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
- C07C309/01—Sulfonic acids
- C07C309/28—Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
- C07C309/57—Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing carboxyl groups bound to the carbon skeleton
- C07C309/58—Carboxylic acid groups or esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1535397 | 1997-01-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69800897D1 DE69800897D1 (de) | 2001-07-19 |
DE69800897T2 true DE69800897T2 (de) | 2001-10-18 |
Family
ID=11886442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69800897T Expired - Lifetime DE69800897T2 (de) | 1997-01-29 | 1998-01-27 | Chemisch verstärkte Positiv-Resistzusammensetzung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0856773B1 (de) |
KR (1) | KR100562180B1 (de) |
DE (1) | DE69800897T2 (de) |
TW (1) | TW482946B (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6576392B1 (en) * | 1996-12-07 | 2003-06-10 | Fuji Photo Film Co., Ltd. | Positive photoresist composition |
US6214517B1 (en) | 1997-02-17 | 2001-04-10 | Fuji Photo Film Co., Ltd. | Positive photoresist composition |
EP0877293B1 (de) * | 1997-05-09 | 2004-01-14 | Fuji Photo Film Co., Ltd. | Positiv arbeitende lichtempfindliche Zusammensetzung |
JPH11231541A (ja) * | 1998-02-17 | 1999-08-27 | Daicel Chem Ind Ltd | 放射線感光材料及びそれを使用したパターン形成方法 |
US6706826B1 (en) | 1998-03-27 | 2004-03-16 | Mitsubishi Rayon Co., Ltd. | Copolymer, process for producing the same, and resist composition |
KR100574574B1 (ko) | 1998-08-26 | 2006-04-28 | 스미또모 가가꾸 가부시키가이샤 | 화학 증폭형 포지티브 내식막 조성물 |
US6852466B2 (en) | 1998-12-23 | 2005-02-08 | Shipley Company, L.L.C. | Photoresist compositions particularly suitable for short wavelength imaging |
TWI263866B (en) * | 1999-01-18 | 2006-10-11 | Sumitomo Chemical Co | Chemical amplification type positive resist composition |
US6344582B1 (en) | 1999-02-22 | 2002-02-05 | Sumitomo Chemical Company, Limited | Process for producing a 2-adamantyl (meth>acrylate |
KR100704423B1 (ko) | 1999-03-31 | 2007-04-06 | 스미또모 가가꾸 가부시키가이샤 | 화학 증폭형 포지티브 레지스트 |
EP1209525A4 (de) * | 1999-07-12 | 2003-03-19 | Mitsubishi Rayon Co | Chemisch verstärkte resistzusammensetzung |
JP2001215704A (ja) * | 2000-01-31 | 2001-08-10 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
JP4576737B2 (ja) * | 2000-06-09 | 2010-11-10 | Jsr株式会社 | 感放射線性樹脂組成物 |
TWI370327B (en) * | 2004-01-21 | 2012-08-11 | Sumitomo Chemical Co | A chemical amplification type positive resist composition |
US7232642B2 (en) | 2004-05-11 | 2007-06-19 | Sumitomo Chemical Company, Limited | Chemically amplified positive resist composition, a haloester derivative and a process for producing the same |
JP4510695B2 (ja) | 2005-05-10 | 2010-07-28 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
JP6191601B2 (ja) | 2012-06-04 | 2017-09-06 | Jnc株式会社 | β−(メタ)アクリロイルオキシ−γ−ブチロラクトン類の製造方法 |
CN114276317A (zh) * | 2021-12-27 | 2022-04-05 | 徐州博康信息化学品有限公司 | 一种含内酯结构的光刻胶树脂单体的制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02149848A (ja) * | 1988-11-30 | 1990-06-08 | Oki Electric Ind Co Ltd | 感光性材料及びこれを用いた感光性組成物 |
JPH04251849A (ja) * | 1991-01-29 | 1992-09-08 | Fuji Photo Film Co Ltd | 感電離放射線性樹脂組成物 |
KR100326009B1 (ko) * | 1993-07-20 | 2002-05-10 | 야마사키 노리쓰카 | 오르토스피로에스테르화합물,이를함유하는저경화수축성수지조성물및경화물 |
US5571657A (en) * | 1993-09-30 | 1996-11-05 | Shipley Company, Inc. | Modified cation exhange process |
JP3009320B2 (ja) * | 1993-12-24 | 2000-02-14 | 三菱電機株式会社 | 分解性樹脂および感光性樹脂組成物 |
-
1998
- 1998-01-26 KR KR1019980002302A patent/KR100562180B1/ko not_active IP Right Cessation
- 1998-01-26 TW TW087101061A patent/TW482946B/zh not_active IP Right Cessation
- 1998-01-27 EP EP98101371A patent/EP0856773B1/de not_active Expired - Lifetime
- 1998-01-27 DE DE69800897T patent/DE69800897T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR19980070853A (ko) | 1998-10-26 |
TW482946B (en) | 2002-04-11 |
EP0856773A1 (de) | 1998-08-05 |
KR100562180B1 (ko) | 2006-07-03 |
EP0856773B1 (de) | 2001-06-13 |
DE69800897D1 (de) | 2001-07-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SUMITOMO CHEMICAL CO. LTD., TOKIO/TOKYO, JP |