DE69738388D1 - Flexibles hochleistungslaminat - Google Patents

Flexibles hochleistungslaminat

Info

Publication number
DE69738388D1
DE69738388D1 DE69738388T DE69738388T DE69738388D1 DE 69738388 D1 DE69738388 D1 DE 69738388D1 DE 69738388 T DE69738388 T DE 69738388T DE 69738388 T DE69738388 T DE 69738388T DE 69738388 D1 DE69738388 D1 DE 69738388D1
Authority
DE
Germany
Prior art keywords
flexible high
performance laminate
laminate
performance
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69738388T
Other languages
English (en)
Other versions
DE69738388T2 (de
Inventor
Harish D Merchant
Sidney Clouser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Nikko Materials USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26698506&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69738388(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/911,357 external-priority patent/US5863666A/en
Application filed by Nikko Materials USA Inc filed Critical Nikko Materials USA Inc
Publication of DE69738388D1 publication Critical patent/DE69738388D1/de
Application granted granted Critical
Publication of DE69738388T2 publication Critical patent/DE69738388T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
DE69738388T 1996-08-23 1997-08-12 Flexibles hochleistungslaminat Expired - Lifetime DE69738388T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US2448596P 1996-08-23 1996-08-23
US24485P 1996-08-23
US911357 1997-08-07
US08/911,357 US5863666A (en) 1997-08-07 1997-08-07 High performance flexible laminate
PCT/US1997/013966 WO1998008361A1 (en) 1996-08-23 1997-08-12 High performance flexible laminate

Publications (2)

Publication Number Publication Date
DE69738388D1 true DE69738388D1 (de) 2008-01-31
DE69738388T2 DE69738388T2 (de) 2008-12-04

Family

ID=26698506

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69738388T Expired - Lifetime DE69738388T2 (de) 1996-08-23 1997-08-12 Flexibles hochleistungslaminat

Country Status (5)

Country Link
EP (1) EP0857402B1 (de)
JP (1) JP3053440B2 (de)
KR (1) KR100327955B1 (de)
DE (1) DE69738388T2 (de)
WO (1) WO1998008361A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4394234B2 (ja) * 2000-01-20 2010-01-06 日鉱金属株式会社 銅電気めっき液及び銅電気めっき方法
JP4583149B2 (ja) * 2004-12-01 2010-11-17 三井金属鉱業株式会社 電解銅箔及びその製造方法
CN1946879B (zh) 2005-01-25 2010-05-05 日矿金属株式会社 作为添加剂含有具有特定骨架化合物的铜电解液以及由该铜电解液制造的电解铜箔
TWI396779B (zh) * 2005-02-21 2013-05-21 Copper foil and its manufacturing method, and flexible printed circuit board
JP4681936B2 (ja) * 2005-05-20 2011-05-11 福田金属箔粉工業株式会社 プラズマディスプレイ電磁波シールドフィルター用銅箔
KR101154203B1 (ko) 2006-04-28 2012-06-18 미쓰이 긴조꾸 고교 가부시키가이샤 전해 동박, 그 전해 동박을 이용한 표면 처리 동박 및 그 표면 처리 동박을 이용한 동박 적층판 및 그 전해 동박의 제조 방법
JP5255229B2 (ja) * 2006-04-28 2013-08-07 三井金属鉱業株式会社 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法
JP2007317782A (ja) * 2006-05-24 2007-12-06 Sumitomo Metal Mining Co Ltd フレキシブル配線基板
JP4668232B2 (ja) * 2007-04-16 2011-04-13 株式会社フジクラ フレキシブルプリント基板
JP2008285727A (ja) * 2007-05-18 2008-11-27 Furukawa Circuit Foil Kk 高抗張力電解銅箔及びその製造方法
KR101802948B1 (ko) * 2016-04-28 2017-11-29 일진머티리얼즈 주식회사 그래핀용 전해동박 및 그의 제조방법
KR101802949B1 (ko) * 2016-04-28 2017-11-29 일진머티리얼즈 주식회사 그래핀용 전해동박 및 그의 제조방법
CN110753588A (zh) * 2017-05-23 2020-02-04 阿尔法装配解决方案公司 用于膜接触开关和其他柔性电子结构的石墨烯增强和工程化材料
KR102433032B1 (ko) * 2017-07-31 2022-08-16 에스케이넥실리스 주식회사 주름 발생이 방지된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1162823A (en) * 1966-08-27 1969-08-27 Schjeldahl Co G T Improvements in Copper-Plastic Laminates
US4997722A (en) * 1989-07-10 1991-03-05 Edward Adler Composition and method for improving adherence of copper foil to resinous substrates
US5171417A (en) * 1989-09-13 1992-12-15 Gould Inc. Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
WO1991019024A1 (en) * 1990-05-30 1991-12-12 Gould, Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
JPH0826470B2 (ja) * 1990-07-30 1996-03-13 日本電解株式会社 銅メッキ液とこれを用いる電解銅箔の製造方法
US5219640A (en) * 1991-02-08 1993-06-15 Rogers Corporation Flexible circuit having flexing section of reduced stiffness, and method of manufacture thereof
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板

Also Published As

Publication number Publication date
EP0857402A1 (de) 1998-08-12
EP0857402B1 (de) 2007-12-19
WO1998008361A1 (en) 1998-02-26
EP0857402A4 (de) 2003-05-02
KR100327955B1 (ko) 2002-05-09
KR20000064294A (ko) 2000-11-06
JPH11501268A (ja) 1999-02-02
DE69738388T2 (de) 2008-12-04
JP3053440B2 (ja) 2000-06-19

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Legal Events

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