DE69728492D1 - Anrichtung und Verfahren zur Beschichtung von empfindlichen Schaltungen durch thermisches Spritzen - Google Patents

Anrichtung und Verfahren zur Beschichtung von empfindlichen Schaltungen durch thermisches Spritzen

Info

Publication number
DE69728492D1
DE69728492D1 DE69728492T DE69728492T DE69728492D1 DE 69728492 D1 DE69728492 D1 DE 69728492D1 DE 69728492 T DE69728492 T DE 69728492T DE 69728492 T DE69728492 T DE 69728492T DE 69728492 D1 DE69728492 D1 DE 69728492D1
Authority
DE
Germany
Prior art keywords
thermal spraying
sensitive circuits
coating sensitive
coating
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69728492T
Other languages
English (en)
Other versions
DE69728492T2 (de
Inventor
Kenneth H Heffner
Curtis W Anderson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Application granted granted Critical
Publication of DE69728492D1 publication Critical patent/DE69728492D1/de
Publication of DE69728492T2 publication Critical patent/DE69728492T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
    • B05B12/124—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus responsive to distance between spray apparatus and target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B05B13/0242—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the objects being individually presented to the spray heads by a rotating element, e.g. turntable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/16—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed
    • B05B7/20—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed by flame or combustion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Nozzles (AREA)
  • Coating By Spraying Or Casting (AREA)
DE69728492T 1996-11-15 1997-11-11 Anrichtung und Verfahren zur Beschichtung von empfindlichen Schaltungen durch thermisches Spritzen Expired - Fee Related DE69728492T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US751146 1996-11-15
US08/751,146 US5762711A (en) 1996-11-15 1996-11-15 Coating delicate circuits

Publications (2)

Publication Number Publication Date
DE69728492D1 true DE69728492D1 (de) 2004-05-13
DE69728492T2 DE69728492T2 (de) 2005-02-24

Family

ID=25020688

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69728492T Expired - Fee Related DE69728492T2 (de) 1996-11-15 1997-11-11 Anrichtung und Verfahren zur Beschichtung von empfindlichen Schaltungen durch thermisches Spritzen

Country Status (3)

Country Link
US (2) US5762711A (de)
EP (1) EP0842707B1 (de)
DE (1) DE69728492T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6573124B1 (en) * 1999-05-03 2003-06-03 Hughes Electronics Corp. Preparation of passivated chip-on-board electronic devices
US6335224B1 (en) * 2000-05-16 2002-01-01 Sandia Corporation Protection of microelectronic devices during packaging
US7005404B2 (en) * 2000-12-20 2006-02-28 Honda Motor Co., Ltd. Substrates with small particle size metal oxide and noble metal catalyst coatings and thermal spraying methods for producing the same
EP1386527A1 (de) * 2001-05-10 2004-02-04 Parker Hannifin Corporation Herstellung eines gehäuses für elektronik mit einer metallisierten schutzschicht
US7723162B2 (en) * 2002-03-22 2010-05-25 White Electronic Designs Corporation Method for producing shock and tamper resistant microelectronic devices
WO2004013900A2 (en) * 2002-08-05 2004-02-12 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
US7208046B1 (en) * 2003-01-10 2007-04-24 White Electronic Designs Corporation Spray coating apparatus and fixtures
US8210120B2 (en) * 2003-01-10 2012-07-03 Microsemi Corporation Systems and methods for building tamper resistant coatings
US7758911B2 (en) 2003-05-08 2010-07-20 Honeywell International Inc. Microelectronic security coatings
DE102004018483B4 (de) * 2004-04-14 2007-11-29 Infineon Technologies Ag Verfahren zum Aufbringen von Beschichtungen auf bandförmigen Strukturen in der Halbleiterbauteilefertigung und Verwendung einer Vorrichtung zum Aufbringen von Beschichtungen auf bandförmigen Strukturen
US20060067055A1 (en) * 2004-09-30 2006-03-30 Heffner Kenneth H Thermally conductive composite and uses for microelectronic packaging
US20080007890A1 (en) * 2004-09-30 2008-01-10 Harmon Julianne P Thermally conductive composite and uses for microelectronic packaging
US7429915B2 (en) * 2005-04-20 2008-09-30 Honeywell International Inc. System and method for detecting unauthorized access to electronic equipment or components
US7189335B1 (en) * 2005-08-31 2007-03-13 Honeywell International Inc. Conformal coverings for electronic devices
US20070055147A1 (en) 2005-09-06 2007-03-08 Honeywell International Inc. Medical devices incorporating radio-opaque and biocompatible coatings
US7495554B2 (en) * 2006-01-11 2009-02-24 Honeywell International Inc. Clamshell protective encasement
US8710618B2 (en) * 2007-03-12 2014-04-29 Honeywell International Inc. Fibrous laminate interface for security coatings
FI20085053A0 (fi) * 2008-01-22 2008-01-22 Valtion Teknillinen Menetelmä termisen ruiskutuksen suorittamiseksi ja menetelmän mukaiset sovellukset
US20090317554A1 (en) * 2008-06-24 2009-12-24 Specialty Coating Systems, Inc. Apparatus and method for spray coating
DE102010010819A1 (de) 2010-03-10 2011-09-15 Osram Opto Semiconductors Gmbh Verfahren und Vorrichtung zur Herstellung einer Parylen-Beschichtung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3170813A (en) * 1961-05-19 1965-02-23 Westinghouse Electric Corp Method for encapsulating semiconductors
US3532072A (en) * 1966-10-17 1970-10-06 Inland Steel Co Spray coating apparatus
US4031268A (en) * 1976-01-05 1977-06-21 Sirius Corporation Process for spraying metallic patterns on a substrate
US4115600A (en) * 1977-04-01 1978-09-19 Sprague Electric Company Method for forming a metal termination on a wound capacitor section
DE3318931C2 (de) * 1983-05-25 1986-10-30 Euroflamm Hansjörg Werner KG, 2820 Bremen Verfahren zum Spritzbeschichten von Gegenständen und Vorrichtung zur Durchführung des Verfahrens
DE3422718A1 (de) * 1984-06-19 1986-01-09 Plasmainvent AG, Zug Vakuum-plasma-beschichtungsanlage
JPS619565A (ja) * 1984-06-22 1986-01-17 Tanaka Kikinzoku Kogyo Kk 金属複合材の製造方法
DE3705592A1 (de) * 1987-02-21 1988-09-01 Convac Gmbh Geraete Zur Halble Vorrichtung zur duennen beschichtung (belackung) scheibenfoermiger substrate fuer elektronische anwendungszwecke, bspw. leiterplatten, compact disks etc.
US4973526A (en) * 1990-02-15 1990-11-27 Dow Corning Corporation Method of forming ceramic coatings and resulting articles
JPH03264666A (ja) * 1990-03-15 1991-11-25 Seiko Instr Inc 半導体製造装置
US5302553A (en) * 1991-10-04 1994-04-12 Texas Instruments Incorporated Method of forming a coated plastic package
US5246731A (en) * 1992-03-16 1993-09-21 Velie Circuits, Inc. Method of and apparatus for depositing solder on the terminal pads of printed circuit boards
DE4210900A1 (de) * 1992-04-02 1993-10-14 Hoechst Ag Verfahren zur Herstellung eines haftfesten Verbundes zwischen Kupferschichten und Keramik
WO1994007611A1 (en) * 1992-10-01 1994-04-14 Motorola, Inc. Method for forming circuitry by a spraying process with stencil
US5364656A (en) * 1993-09-15 1994-11-15 Koorey Daniel P Method for refinishing vehicle wheels
US5456951A (en) * 1993-12-09 1995-10-10 Sermatech International, Inc. Thermal spray coating chamber and method of using same
US5468299A (en) * 1995-01-09 1995-11-21 Tsai; Charles S. Device comprising a flat susceptor rotating parallel to a reference surface about a shaft perpendicular to this surface
EP0771023A3 (de) * 1995-10-27 1999-03-24 Honeywell Inc. Verfahren zum Aufbringen einer Schutzschicht auf einer integrierten Halbleiteranordnung

Also Published As

Publication number Publication date
EP0842707B1 (de) 2004-04-07
DE69728492T2 (de) 2005-02-24
US6110537A (en) 2000-08-29
US5762711A (en) 1998-06-09
EP0842707A1 (de) 1998-05-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee