DE69714251T2 - Tröpfchenablageapparat - Google Patents

Tröpfchenablageapparat

Info

Publication number
DE69714251T2
DE69714251T2 DE69714251T DE69714251T DE69714251T2 DE 69714251 T2 DE69714251 T2 DE 69714251T2 DE 69714251 T DE69714251 T DE 69714251T DE 69714251 T DE69714251 T DE 69714251T DE 69714251 T2 DE69714251 T2 DE 69714251T2
Authority
DE
Germany
Prior art keywords
channel
region
channels
side walls
piezoelectric material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69714251T
Other languages
German (de)
English (en)
Other versions
DE69714251D1 (de
Inventor
James Ashe
David Phillips
Stephen Temple
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xaar Technology Ltd
Original Assignee
Xaar Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9608373.8A external-priority patent/GB9608373D0/en
Priority claimed from GBGB9624408.2A external-priority patent/GB9624408D0/en
Application filed by Xaar Technology Ltd filed Critical Xaar Technology Ltd
Publication of DE69714251D1 publication Critical patent/DE69714251D1/de
Application granted granted Critical
Publication of DE69714251T2 publication Critical patent/DE69714251T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14387—Front shooter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
DE69714251T 1996-04-23 1997-04-18 Tröpfchenablageapparat Expired - Lifetime DE69714251T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB9608373.8A GB9608373D0 (en) 1996-04-23 1996-04-23 Droplet deposition apparatus
GBGB9624408.2A GB9624408D0 (en) 1996-11-23 1996-11-23 Droplet deposition apparatus
PCT/GB1997/001083 WO1997039897A1 (en) 1996-04-23 1997-04-18 Droplet deposition apparatus

Publications (2)

Publication Number Publication Date
DE69714251D1 DE69714251D1 (de) 2002-08-29
DE69714251T2 true DE69714251T2 (de) 2003-03-27

Family

ID=26309190

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69714251T Expired - Lifetime DE69714251T2 (de) 1996-04-23 1997-04-18 Tröpfchenablageapparat

Country Status (9)

Country Link
US (2) US6286943B1 (en:Method)
EP (1) EP0901415B1 (en:Method)
JP (1) JP3177897B2 (en:Method)
CN (1) CN1191936C (en:Method)
CA (1) CA2248807C (en:Method)
DE (1) DE69714251T2 (en:Method)
IN (1) IN191904B (en:Method)
RU (1) RU2165853C2 (en:Method)
WO (1) WO1997039897A1 (en:Method)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9622177D0 (en) 1996-10-24 1996-12-18 Xaar Ltd Passivation of ink jet print heads
US7110227B2 (en) 1997-04-08 2006-09-19 X2Y Attenuators, Llc Universial energy conditioning interposer with circuit architecture
US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US7106570B2 (en) 1997-04-08 2006-09-12 Xzy Altenuators, Llc Pathway arrangement
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336467B2 (en) 2000-10-17 2008-02-26 X2Y Attenuators, Llc Energy pathway arrangement
US6018448A (en) 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US7274549B2 (en) * 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US7321485B2 (en) * 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US7042703B2 (en) 2000-03-22 2006-05-09 X2Y Attenuators, Llc Energy conditioning structure
US6894884B2 (en) 1997-04-08 2005-05-17 Xzy Attenuators, Llc Offset pathway arrangements for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US20020079116A1 (en) * 2000-10-17 2002-06-27 X2Y Attenuators, Llc Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
US6606011B2 (en) 1998-04-07 2003-08-12 X2Y Attenuators, Llc Energy conditioning circuit assembly
US7427816B2 (en) 1998-04-07 2008-09-23 X2Y Attenuators, Llc Component carrier
EP1070389B1 (en) 1998-04-07 2007-12-05 X2Y Attenuators, L.L.C. Component carrier
US7113383B2 (en) 2000-04-28 2006-09-26 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
IL154413A0 (en) 2000-08-15 2003-09-17 X2Y Attenuators Llc An electrode arrangement for circuit energy conditioning
IL155047A0 (en) 2000-09-26 2003-10-31 Xaar Technology Ltd Droplet deposition apparatus
US7193831B2 (en) * 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
US7895530B2 (en) 2000-11-09 2011-02-22 Change Tools, Inc. User definable interface system, method, support tools, and computer program product
EP1342609B1 (en) * 2000-12-12 2008-06-18 Japan Science and Technology Agency Steering mechanism of electric car
US6864620B2 (en) * 2000-12-22 2005-03-08 Ngk Insulators, Ltd. Matrix type actuator
JP2003246058A (ja) 2002-02-27 2003-09-02 Sharp Corp インクジェットヘッド
US6844960B2 (en) * 2002-09-24 2005-01-18 Eastman Kodak Company Microelectromechanical device with continuously variable displacement
JP4473532B2 (ja) * 2002-10-10 2010-06-02 日本碍子株式会社 圧電／電歪デバイス及び製造方法
US6957884B2 (en) * 2002-12-27 2005-10-25 Kinberly-Clark Worldwide, Inc. High-speed inkjet printing for vibrant and crockfast graphics on web materials or end-products
US7180718B2 (en) * 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
EP1629582A2 (en) 2003-05-29 2006-03-01 X2Y Attenuators, L.L.C. Connector related structures including an energy conditioner
EP1649572A4 (en) 2003-07-21 2012-06-27 X2Y Attenuators Llc FILTER ASSEMBLY
US8251471B2 (en) * 2003-08-18 2012-08-28 Fujifilm Dimatix, Inc. Individual jet voltage trimming circuitry
JP4878111B2 (ja) * 2003-10-30 2012-02-15 日本碍子株式会社 セル駆動型圧電／電歪アクチュエータ及びその製造方法
CN1890854A (zh) 2003-12-22 2007-01-03 X2Y艾泰钮埃特有限责任公司 内屏蔽式能量调节装置
KR101193918B1 (ko) * 2004-06-03 2012-10-29 몰레큘러 임프린츠 인코퍼레이티드 나노-스케일 제조공정을 위한 유체 배분방법과 필요에 따른액적 배분방법
US20070228593A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Residual Layer Thickness Measurement and Correction
JP4274555B2 (ja) * 2004-07-16 2009-06-10 キヤノン株式会社 液体吐出素子基板の製造方法および液体吐出素子の製造方法
US8085428B2 (en) 2004-10-15 2011-12-27 Fujifilm Dimatix, Inc. Print systems and techniques
US8068245B2 (en) * 2004-10-15 2011-11-29 Fujifilm Dimatix, Inc. Printing device communication protocol
US7722147B2 (en) * 2004-10-15 2010-05-25 Fujifilm Dimatix, Inc. Printing system architecture
US7911625B2 (en) * 2004-10-15 2011-03-22 Fujifilm Dimatrix, Inc. Printing system software architecture
US7907298B2 (en) * 2004-10-15 2011-03-15 Fujifilm Dimatix, Inc. Data pump for printing
US8199342B2 (en) * 2004-10-29 2012-06-12 Fujifilm Dimatix, Inc. Tailoring image data packets to properties of print heads
US7234788B2 (en) * 2004-11-03 2007-06-26 Dimatix, Inc. Individual voltage trimming with waveforms
US7556327B2 (en) * 2004-11-05 2009-07-07 Fujifilm Dimatix, Inc. Charge leakage prevention for inkjet printing
US7281919B2 (en) * 2004-12-07 2007-10-16 Molecular Imprints, Inc. System for controlling a volume of material on a mold
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
JP2008535207A (ja) 2005-03-01 2008-08-28 エックストゥーワイ アテニュエイターズ，エルエルシー 共平面導体を有する調整器
WO2006099297A2 (en) 2005-03-14 2006-09-21 X2Y Attenuators, Llc Conditioner with coplanar conductors
WO2007103965A1 (en) 2006-03-07 2007-09-13 X2Y Attenuators, Llc Energy conditioner structures
JP5123532B2 (ja) * 2007-01-30 2013-01-23 太陽誘電株式会社 マイクロカンチレバー
EP2160296B1 (en) 2007-06-15 2012-08-15 Silverbrook Research Pty. Ltd Method of forming connection between electrode and actuator in an inkjet nozzle assembly
JP5112889B2 (ja) * 2008-01-11 2013-01-09 エスアイアイ・プリンテック株式会社 インクジェットヘッドチップ、インクジェットヘッドチップの製造方法、インクジェットヘッド、及びインクジェット記録装置
JP2010158864A (ja) * 2009-01-09 2010-07-22 Sii Printek Inc 液体噴射ヘッドチップ及びその製造方法、並びに液体噴射ヘッド及び液体噴射記録装置
JP5633200B2 (ja) * 2010-06-08 2014-12-03 株式会社リコー 圧電アクチュエータ、液体吐出ヘッド及び画像形成装置
JP6121708B2 (ja) * 2012-12-19 2017-04-26 エスアイアイ・プリンテック株式会社 液体噴射ヘッド、液体噴射ヘッドの製造方法および液体噴射装置
JP6314062B2 (ja) * 2014-08-28 2018-04-18 セイコーインスツル株式会社 液体噴射ヘッドの製造方法及び液体噴射装置
JP6371639B2 (ja) * 2014-08-28 2018-08-08 セイコーインスツル株式会社 液体噴射ヘッド及び液体噴射装置
JP6393180B2 (ja) * 2014-12-16 2018-09-19 エスアイアイ・プリンテック株式会社 液体噴射ヘッド、液体噴射装置及び液体噴射ヘッドの製造方法
JP6983504B2 (ja) * 2016-01-08 2021-12-17 キヤノン株式会社 液体吐出ヘッド及び液体吐出装置
US10029473B2 (en) * 2016-01-08 2018-07-24 Canon Kabushiki Kaisha Liquid discharge head and recording apparatus
JP2023035586A (ja) * 2021-09-01 2023-03-13 エスアイアイ・プリンテック株式会社 ヘッドチップ、液体噴射ヘッド、液体噴射記録装置及びヘッドチップの製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL281145A (en:Method) * 1961-05-08
JPS63137158A (ja) * 1986-11-27 1988-06-09 Nissin Electric Co Ltd アルミ薄膜の作製方法
JPS6473069A (en) * 1987-09-10 1989-03-17 Nissin Electric Co Ltd Production of aluminum nitride film
EP0341929B1 (en) * 1988-05-13 1995-02-15 Xaar Limited Multiplexer circuit
GB8824014D0 (en) * 1988-10-13 1988-11-23 Am Int High density multi-channel array electrically pulsed droplet deposition apparatus
SU1635896A3 (ru) * 1989-03-23 1991-03-15 К.П.Зыбин, С.Н.Максимовский и Г.А.Радуцкий Струйна печатающа головка и способ ее изготовлени
US5053245A (en) * 1989-10-26 1991-10-01 Sanyo Electric Co., Ltd. Method of improving the quality of an edge surface of a cutting device
JP2744535B2 (ja) * 1991-07-08 1998-04-28 株式会社テック インクジェットプリンタヘッドの製造方法
US5406319A (en) 1991-08-16 1995-04-11 Compaq Computer Corporation Enhanced U type ink jet printheads
JP3097298B2 (ja) * 1992-04-17 2000-10-10 ブラザー工業株式会社 液滴噴射装置およびその製造方法
US5719606A (en) * 1992-07-03 1998-02-17 Citizen Watch Co., Ltd. Ink jet head including a connector having a joining component with a plurality of electroconductive particles contained therein and a method of producing said ink jet head
JP3052692B2 (ja) * 1993-09-30 2000-06-19 ブラザー工業株式会社 印字ヘッド及びその製造方法
JP3120638B2 (ja) * 1993-10-01 2000-12-25 ブラザー工業株式会社 インク噴射装置
JPH07132591A (ja) 1993-11-10 1995-05-23 Brother Ind Ltd 印字ヘッド
JP3043936B2 (ja) 1994-02-08 2000-05-22 シャープ株式会社 インクジェットヘッド
JPH07304169A (ja) * 1994-05-12 1995-11-21 Brother Ind Ltd 液滴噴射装置
JP3166530B2 (ja) * 1995-01-30 2001-05-14 ブラザー工業株式会社 インク噴射装置
JPH09207331A (ja) 1996-02-07 1997-08-12 Matsushita Electric Ind Co Ltd インクジェット記録ヘッド

Also Published As

Publication number Publication date
US20020005880A1 (en) 2002-01-17
US6618943B2 (en) 2003-09-16
CA2248807C (en) 2006-01-03
JPH11506402A (ja) 1999-06-08
DE69714251D1 (de) 2002-08-29
US6286943B1 (en) 2001-09-11
JP3177897B2 (ja) 2001-06-18
EP0901415A1 (en) 1999-03-17
EP0901415B1 (en) 2002-07-24
CN1216502A (zh) 1999-05-12
CA2248807A1 (en) 1997-10-30
WO1997039897A1 (en) 1997-10-30
RU2165853C2 (ru) 2001-04-27
CN1191936C (zh) 2005-03-09
IN191904B (en:Method) 2004-01-17

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