DE69707097D1 - Entwicklungsflüssigkeitsversorgungsvorrichtung - Google Patents

Entwicklungsflüssigkeitsversorgungsvorrichtung

Info

Publication number
DE69707097D1
DE69707097D1 DE69707097T DE69707097T DE69707097D1 DE 69707097 D1 DE69707097 D1 DE 69707097D1 DE 69707097 T DE69707097 T DE 69707097T DE 69707097 T DE69707097 T DE 69707097T DE 69707097 D1 DE69707097 D1 DE 69707097D1
Authority
DE
Germany
Prior art keywords
supply device
fluid supply
development fluid
development
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69707097T
Other languages
English (en)
Other versions
DE69707097T2 (de
Inventor
Yoshio Kimura
Satoshi Morita
Yuji Matsuyama
Norio Semba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP35572396A external-priority patent/JP3647585B2/ja
Priority claimed from JP35611996A external-priority patent/JP3545559B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE69707097D1 publication Critical patent/DE69707097D1/de
Publication of DE69707097T2 publication Critical patent/DE69707097T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/2931Diverse fluid containing pressure systems
    • Y10T137/3115Gas pressure storage over or displacement of liquid
    • Y10T137/3124Plural units

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)
DE1997607097 1996-12-24 1997-12-18 Entwicklungsflüssigkeitsversorgungsvorrichtung Expired - Lifetime DE69707097T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35572396A JP3647585B2 (ja) 1996-12-24 1996-12-24 処理液供給機構及び処理液供給方法
JP35611996A JP3545559B2 (ja) 1996-12-25 1996-12-25 処理液供給装置

Publications (2)

Publication Number Publication Date
DE69707097D1 true DE69707097D1 (de) 2001-11-08
DE69707097T2 DE69707097T2 (de) 2002-03-07

Family

ID=26580317

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997607097 Expired - Lifetime DE69707097T2 (de) 1996-12-24 1997-12-18 Entwicklungsflüssigkeitsversorgungsvorrichtung

Country Status (6)

Country Link
US (1) US6015066A (de)
EP (1) EP0851301B1 (de)
KR (1) KR100539187B1 (de)
DE (1) DE69707097T2 (de)
SG (1) SG67461A1 (de)
TW (1) TW382749B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858091B2 (en) * 2001-07-13 2005-02-22 Lam Research Corporation Method for controlling galvanic corrosion effects on a single-wafer cleaning system
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) * 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US20060130767A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
US20060241813A1 (en) * 2005-04-22 2006-10-26 Applied Materials, Inc. Optimized cluster tool transfer process and collision avoidance design
DE102005044796A1 (de) * 2005-09-19 2007-03-29 Hilger U. Kern Gmbh Verfahren zur Steuerung einer Dosiereinrichtung für flüssige oder pasteuse Medien
US8434509B2 (en) * 2009-11-13 2013-05-07 Eurotecnica Melamine Luxemburg Tank for containing liquids
JP4888580B2 (ja) * 2010-04-22 2012-02-29 住友金属鉱山株式会社 貯液装置及びその圧力制御方法
JP5999073B2 (ja) * 2013-11-20 2016-09-28 東京エレクトロン株式会社 処理液供給装置、処理液供給方法及び記憶媒体
US9605346B2 (en) * 2014-03-28 2017-03-28 Lam Research Corporation Systems and methods for pressure-based liquid flow control
US11970772B2 (en) 2014-08-22 2024-04-30 Lam Research Corporation Dynamic precursor dosing for atomic layer deposition
US10094018B2 (en) 2014-10-16 2018-10-09 Lam Research Corporation Dynamic precursor dosing for atomic layer deposition
US11072860B2 (en) 2014-08-22 2021-07-27 Lam Research Corporation Fill on demand ampoule refill

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02138427U (de) * 1989-04-24 1990-11-19
US5416047A (en) * 1990-09-07 1995-05-16 Tokyo Electron Limited Method for applying process solution to substrates
JP3150690B2 (ja) * 1990-11-28 2001-03-26 東京エレクトロン株式会社 薬液処理装置
JPH05289344A (ja) * 1992-04-13 1993-11-05 Mitsubishi Paper Mills Ltd 平版印刷版の製版方法
JP2952630B2 (ja) * 1993-04-23 1999-09-27 東京エレクトロン株式会社 処理装置
US5383574A (en) * 1993-07-19 1995-01-24 Microbar Sytems, Inc. System and method for dispensing liquid from storage containers
KR970002429B1 (en) * 1994-01-31 1997-03-05 Lg Semicon Co Ltd Supplying apparatus of development liquor
KR100203781B1 (ko) * 1996-09-13 1999-06-15 윤종용 반도체 포토리소그래피 공정의 현상액 공급시스템
US5868278A (en) * 1996-12-09 1999-02-09 Taiwan Semiconductor Manufacturing Company, Ltd. Eliminating microbubbles in developer solutions to reduce photoresist residues
JP3206745B2 (ja) * 1999-05-21 2001-09-10 東京エレクトロン株式会社 液供給装置

Also Published As

Publication number Publication date
KR100539187B1 (ko) 2006-03-20
EP0851301A1 (de) 1998-07-01
KR19980064626A (ko) 1998-10-07
DE69707097T2 (de) 2002-03-07
SG67461A1 (en) 1999-09-21
TW382749B (en) 2000-02-21
EP0851301B1 (de) 2001-10-04
US6015066A (en) 2000-01-18

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