DE69706940D1 - Unter Verwendung einer eine thermische Spannung erzeugenden punktlichen Wärmequelle, Verfahren zum Spalten von Sprödenwerkstoff - Google Patents

Unter Verwendung einer eine thermische Spannung erzeugenden punktlichen Wärmequelle, Verfahren zum Spalten von Sprödenwerkstoff

Info

Publication number
DE69706940D1
DE69706940D1 DE69706940T DE69706940T DE69706940D1 DE 69706940 D1 DE69706940 D1 DE 69706940D1 DE 69706940 T DE69706940 T DE 69706940T DE 69706940 T DE69706940 T DE 69706940T DE 69706940 D1 DE69706940 D1 DE 69706940D1
Authority
DE
Germany
Prior art keywords
heat generating
thermal stress
point source
brittle material
generating thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69706940T
Other languages
English (en)
Other versions
DE69706940T2 (de
Inventor
Hiroshi Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69706940D1 publication Critical patent/DE69706940D1/de
Application granted granted Critical
Publication of DE69706940T2 publication Critical patent/DE69706940T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work
DE69706940T 1996-10-30 1997-10-30 Unter Verwendung einer eine thermische Spannung erzeugenden punktlichen Wärmequelle, Verfahren zum Spalten von Sprödenwerkstoff Expired - Fee Related DE69706940T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8288096A JPH10128567A (ja) 1996-10-30 1996-10-30 レーザ割断方法

Publications (2)

Publication Number Publication Date
DE69706940D1 true DE69706940D1 (de) 2001-10-31
DE69706940T2 DE69706940T2 (de) 2002-04-04

Family

ID=17725750

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69706940T Expired - Fee Related DE69706940T2 (de) 1996-10-30 1997-10-30 Unter Verwendung einer eine thermische Spannung erzeugenden punktlichen Wärmequelle, Verfahren zum Spalten von Sprödenwerkstoff

Country Status (6)

Country Link
US (1) US6023039A (de)
EP (1) EP0839597B1 (de)
JP (1) JPH10128567A (de)
KR (1) KR100264308B1 (de)
DE (1) DE69706940T2 (de)
TW (1) TW365558B (de)

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JPH11240730A (ja) * 1998-02-27 1999-09-07 Nec Kansai Ltd 脆性材料の割断方法
US6211488B1 (en) 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
WO2001085387A1 (en) * 2000-05-11 2001-11-15 Ptg Precision Technology Center Limited Llc System for cutting brittle materials
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
TW542763B (en) * 2001-07-16 2003-07-21 Mitsuboshi Diamond Ind Co Ltd Scribing device for fragile material substrate
ATE362653T1 (de) 2002-03-12 2007-06-15 Hamamatsu Photonics Kk Methode zur trennung von substraten
TWI326626B (en) * 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
US7304265B2 (en) * 2002-03-12 2007-12-04 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
JP4606741B2 (ja) 2002-03-12 2011-01-05 浜松ホトニクス株式会社 加工対象物切断方法
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
EP1609559B1 (de) * 2003-03-12 2007-08-08 Hamamatsu Photonics K. K. Laserstrahlbearbeitungsverfahren
DE10330179A1 (de) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
JP2005268752A (ja) * 2004-02-19 2005-09-29 Canon Inc レーザ割断方法、被割断部材および半導体素子チップ
DE102004035342B4 (de) 2004-07-21 2007-12-27 Schott Ag Verfahren zum Durchtrennen von Platten aus nichtmetallischen Werkstoffen
US20060021977A1 (en) * 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
JP2006315017A (ja) * 2005-05-11 2006-11-24 Canon Inc レーザ切断方法および被切断部材
US9362439B2 (en) * 2008-05-07 2016-06-07 Silicon Genesis Corporation Layer transfer of films utilizing controlled shear region
JP5345334B2 (ja) * 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
US8609512B2 (en) * 2009-03-27 2013-12-17 Electro Scientific Industries, Inc. Method for laser singulation of chip scale packages on glass substrates
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
JP5056839B2 (ja) * 2009-12-25 2012-10-24 三星ダイヤモンド工業株式会社 被加工物の加工方法および被加工物の分割方法
US8720228B2 (en) * 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8677783B2 (en) * 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
CN102749746B (zh) * 2012-06-21 2015-02-18 深圳市华星光电技术有限公司 液晶基板切割装置及液晶基板切割方法
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
DE102014013262A1 (de) 2014-09-08 2016-03-10 Schott Ag Vorrichtung und Verfahren zum Durchtrennen von mit einer Geschwindigkeit bewegten Werkstücken mechanisch spröder und nichtmetallischer Werkstoffe

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US3629545A (en) * 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
US3790362A (en) * 1970-09-15 1974-02-05 Ppg Industries Inc Directional control for thermal severing of glass
IT996776B (it) * 1972-10-12 1975-12-10 Glaverbel Procedimento e dispositivo per ta gliare un materiale vetroso o vetro cristallino
US4615765A (en) * 1985-02-01 1986-10-07 General Electric Company Self-registered, thermal processing technique using a pulsed heat source
EP0397236B1 (de) * 1989-05-08 1994-10-05 Koninklijke Philips Electronics N.V. Verfahren zum Spalten einer Platte aus sprödem Werkstoff
DE69008927T2 (de) * 1989-05-08 1994-12-01 Philips Nv Verfahren zum Spalten einer Platte aus sprödem Werkstoff.
JPH0313040A (ja) * 1989-06-09 1991-01-22 Sharp Corp コードレス電話機
JP2712723B2 (ja) * 1990-03-07 1998-02-16 松下電器産業株式会社 レーザ切断方法
JPH0639572A (ja) * 1991-01-11 1994-02-15 Souei Tsusho Kk ウェハ割断装置
US5281798A (en) * 1991-12-24 1994-01-25 Maxwell Laboratories, Inc. Method and system for selective removal of material coating from a substrate using a flashlamp
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
JP3175463B2 (ja) * 1994-02-24 2001-06-11 三菱電機株式会社 レーザ切断方法
US5776220A (en) * 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials

Also Published As

Publication number Publication date
EP0839597B1 (de) 2001-09-26
EP0839597A1 (de) 1998-05-06
KR100264308B1 (ko) 2000-08-16
KR19990034662A (ko) 1999-05-15
TW365558B (en) 1999-08-01
US6023039A (en) 2000-02-08
JPH10128567A (ja) 1998-05-19
DE69706940T2 (de) 2002-04-04

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee