DE69703611T2 - Ätzverfahren unter Verwendung eines fokussierten Ionenstrahls (FIB) mit 1,2-Dijodoäthan - Google Patents
Ätzverfahren unter Verwendung eines fokussierten Ionenstrahls (FIB) mit 1,2-DijodoäthanInfo
- Publication number
- DE69703611T2 DE69703611T2 DE69703611T DE69703611T DE69703611T2 DE 69703611 T2 DE69703611 T2 DE 69703611T2 DE 69703611 T DE69703611 T DE 69703611T DE 69703611 T DE69703611 T DE 69703611T DE 69703611 T2 DE69703611 T2 DE 69703611T2
- Authority
- DE
- Germany
- Prior art keywords
- diiodoethane
- fib
- etching process
- ion beam
- focused ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- GBBZLMLLFVFKJM-UHFFFAOYSA-N 1,2-diiodoethane Chemical compound ICCI GBBZLMLLFVFKJM-UHFFFAOYSA-N 0.000 title 1
- 238000005530 etching Methods 0.000 title 1
- 238000010884 ion-beam technique Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3174—Etching microareas
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/771,804 US5840630A (en) | 1996-12-20 | 1996-12-20 | FBI etching enhanced with 1,2 di-iodo-ethane |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69703611D1 DE69703611D1 (de) | 2001-01-04 |
DE69703611T2 true DE69703611T2 (de) | 2001-05-03 |
Family
ID=25093016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69703611T Expired - Fee Related DE69703611T2 (de) | 1996-12-20 | 1997-12-10 | Ätzverfahren unter Verwendung eines fokussierten Ionenstrahls (FIB) mit 1,2-Dijodoäthan |
Country Status (6)
Country | Link |
---|---|
US (1) | US5840630A (de) |
EP (1) | EP0855734B1 (de) |
JP (1) | JPH10204660A (de) |
KR (1) | KR100510431B1 (de) |
DE (1) | DE69703611T2 (de) |
TW (1) | TW375761B (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3117960B2 (ja) * | 1997-12-11 | 2000-12-18 | セイコーインスツルメンツ株式会社 | 集束イオンビーム加工方法及び装置 |
JP3494889B2 (ja) * | 1998-06-03 | 2004-02-09 | セイコーインスツルメンツ株式会社 | 集束イオンビーム加工装置 |
US6268608B1 (en) | 1998-10-09 | 2001-07-31 | Fei Company | Method and apparatus for selective in-situ etching of inter dielectric layers |
US6651313B1 (en) * | 2000-10-06 | 2003-11-25 | International Business Machines Corporation | Method for manufacturing a magnetic head |
US6730237B2 (en) * | 2001-06-22 | 2004-05-04 | International Business Machines Corporation | Focused ion beam process for removal of copper |
AU2002336400A1 (en) | 2001-08-27 | 2003-03-10 | Nptest, Inc. | Process for charged particle beam micro-machining of copper |
US6855622B2 (en) | 2002-05-30 | 2005-02-15 | Nptest, Llc | Method and apparatus for forming a cavity in a semiconductor substrate using a charged particle beam |
US6955930B2 (en) | 2002-05-30 | 2005-10-18 | Credence Systems Corporation | Method for determining thickness of a semiconductor substrate at the floor of a trench |
US7029595B1 (en) * | 2002-08-21 | 2006-04-18 | Advanced Micro Devices, Inc. | Selective etch for uniform metal trace exposure and milling using focused ion beam system |
US7060196B2 (en) * | 2003-10-03 | 2006-06-13 | Credence Systems Corporation | FIB milling of copper over organic dielectrics |
JP4359131B2 (ja) | 2003-12-08 | 2009-11-04 | 株式会社日立ハイテクノロジーズ | 液体金属イオン銃、及びイオンビーム装置 |
KR100590575B1 (ko) * | 2004-12-24 | 2006-06-19 | 삼성전자주식회사 | 새로운 물질을 이용한 전자빔 리소그래피 방법 |
US8277672B2 (en) * | 2009-04-17 | 2012-10-02 | Tiza Lab, LLC | Enhanced focused ion beam etching of dielectrics and silicon |
EP3380061A4 (de) | 2015-11-24 | 2019-07-24 | Insulet Corporation | Automatisiertes wearable-arzneimittelabgabesystem |
CZ310048B6 (cs) * | 2017-07-25 | 2024-06-19 | Tescan Group, A.S. | Způsob odstranění hmoty |
US20220223431A1 (en) * | 2020-12-28 | 2022-07-14 | American Air Liquide, Inc. | High conductive passivation layers and method of forming the same during high aspect ratio plasma etching |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4126523A (en) * | 1976-10-21 | 1978-11-21 | Alumatec, Inc. | Method and means for electrolytic precleaning of substrates and the electrodeposition of aluminum on said substrates |
US4226666A (en) * | 1978-08-21 | 1980-10-07 | International Business Machines Corporation | Etching method employing radiation and noble gas halide |
DE3785737T2 (de) * | 1986-12-26 | 1993-09-02 | Seiko Instr Inc | Geraet zur ausbesserung eines gemusterten films. |
US4874947A (en) * | 1988-02-26 | 1989-10-17 | Micrion Corporation | Focused ion beam imaging and process control |
DE3919568A1 (de) * | 1989-06-15 | 1990-12-20 | Dom Sicherheitstechnik | Schloss mit vor- und rueckschliessbarem riegelelement |
US5009743A (en) * | 1989-11-06 | 1991-04-23 | Gatan Incorporated | Chemically-assisted ion beam milling system for the preparation of transmission electron microscope specimens |
JPH088245B2 (ja) * | 1990-09-28 | 1996-01-29 | 株式会社島津製作所 | 集束イオンビームエッチング装置 |
US5140164A (en) * | 1991-01-14 | 1992-08-18 | Schlumberger Technologies, Inc. | Ic modification with focused ion beam system |
WO1994013010A1 (en) * | 1991-04-15 | 1994-06-09 | Fei Company | Process of shaping features of semiconductor devices |
US5188705A (en) * | 1991-04-15 | 1993-02-23 | Fei Company | Method of semiconductor device manufacture |
DE4421517A1 (de) * | 1993-06-28 | 1995-01-05 | Schlumberger Technologies Inc | Verfahren zum Abtrag oder Auftrag von Material mittels eines Partikelstrahls und Vorrichtung zu seiner Durchführung |
US5580419A (en) * | 1994-03-23 | 1996-12-03 | Trw Inc. | Process of making semiconductor device using focused ion beam for resistless in situ etching, deposition, and nucleation |
-
1996
- 1996-12-20 US US08/771,804 patent/US5840630A/en not_active Expired - Fee Related
-
1997
- 1997-11-11 TW TW086116824A patent/TW375761B/zh not_active IP Right Cessation
- 1997-12-10 EP EP97402995A patent/EP0855734B1/de not_active Expired - Lifetime
- 1997-12-10 DE DE69703611T patent/DE69703611T2/de not_active Expired - Fee Related
- 1997-12-15 JP JP9345286A patent/JPH10204660A/ja active Pending
- 1997-12-17 KR KR1019970070005A patent/KR100510431B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR19980064271A (ko) | 1998-10-07 |
KR100510431B1 (ko) | 2005-11-11 |
EP0855734B1 (de) | 2000-11-29 |
EP0855734A1 (de) | 1998-07-29 |
TW375761B (en) | 1999-12-01 |
DE69703611D1 (de) | 2001-01-04 |
JPH10204660A (ja) | 1998-08-04 |
US5840630A (en) | 1998-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |