DE69703350D1 - Siebdruckverfahren und siebdruckvorrichtung - Google Patents

Siebdruckverfahren und siebdruckvorrichtung

Info

Publication number
DE69703350D1
DE69703350D1 DE69703350T DE69703350T DE69703350D1 DE 69703350 D1 DE69703350 D1 DE 69703350D1 DE 69703350 T DE69703350 T DE 69703350T DE 69703350 T DE69703350 T DE 69703350T DE 69703350 D1 DE69703350 D1 DE 69703350D1
Authority
DE
Germany
Prior art keywords
screen printing
printing device
printing method
screen
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69703350T
Other languages
English (en)
Other versions
DE69703350T2 (de
Inventor
Akihiko Wachi
Seishiro Yanachi
Nobuyuki Kakishima
Masaya Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69703350D1 publication Critical patent/DE69703350D1/de
Publication of DE69703350T2 publication Critical patent/DE69703350T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/10—Machines for multicolour printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S101/00—Printing
    • Y10S101/36—Means for registering or alignment of print plates on print press structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69703350T 1996-06-14 1997-06-12 Siebdruckverfahren und siebdruckvorrichtung Expired - Fee Related DE69703350T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15433296 1996-06-14
PCT/JP1997/002027 WO1997048258A1 (en) 1996-06-14 1997-06-12 Screen printing method and screen printing apparatus

Publications (2)

Publication Number Publication Date
DE69703350D1 true DE69703350D1 (de) 2000-11-23
DE69703350T2 DE69703350T2 (de) 2001-05-31

Family

ID=15581843

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69703350T Expired - Fee Related DE69703350T2 (de) 1996-06-14 1997-06-12 Siebdruckverfahren und siebdruckvorrichtung

Country Status (6)

Country Link
US (1) US6131511A (de)
EP (1) EP0904675B1 (de)
JP (1) JP2000514005A (de)
CN (1) CN1167314C (de)
DE (1) DE69703350T2 (de)
WO (1) WO1997048258A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60045379D1 (de) * 1999-07-26 2011-01-27 Panasonic Corp Verfahren und vorrichtung zum drucken von lötpaste
US6715413B2 (en) 2000-05-09 2004-04-06 Matsushita Electric Industrial Co., Ltd. Apparatus and method of screen printing
SG99920A1 (en) * 2000-07-18 2003-11-27 Matsushita Electric Ind Co Ltd Screen printing apparatus and method of the same
US6386435B1 (en) 2000-08-11 2002-05-14 Emc Corporation Systems and methods for distributing solder paste using a tool having a solder paste aperture with a non-circular cross-sectional shape
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US7084353B1 (en) 2002-12-11 2006-08-01 Emc Corporation Techniques for mounting a circuit board component to a circuit board
JP2004351624A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Ind Co Ltd クリーム半田のスクリーン印刷装置およびスクリーン印刷方法
JP2006187912A (ja) * 2005-01-05 2006-07-20 Denso Corp スクリーン印刷方法及びその装置
US8215473B2 (en) * 2008-05-21 2012-07-10 Applied Materials, Inc. Next generation screen printing system
JP2011031588A (ja) * 2009-08-06 2011-02-17 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
WO2011160130A2 (en) 2010-06-18 2011-12-22 Sionyx, Inc High speed photosensitive devices and associated methods
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
US20130016203A1 (en) 2011-07-13 2013-01-17 Saylor Stephen D Biometric imaging devices and associated methods
JP5189194B2 (ja) * 2011-09-05 2013-04-24 ミカドテクノス株式会社 真空加熱接合装置及び真空加熱接合方法
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
CN102756539B (zh) * 2012-07-20 2014-04-16 深圳市捷佳伟创新能源装备股份有限公司 一种基于双印刷台的图形对位方法及其装置
US9421755B2 (en) * 2013-03-14 2016-08-23 Telekom Malaysia Berhad Screen printing system with positional alignment
US9209345B2 (en) 2013-06-29 2015-12-08 Sionyx, Inc. Shallow trench textured regions and associated methods
PL2840874T3 (pl) * 2013-08-19 2020-03-31 Asm Assembly Systems Gmbh & Co. Kg Zmiana parametrów sterujących drukowaniem na podstawie zmierzonych depozytów pasty lutowniczej na pewnych podobszarach płytki drukowanej
WO2015033403A1 (ja) * 2013-09-04 2015-03-12 富士機械製造株式会社 実装ライン
CN105015151A (zh) * 2015-07-31 2015-11-04 苏州宏展信息科技有限公司 一种小型焊膏丝印台

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0126723A3 (de) * 1983-05-18 1986-10-29 Svecia Silkscreen Maskiner AB Verfahren und Vorrichtung zum Positionieren eines zweiten Abdruckes von einem auf einer Schablone befindlichen Muster auf einem zu bedruckenden Werkstück
JPS60259446A (ja) * 1984-06-06 1985-12-21 Pilot Pen Co Ltd:The スクリーン印刷におけるスクリーン版と被印刷体の位置整合装置
SE8405067L (sv) * 1984-10-10 1986-04-11 Svecia Silkscreen Maskiner Ab Anordning for att i en stenciltryckmaskin orientera ett fran ett forsta pa en stencil utbildat monster herrorande andra monster i forhallande till ett for monstret avsett material (samtidig stegmotorpaverkan)
SE8703669L (sv) * 1987-09-23 1989-03-24 Svecia Silkscreen Maskiner Ab Saett att i en flerfaergsstenciltryckmaskin kunna orientera ett material foer raett tryckning i resp trycklaege
JP2666368B2 (ja) * 1988-05-25 1997-10-22 松下電器産業株式会社 スクリーン印刷機
JPH0734500B2 (ja) * 1988-11-02 1995-04-12 三洋電機株式会社 スクリーン印刷機のスクリーン位置合わせ方法及びその装置
JP2745623B2 (ja) * 1989-01-17 1998-04-28 松下電器産業株式会社 スクリーン印刷方法
JP2682145B2 (ja) * 1989-06-16 1997-11-26 松下電器産業株式会社 スクリーン印刷装置及びスクリーン印刷方法
JP2717707B2 (ja) * 1989-07-14 1998-02-25 株式会社村田製作所 スクリーン印刷方法、印刷版の製造方法及びそれらのための装置
JP2936601B2 (ja) * 1989-10-17 1999-08-23 松下電器産業株式会社 印刷ペーストのスクリーン印刷方法
JP2614946B2 (ja) * 1991-05-27 1997-05-28 日立テクノエンジニアリング株式会社 スクリーン印刷機
JPH04353448A (ja) * 1991-05-30 1992-12-08 Matsushita Electric Ind Co Ltd スクリーン印刷機
JPH05131610A (ja) * 1991-11-14 1993-05-28 Tdk Corp 印刷用スクリーンと基板の位置合わせ装置
JP3179832B2 (ja) * 1992-01-14 2001-06-25 松下電器産業株式会社 スクリーン印刷機及び方法
JPH05229097A (ja) * 1992-02-22 1993-09-07 Tdk Corp スクリーン印刷法
JP3266343B2 (ja) * 1992-12-17 2002-03-18 芝浦メカトロニクス株式会社 クリームはんだ印刷装置
JP3268859B2 (ja) * 1992-12-28 2002-03-25 三洋電機株式会社 スクリーン印刷機のスクリーン位置合わせ方法及びその装置
JPH081906A (ja) * 1994-06-27 1996-01-09 Matsushita Electric Ind Co Ltd スクリーン印刷方法およびスクリーン印刷装置
JPH0858058A (ja) * 1994-08-25 1996-03-05 Matsushita Electric Ind Co Ltd クリーム半田印刷機

Also Published As

Publication number Publication date
US6131511A (en) 2000-10-17
CN1221552A (zh) 1999-06-30
JP2000514005A (ja) 2000-10-24
WO1997048258A1 (en) 1997-12-18
DE69703350T2 (de) 2001-05-31
EP0904675A1 (de) 1999-03-31
EP0904675B1 (de) 2000-10-18
CN1167314C (zh) 2004-09-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee