DE69702033T2 - Elektronisches Steuergerät mit Kühlkörper - Google Patents

Elektronisches Steuergerät mit Kühlkörper

Info

Publication number
DE69702033T2
DE69702033T2 DE69702033T DE69702033T DE69702033T2 DE 69702033 T2 DE69702033 T2 DE 69702033T2 DE 69702033 T DE69702033 T DE 69702033T DE 69702033 T DE69702033 T DE 69702033T DE 69702033 T2 DE69702033 T2 DE 69702033T2
Authority
DE
Germany
Prior art keywords
control unit
heat sink
electronic control
electronic
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69702033T
Other languages
English (en)
Other versions
DE69702033D1 (de
Inventor
James Ronald Kiefer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE69702033D1 publication Critical patent/DE69702033D1/de
Application granted granted Critical
Publication of DE69702033T2 publication Critical patent/DE69702033T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
DE69702033T 1996-08-30 1997-08-28 Elektronisches Steuergerät mit Kühlkörper Expired - Fee Related DE69702033T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/705,605 US5777844A (en) 1996-08-30 1996-08-30 Electronic control with heat sink

Publications (2)

Publication Number Publication Date
DE69702033D1 DE69702033D1 (de) 2000-06-21
DE69702033T2 true DE69702033T2 (de) 2001-02-15

Family

ID=24834204

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69702033T Expired - Fee Related DE69702033T2 (de) 1996-08-30 1997-08-28 Elektronisches Steuergerät mit Kühlkörper

Country Status (4)

Country Link
US (1) US5777844A (de)
EP (1) EP0827373B1 (de)
DE (1) DE69702033T2 (de)
ES (1) ES2146958T3 (de)

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US5908235A (en) * 1997-04-28 1999-06-01 Jrs Technology Inc. Ballast fixture for fluorescent lighting
US6560119B1 (en) * 1998-06-23 2003-05-06 Fujitsu Limited Fastening parts suitable for recycling
DE19855389C2 (de) * 1998-12-01 2002-10-31 Siemens Ag Elektronische Vorrichtung
NO986129L (no) * 1998-12-23 2000-06-26 Cit Alcatel Beskyttet modulært hus for substrat
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
US6460170B1 (en) * 2000-04-29 2002-10-01 Hewlett Packard Company Connection block for interfacing a plurality of printed circuit boards
DE10034572A1 (de) * 2000-07-14 2002-01-24 Webasto Thermosysteme Gmbh Heizgerät mit Kühlmittel für Leistungstransistor
DE60139533D1 (de) * 2000-08-01 2009-09-24 Mitsubishi Electric Corp Elektronisches Gerät mit einem Substrat für die Schaltung
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
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US6479895B1 (en) * 2001-05-18 2002-11-12 Intel Corporation High performance air cooled heat sinks used in high density packaging applications
US6705144B2 (en) 2001-09-10 2004-03-16 Intel Corporation Manufacturing process for a radial fin heat sink
US6657862B2 (en) 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6881077B2 (en) * 2002-07-22 2005-04-19 Siemens Vdo Automotive Corporation Automotive control module housing
US20040120129A1 (en) * 2002-12-24 2004-06-24 Louis Soto Multi-layer laminated structures for mounting electrical devices and method for fabricating such structures
US6831835B2 (en) * 2002-12-24 2004-12-14 Ault, Inc. Multi-layer laminated structures, method for fabricating such structures, and power supply including such structures
JP4186732B2 (ja) * 2003-07-24 2008-11-26 株式会社村田製作所 電子機器
US7193307B2 (en) * 2004-03-25 2007-03-20 Ault Incorporated Multi-layer FET array and method of fabricating
TWI256192B (en) * 2004-04-15 2006-06-01 Acbel Polytech Inc Power adapter with heat sink device
TWI318338B (en) * 2005-05-19 2009-12-11 Htc Corp Portable electronic device
US20060261783A1 (en) * 2005-05-23 2006-11-23 Paul Gamboa Electronic battery module (EBM) with bidirectional DC-DC converter
TWI283806B (en) * 2005-06-07 2007-07-11 Htc Corp Portable electronic device
US7440282B2 (en) * 2006-05-16 2008-10-21 Delphi Technologies, Inc. Heat sink electronic package having compliant pedestal
JP4799350B2 (ja) * 2006-09-29 2011-10-26 株式会社東芝 電子機器
US8007255B2 (en) * 2006-11-22 2011-08-30 Mitsubishi Heavy Industries, Ltd. Inverter-integrated electric compressor with inverter storage box arrangement
JP2008251687A (ja) * 2007-03-29 2008-10-16 Toshiba Corp プリント回路板、およびこれを備えた電子機器
JP4869181B2 (ja) * 2007-08-27 2012-02-08 三洋電機株式会社 放熱構造を有する携帯機器
FR2932356B1 (fr) * 2008-06-10 2011-03-25 Airbus France Systeme de dissipation de chaleur
US8363351B1 (en) 2008-07-29 2013-01-29 Western Digital Technologies, Inc. Disk drive base having a raised thermal pedestal
US8441216B2 (en) * 2008-09-03 2013-05-14 ALVA Systems, Inc. Power supply system for a building
JP2010073159A (ja) * 2008-09-22 2010-04-02 Fujitsu Ltd 電子機器
JP5402200B2 (ja) * 2009-04-20 2014-01-29 株式会社リコー 熱移動機構及び情報機器
CN102338142A (zh) * 2010-07-16 2012-02-01 深圳富泰宏精密工业有限公司 卡合结构及应用该卡合结构的电子装置
JP2013070028A (ja) * 2011-09-07 2013-04-18 Hitachi Automotive Systems Ltd 電子制御装置
JP5962061B2 (ja) * 2012-02-28 2016-08-03 株式会社ジェイテクト 電動モータの制御装置及びこれを備えた車両用操舵装置
JP2013197405A (ja) * 2012-03-21 2013-09-30 Hitachi Automotive Systems Ltd 電子制御装置
US8702052B2 (en) 2012-07-05 2014-04-22 Globe Motors, Inc. Retention structure for heat generating component
US9007773B2 (en) * 2012-08-31 2015-04-14 Flextronics Ap, Llc Housing unit with heat sink
US9472799B2 (en) * 2012-10-29 2016-10-18 Infineon Technologies Ag Switch arrangements and battery arrangements
US20160135282A1 (en) * 2014-11-07 2016-05-12 Kabushiki Kaisha Toshiba Electronic apparatus
DE102015219071B3 (de) * 2015-10-02 2016-12-15 Continental Automotive Gmbh Leistungsmodul mit Kühlkörper
JP6274196B2 (ja) * 2015-12-16 2018-02-07 株式会社オートネットワーク技術研究所 電気接続箱
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
JP7016054B2 (ja) * 2018-01-12 2022-02-04 パナソニックＩｐマネジメント株式会社 電源装置、前照灯、及び移動体
TWI763569B (zh) * 2020-11-17 2022-05-01 宏達國際電子股份有限公司 電子裝置
US11908495B2 (en) * 2022-04-21 2024-02-20 Western Digital Technologies, Inc. Electronic device with heat transfer pedestal having optimized interface surface and associated methods

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US4521827A (en) * 1981-10-23 1985-06-04 Thermalloy, Inc. Heat sink mounting
DE3203609C2 (de) * 1982-02-03 1985-02-14 Siemens AG, 1000 Berlin und 8000 München Kühlelement für integrierte Bauelemente
US4471407A (en) * 1982-09-27 1984-09-11 Kohler Company Combination heat sink for a semiconductor
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
IT8819772A0 (it) * 1988-03-15 1988-03-15 Honeywell Bull Spa Dispositivo selettivo a terra per apparecchiature elettroniche.
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
JP2612339B2 (ja) * 1989-04-18 1997-05-21 三菱電機株式会社 電子機器筐体
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
US5423192A (en) * 1993-08-18 1995-06-13 General Electric Company Electronically commutated motor for driving a compressor
FR2679729B1 (fr) * 1991-07-23 1994-04-29 Alcatel Telspace Dissipateur thermique.
US5138523A (en) * 1991-10-18 1992-08-11 International Business Machines Corporation Digitizer tablet having cooling apparatus with base and integrated heat sink
JPH05335764A (ja) * 1992-05-28 1993-12-17 Matsushita Electric Ind Co Ltd 電子回路装置とその製造方法
JPH0669389A (ja) * 1992-08-20 1994-03-11 Fujitsu Ltd 半導体装置の取り付け構造とその取り付け方法
US5305185A (en) * 1992-09-30 1994-04-19 Samarov Victor M Coplanar heatsink and electronics assembly
US5311395A (en) * 1992-10-29 1994-05-10 Ncr Corporation Surface mount heat sink
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
EP0619605B1 (de) * 1993-04-05 1996-08-28 STMicroelectronics S.r.l. Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke
US5367193A (en) * 1993-06-17 1994-11-22 Sun Microsystems, Inc. Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die
US5379185A (en) * 1993-11-01 1995-01-03 Motorola, Inc. Leadless surface mountable assembly
JP3288875B2 (ja) * 1994-11-28 2002-06-04 株式会社東芝 シールドケースの取付構造
US5611393A (en) * 1996-02-23 1997-03-18 Wakefield Engineering, Inc. Clamping heat sink

Also Published As

Publication number Publication date
DE69702033D1 (de) 2000-06-21
US5777844A (en) 1998-07-07
EP0827373A1 (de) 1998-03-04
EP0827373B1 (de) 2000-05-17
ES2146958T3 (es) 2000-08-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: ROEGER UND KOLLEGEN, 73728 ESSLINGEN

8339 Ceased/non-payment of the annual fee