DE69701463D1 - System zum abgeben von geschmolzenem lötwerkstoff - Google Patents

System zum abgeben von geschmolzenem lötwerkstoff

Info

Publication number
DE69701463D1
DE69701463D1 DE69701463T DE69701463T DE69701463D1 DE 69701463 D1 DE69701463 D1 DE 69701463D1 DE 69701463 T DE69701463 T DE 69701463T DE 69701463 T DE69701463 T DE 69701463T DE 69701463 D1 DE69701463 D1 DE 69701463D1
Authority
DE
Germany
Prior art keywords
soldering material
molten soldering
dispensing molten
dispensing
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69701463T
Other languages
English (en)
Other versions
DE69701463T2 (de
Inventor
Alan Straub
Burke Dipiazza
Amir Jairazbhoy
Nandial Goenka
Claude Stevenson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co Ltd
Ford Motor Co
Original Assignee
Ford Motor Co Ltd
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co Ltd, Ford Motor Co filed Critical Ford Motor Co Ltd
Application granted granted Critical
Publication of DE69701463D1 publication Critical patent/DE69701463D1/de
Publication of DE69701463T2 publication Critical patent/DE69701463T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69701463T 1996-05-15 1997-05-01 System zum abgeben von geschmolzenem lötwerkstoff Expired - Fee Related DE69701463T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/649,750 US5746368A (en) 1996-05-15 1996-05-15 Molten solder dispensing system
PCT/GB1997/001184 WO1997043071A1 (en) 1996-05-15 1997-05-01 Molten solder dispensing system

Publications (2)

Publication Number Publication Date
DE69701463D1 true DE69701463D1 (de) 2000-04-20
DE69701463T2 DE69701463T2 (de) 2000-07-06

Family

ID=24606074

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69701463T Expired - Fee Related DE69701463T2 (de) 1996-05-15 1997-05-01 System zum abgeben von geschmolzenem lötwerkstoff

Country Status (6)

Country Link
US (2) US5746368A (de)
EP (1) EP0910490B1 (de)
JP (1) JP2001522309A (de)
KR (1) KR19990071770A (de)
DE (1) DE69701463T2 (de)
WO (1) WO1997043071A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6076723A (en) * 1998-08-19 2000-06-20 Hewlett-Packard Company Metal jet deposition system
JP4142800B2 (ja) * 1999-04-07 2008-09-03 株式会社ルネサステクノロジ バンプ形成装置及びバンプ形成方法
JP2001274532A (ja) * 2000-03-24 2001-10-05 Olympus Optical Co Ltd 電気配線形成システム
US6878396B2 (en) * 2000-04-10 2005-04-12 Micron Technology, Inc. Micro C-4 semiconductor die and method for depositing connection sites thereon
DE10331714B4 (de) * 2003-07-11 2006-05-24 Micronas Gmbh Verfahren zur Strukturierung der Oberfläche eines Substrats
US7519220B2 (en) * 2004-11-15 2009-04-14 Siemens Medical Solutions Usa, Inc. GPU accelerated isoperimetric algorithm for image segmentation, digital photo and video editing
US20080302861A1 (en) * 2007-06-11 2008-12-11 Szymanowski Richard A Method and apparatus for wave soldering an electronic substrate

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1760519A (en) * 1926-12-29 1930-05-27 Gen Electric Soldering iron
US1906225A (en) * 1931-04-15 1933-05-02 Dupau Fernand Electrically-heated soldering-iron
US2780712A (en) * 1955-02-16 1957-02-05 John F Thomas Soldering device
US3222776A (en) * 1961-12-04 1965-12-14 Ibm Method and apparatus for treating molten material
DE1215310B (de) * 1963-03-02 1966-04-28 Bochumer Ver Fuer Gussstahlfab Vorrichtung zum Entgasen und Giessen, insbesondere Stranggiessen, von Stahl oder anderen Metallen
US3358897A (en) * 1964-03-31 1967-12-19 Tempress Res Co Electric lead wire bonding tools
US3408059A (en) * 1965-06-02 1968-10-29 United States Steel Corp Apparatus for stream degassing molten metal
US3423029A (en) * 1966-03-03 1969-01-21 Quigley Co Multiple tube spray discharge nozzle
GB2061829B (en) * 1979-10-29 1983-11-09 Suwa Seikosha Kk Ink jet head
JPS6092072A (ja) * 1983-10-21 1985-05-23 Toshiba Corp 半田滴下装置
JPS60219793A (ja) * 1984-04-17 1985-11-02 松下電器産業株式会社 厚膜回路描画方法
US4603727A (en) * 1984-06-22 1986-08-05 Gte Laboratories Incorporated Flexible permeable valve for melt spinning process
US4546815A (en) * 1984-12-28 1985-10-15 Allied Corporation Continuous casting using in-line replaceable orifices
JPH01249163A (ja) * 1988-03-31 1989-10-04 Seiko Epson Corp ディスペンサー用ノズル及びそれを備えたダイボンダー
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
US5042708A (en) * 1990-09-24 1991-08-27 International Business Machines Corporation Solder placement nozzle assembly
US5065932A (en) * 1990-09-24 1991-11-19 International Business Machines Corporation Solder placement nozzle with inert cover gas and inert gas bleed
US5104689A (en) * 1990-09-24 1992-04-14 International Business Machines Corporation Method and apparatus for automated solder deposition at multiple sites
JPH0666314B2 (ja) * 1991-05-31 1994-08-24 インターナショナル・ビジネス・マシーンズ・コーポレイション バンプ形成方法及び装置
JPH04361871A (ja) * 1991-06-06 1992-12-15 Pioneer Electron Corp クリームハンダ塗布用ディスペンサー
US5176312A (en) * 1991-08-12 1993-01-05 Brian Lowenthal Selective flow soldering apparatus
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
US5244143A (en) * 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
JPH0692072A (ja) * 1992-06-05 1994-04-05 Katsuseru:Kk 磁気記録カード
US5261611A (en) * 1992-07-17 1993-11-16 Martin Marietta Energy Systems, Inc. Metal atomization spray nozzle
JP3583462B2 (ja) * 1993-04-05 2004-11-04 フォード モーター カンパニー 電子成分のための微小はんだ付け装置および方法
US5377961A (en) * 1993-04-16 1995-01-03 International Business Machines Corporation Electrodynamic pump for dispensing molten solder
US5452827A (en) * 1993-07-13 1995-09-26 Eckert; C. Edward Nozzle for continuous caster
JP3478914B2 (ja) * 1995-10-20 2003-12-15 株式会社日立製作所 流体噴射ノズル及びそのノズルを用いた応力改善処理方法

Also Published As

Publication number Publication date
WO1997043071A1 (en) 1997-11-20
EP0910490A1 (de) 1999-04-28
US5746368A (en) 1998-05-05
DE69701463T2 (de) 2000-07-06
KR19990071770A (ko) 1999-09-27
EP0910490B1 (de) 2000-03-15
US6000597A (en) 1999-12-14
JP2001522309A (ja) 2001-11-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee