DE69632228D1 - Bildsensor und Verpackungsverfahren - Google Patents

Bildsensor und Verpackungsverfahren

Info

Publication number
DE69632228D1
DE69632228D1 DE69632228T DE69632228T DE69632228D1 DE 69632228 D1 DE69632228 D1 DE 69632228D1 DE 69632228 T DE69632228 T DE 69632228T DE 69632228 T DE69632228 T DE 69632228T DE 69632228 D1 DE69632228 D1 DE 69632228D1
Authority
DE
Germany
Prior art keywords
image sensor
packaging process
packaging
sensor
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69632228T
Other languages
English (en)
Other versions
DE69632228T2 (de
Inventor
Dean A Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/563,832 external-priority patent/US5861654A/en
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of DE69632228D1 publication Critical patent/DE69632228D1/de
Application granted granted Critical
Publication of DE69632228T2 publication Critical patent/DE69632228T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Facsimile Heads (AREA)
  • Light Receiving Elements (AREA)
DE69632228T 1995-07-13 1996-07-11 Bildsensor mit einem Trägergehäuse Expired - Lifetime DE69632228T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US112395P 1995-07-13 1995-07-13
US1123 1995-07-13
US563832 1995-11-28
US08/563,832 US5861654A (en) 1995-11-28 1995-11-28 Image sensor assembly

Publications (2)

Publication Number Publication Date
DE69632228D1 true DE69632228D1 (de) 2004-05-27
DE69632228T2 DE69632228T2 (de) 2005-04-14

Family

ID=26668591

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69632228T Expired - Lifetime DE69632228T2 (de) 1995-07-13 1996-07-11 Bildsensor mit einem Trägergehäuse

Country Status (4)

Country Link
US (1) US5998878A (de)
EP (1) EP0753893B1 (de)
JP (1) JPH0936339A (de)
DE (1) DE69632228T2 (de)

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SE508763C2 (sv) * 1995-11-29 1998-11-02 Ericsson Telefon Ab L M Förfarande och anordning för chipmontering
EP0886322A3 (de) * 1997-06-16 1999-02-03 Eastman Kodak Company Einkapselung von Bildsensoren
US5821532A (en) * 1997-06-16 1998-10-13 Eastman Kodak Company Imager package substrate
FR2779836B1 (fr) * 1998-06-12 2003-05-30 Thomson Csf Systeme d'assemblage de composant sur dispositif optique
US6185816B1 (en) * 1999-07-06 2001-02-13 Lucent Technologies Inc. Alignment method
US6483030B1 (en) 1999-12-08 2002-11-19 Amkor Technology, Inc. Snap lid image sensor package
US6483101B1 (en) 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
WO2001091193A2 (en) 2000-05-23 2001-11-29 Atmel Corporation Integrated ic chip package for electronic image sensor die
US6683298B1 (en) * 2000-11-20 2004-01-27 Agilent Technologies Inc. Image sensor packaging with package cavity sealed by the imaging optics
JP4476471B2 (ja) * 2000-11-27 2010-06-09 株式会社東芝 Ｘ線コンピュータ断層撮影装置
US7059040B1 (en) 2001-01-16 2006-06-13 Amkor Technology, Inc. Optical module with lens integral holder fabrication method
KR100401020B1 (ko) 2001-03-09 2003-10-08 앰코 테크놀로지 코리아 주식회사 반도체칩의 스택킹 구조 및 이를 이용한 반도체패키지
US6734419B1 (en) 2001-06-28 2004-05-11 Amkor Technology, Inc. Method for forming an image sensor package with vision die in lens housing
JP4033439B2 (ja) * 2001-09-11 2008-01-16 シャープ株式会社 固体撮像ユニットおよびその製造方法、撮像機器
KR100399640B1 (ko) * 2001-09-18 2003-09-29 삼성전기주식회사 촬상 소자 모듈 패키지
US6936495B1 (en) 2002-01-09 2005-08-30 Bridge Semiconductor Corporation Method of making an optoelectronic semiconductor package device
US6891276B1 (en) 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
US6838689B1 (en) * 2002-02-14 2005-01-04 Finisar Corporation Backside alignment and packaging of opto-electronic devices
US8614768B2 (en) 2002-03-18 2013-12-24 Raytheon Company Miniaturized imaging device including GRIN lens optically coupled to SSID
US7146106B2 (en) * 2002-08-23 2006-12-05 Amkor Technology, Inc. Optic semiconductor module and manufacturing method
US20060261458A1 (en) * 2003-11-12 2006-11-23 Amkor Technology, Inc. Semiconductor package and manufacturing method thereof
DE202004011854U1 (de) * 2004-07-28 2004-11-04 Microelectronic Packaging Dresden Gmbh Image-Modul
JP4687053B2 (ja) * 2004-09-29 2011-05-25 株式会社ニコン 撮像素子ユニットおよびデジタルカメラ
US7359579B1 (en) 2004-10-08 2008-04-15 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20070210246A1 (en) * 2005-04-14 2007-09-13 Amkor Technology, Inc. Stacked image sensor optical module and fabrication method
US7227236B1 (en) 2005-04-26 2007-06-05 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20070272827A1 (en) * 2005-04-27 2007-11-29 Amkor Technology, Inc. Image sensor package having mount holder attached to image sensor die
US7576401B1 (en) 2005-07-07 2009-08-18 Amkor Technology, Inc. Direct glass attached on die optical module
CN100468665C (zh) * 2005-12-02 2009-03-11 鸿富锦精密工业（深圳）有限公司 影像感测晶片封装制程
CN100562068C (zh) * 2005-12-02 2009-11-18 鸿富锦精密工业（深圳）有限公司 数码相机模组制作方法
US20080237824A1 (en) * 2006-02-17 2008-10-02 Amkor Technology, Inc. Stacked electronic component package having single-sided film spacer
US7675180B1 (en) 2006-02-17 2010-03-09 Amkor Technology, Inc. Stacked electronic component package having film-on-wire spacer
US7633144B1 (en) 2006-05-24 2009-12-15 Amkor Technology, Inc. Semiconductor package
US7835074B2 (en) 2007-06-05 2010-11-16 Sterling Lc Mini-scope for multi-directional imaging
US7485887B2 (en) * 2007-06-11 2009-02-03 Bae Systems Information And Electronic Systems Integration Inc. Passive alignment of photodiode active area in three axes using microscopic focus
US7969659B2 (en) 2008-01-11 2011-06-28 Sterling Lc Grin lens microscope system
JP5596027B2 (ja) 2008-06-18 2014-09-24 レイセオン カンパニー カテーテル
US8486735B2 (en) 2008-07-30 2013-07-16 Raytheon Company Method and device for incremental wavelength variation to analyze tissue
US7915717B2 (en) 2008-08-18 2011-03-29 Eastman Kodak Company Plastic image sensor packaging for image sensors
WO2010053916A2 (en) 2008-11-04 2010-05-14 Sterling Lc Method and device for wavelength shifted imaging
JP2011022860A (ja) * 2009-07-16 2011-02-03 Sony Corp 生体認証装置
US8717428B2 (en) 2009-10-01 2014-05-06 Raytheon Company Light diffusion apparatus
WO2011041720A2 (en) 2009-10-01 2011-04-07 Jacobsen Stephen C Method and apparatus for manipulating movement of a micro-catheter
WO2011041728A2 (en) 2009-10-01 2011-04-07 Jacobsen Stephen C Needle delivered imaging device
US8828028B2 (en) 2009-11-03 2014-09-09 Raytheon Company Suture device and method for closing a planar opening
TWI462341B (zh) * 2010-11-03 2014-11-21 Advanced Optoelectronic Tech 發光二極體封裝方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910264A (ja) * 1982-07-09 1984-01-19 Hitachi Ltd 固体撮像素子
JPS62183145A (ja) * 1986-02-06 1987-08-11 Seiko Epson Corp Ｉｃパツケ−ジ
JPS63155648A (ja) * 1986-12-18 1988-06-28 Toshiba Corp 固体撮像素子用セラミツクパツケ−ジ
JPH01217950A (ja) * 1988-02-26 1989-08-31 Toshiba Corp 固体撮像装置
JPH088624B2 (ja) * 1988-03-14 1996-01-29 株式会社日立製作所 完全密着型読取センサ及び読取センサアセンブリ
US4893163A (en) * 1988-03-28 1990-01-09 International Business Machines Corporation Alignment mark system for electron beam/optical mixed lithography
JPH02112280A (ja) * 1988-10-21 1990-04-24 Toshiba Corp 固体撮像素子用パッケージ
US5011256A (en) * 1988-10-28 1991-04-30 E. I. Du Pont De Nemours And Company Package for an opto-electronic component
US5122861A (en) * 1988-11-25 1992-06-16 Fuji Photo Film Co., Ltd. Solid state image pickup device having particular package structure
US5130531A (en) * 1989-06-09 1992-07-14 Omron Corporation Reflective photosensor and semiconductor light emitting apparatus each using micro Fresnel lens
NL8901523A (nl) * 1989-06-16 1991-01-16 Philips Nv Laserdiode module.
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
JP3067151B2 (ja) * 1990-03-13 2000-07-17 日本電気株式会社 光電気変換素子サブキャリア
JPH04294329A (ja) * 1991-03-22 1992-10-19 G T C:Kk 液晶表示装置およびその製造方法
US5249082A (en) * 1991-05-08 1993-09-28 Eastman Kodak Company Exact constraint arrangement for and methods of mounting an element such as a lens
US5408131A (en) * 1992-04-20 1995-04-18 Motorola, Inc. Circuit identifier for use with focused ion beam equipment
WO1993022787A1 (en) * 1992-04-28 1993-11-11 Lsi Logic Corporation Arrangement for mounting a lens to a solid state image sensor
CA2096551A1 (en) * 1992-05-22 1993-11-23 Masanori Nishiguchi Semiconductor device
US5349234A (en) * 1992-05-29 1994-09-20 Eastman Kodak Company Package and method for assembly of infra-red imaging devices
JP2595885B2 (ja) * 1993-11-18 1997-04-02 日本電気株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
EP0753893A3 (de) 1998-03-11
JPH0936339A (ja) 1997-02-07
EP0753893A2 (de) 1997-01-15
US5998878A (en) 1999-12-07
DE69632228T2 (de) 2005-04-14
EP0753893B1 (de) 2004-04-21

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Legal Events

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