DE69618917D1 - Sensor und Herstellunsgverfahren dazu - Google Patents

Sensor und Herstellunsgverfahren dazu

Info

Publication number
DE69618917D1
DE69618917D1 DE69618917T DE69618917T DE69618917D1 DE 69618917 D1 DE69618917 D1 DE 69618917D1 DE 69618917 T DE69618917 T DE 69618917T DE 69618917 T DE69618917 T DE 69618917T DE 69618917 D1 DE69618917 D1 DE 69618917D1
Authority
DE
Germany
Prior art keywords
sensor
manufacturing process
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69618917T
Other languages
English (en)
Other versions
DE69618917T2 (de
Inventor
Andrew Mirza
Kenneth M Seddon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE69618917D1 publication Critical patent/DE69618917D1/de
Application granted granted Critical
Publication of DE69618917T2 publication Critical patent/DE69618917T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0045—Diaphragm associated with a buried cavity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE69618917T 1995-12-20 1996-12-09 Sensor und Herstellunsgverfahren dazu Expired - Fee Related DE69618917T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/575,944 US5883420A (en) 1995-12-20 1995-12-20 Sensor device having a pathway and a sealed cavity

Publications (2)

Publication Number Publication Date
DE69618917D1 true DE69618917D1 (de) 2002-03-14
DE69618917T2 DE69618917T2 (de) 2002-06-20

Family

ID=24302333

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69618917T Expired - Fee Related DE69618917T2 (de) 1995-12-20 1996-12-09 Sensor und Herstellunsgverfahren dazu

Country Status (4)

Country Link
US (1) US5883420A (de)
EP (1) EP0780675B1 (de)
JP (1) JPH09186347A (de)
DE (1) DE69618917T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19710324A1 (de) * 1997-03-13 1998-09-17 Bosch Gmbh Robert Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelemente
EP1043770B1 (de) * 1999-04-09 2006-03-01 STMicroelectronics S.r.l. Herstellung von vergrabenen Hohlräumen in einer einkristallinen Halbleiterscheibe und Halbleiterscheibe
DE10250358B4 (de) * 2002-10-29 2017-02-09 Infineon Technologies Ag Sensormodul zur Messung mechanischer Kräfte
WO2006110662A2 (en) 2005-04-08 2006-10-19 Analatom, Inc. Compact pressure-sensing device
JP5069682B2 (ja) * 2005-07-22 2012-11-07 エスティーマイクロエレクトロニクス エス．アール．エル． 二重測定スケールおよび高フルスケール値を有する集積化圧力センサ
ITTO20070190A1 (it) * 2007-03-14 2008-09-15 St Microelectronics Srl Procedimento di fabbricazione di una membrana di materiale semiconduttore integrata in, ed isolata elettricamente da, un substrato
JP5687202B2 (ja) * 2009-11-04 2015-03-18 ローム株式会社 圧力センサおよび圧力センサの製造方法
FR2952628A1 (fr) * 2009-11-13 2011-05-20 Commissariat Energie Atomique Procede de fabrication d'au moins une micropompe a membrane deformable et micropompe a membrane deformable
JP2013138411A (ja) 2011-11-28 2013-07-11 Canon Inc 静電容量型トランスデューサの製造方法
US9352955B2 (en) * 2014-03-27 2016-05-31 Maxim Integrated Products, Inc. MEMS pressure sensor with improved insensitivity to thermo-mechanical stress

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4744863A (en) * 1985-04-26 1988-05-17 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
US4853669A (en) * 1985-04-26 1989-08-01 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
EP0219543B1 (de) * 1985-04-26 1993-12-15 Wisconsin Alumni Research Foundation Halbleiterdruckwandler mit versiegeltem hohlraum und verfahren dazu
US4996082A (en) * 1985-04-26 1991-02-26 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
GB2198611B (en) * 1986-12-13 1990-04-04 Spectrol Reliance Ltd Method of forming a sealed diaphragm on a substrate
JPH0797643B2 (ja) * 1987-07-08 1995-10-18 日産自動車株式会社 圧力変換装置の製造方法
US5177579A (en) * 1989-04-07 1993-01-05 Ic Sensors, Inc. Semiconductor transducer or actuator utilizing corrugated supports
US5283459A (en) * 1989-11-15 1994-02-01 Kabushiki Kaisha Toshiba Semiconductor sensor including an aperture having a funnel shaped section intersecting a second section
CN1018844B (zh) * 1990-06-02 1992-10-28 中国科学院兰州化学物理研究所 防锈干膜润滑剂
US5207866A (en) * 1991-01-17 1993-05-04 Motorola, Inc. Anisotropic single crystal silicon etching solution and method
JP2729005B2 (ja) * 1992-04-01 1998-03-18 三菱電機株式会社 半導体圧力センサ及びその製造方法
DE4314888C1 (de) * 1993-05-05 1994-08-18 Ignaz Eisele Verfahren zum Abscheiden einer ganzflächigen Schicht durch eine Maske und optionalem Verschließen dieser Maske
US5589703A (en) * 1995-04-28 1996-12-31 Motorola, Inc. Edge die bond semiconductor package
US5736430A (en) * 1995-06-07 1998-04-07 Ssi Technologies, Inc. Transducer having a silicon diaphragm and method for forming same
DE59600621D1 (de) * 1995-08-09 1998-11-05 Siemens Ag Mikromechanisches Bauelement mit perforierter, spannungsfreier Membran

Also Published As

Publication number Publication date
EP0780675A1 (de) 1997-06-25
JPH09186347A (ja) 1997-07-15
EP0780675B1 (de) 2002-01-30
US5883420A (en) 1999-03-16
DE69618917T2 (de) 2002-06-20

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Free format text: SCHUMACHER & WILLSAU, PATENTANWALTSSOZIETAET, 80335 MUENCHEN

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee