DE69632003D1 - Starre-flexible Leiterplatte mit einer Öffnung für einen isolierten Montierungsbereich - Google Patents

Starre-flexible Leiterplatte mit einer Öffnung für einen isolierten Montierungsbereich

Info

Publication number
DE69632003D1
DE69632003D1 DE69632003T DE69632003T DE69632003D1 DE 69632003 D1 DE69632003 D1 DE 69632003D1 DE 69632003 T DE69632003 T DE 69632003T DE 69632003 T DE69632003 T DE 69632003T DE 69632003 D1 DE69632003 D1 DE 69632003D1
Authority
DE
Germany
Prior art keywords
rigid
opening
circuit board
flexible circuit
mounting area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69632003T
Other languages
English (en)
Other versions
DE69632003T2 (de
Inventor
Steven R Mclaughlin
Christopher J Wieloch
John C Mather
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rockwell Automation Technologies Inc
Original Assignee
Rockwell Automation Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rockwell Automation Technologies Inc filed Critical Rockwell Automation Technologies Inc
Publication of DE69632003D1 publication Critical patent/DE69632003D1/de
Application granted granted Critical
Publication of DE69632003T2 publication Critical patent/DE69632003T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
DE1996632003 1995-09-29 1996-09-25 Starre-flexible Leiterplatte mit einer Öffnung für einen isolierten Montierungsbereich Expired - Lifetime DE69632003T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/537,216 US5616888A (en) 1995-09-29 1995-09-29 Rigid-flex circuit board having a window for an insulated mounting area
US537216 1995-09-29

Publications (2)

Publication Number Publication Date
DE69632003D1 true DE69632003D1 (de) 2004-05-06
DE69632003T2 DE69632003T2 (de) 2004-11-18

Family

ID=24141719

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996632003 Expired - Lifetime DE69632003T2 (de) 1995-09-29 1996-09-25 Starre-flexible Leiterplatte mit einer Öffnung für einen isolierten Montierungsbereich

Country Status (3)

Country Link
US (1) US5616888A (de)
EP (1) EP0766505B1 (de)
DE (1) DE69632003T2 (de)

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US5812375A (en) * 1996-05-06 1998-09-22 Cummins Engine Company, Inc. Electronic assembly for selective heat sinking and two-sided component attachment
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US6462976B1 (en) 1997-02-21 2002-10-08 University Of Arkansas Conversion of electrical energy from one form to another, and its management through multichip module structures
KR100294041B1 (ko) * 1997-02-24 2001-07-12 윤종용 광부품의패키징방법및콜리메이터실장방법
US7144486B1 (en) 1997-04-30 2006-12-05 Board Of Trustees Of The University Of Arkansas Multilayer microcavity devices and methods
US7169272B2 (en) * 1997-04-30 2007-01-30 Board Of Trustees Of The University Of Arkansas Microfabricated recessed disk microelectrodes: characterization in static and convective solutions
KR100268665B1 (ko) * 1997-06-27 2000-10-16 윤종용 휴대용통신단말기의액정표시기(lcd)를인쇄회로기판(pcb)에실장시키는방법및장치
US6147869A (en) * 1997-11-24 2000-11-14 International Rectifier Corp. Adaptable planar module
US6212086B1 (en) * 1998-05-22 2001-04-03 Intel Corporation Packaging of a DC-to-DC converter
JP3602968B2 (ja) * 1998-08-18 2004-12-15 沖電気工業株式会社 半導体装置およびその基板接続構造
US6674163B1 (en) * 1998-08-18 2004-01-06 Oki Electric Industry Co., Ltd. Package structure for a semiconductor device
KR100278609B1 (ko) * 1998-10-08 2001-01-15 윤종용 인쇄회로기판
US6225571B1 (en) * 1999-02-19 2001-05-01 Lucent Technologies Inc. Heatsink with high thermal conductivity dielectric
US7456028B2 (en) 2000-10-16 2008-11-25 Board Of Trustees Of The University Of Arkansas, N.A. Electrochemical method for detecting water born pathogens
US6887714B2 (en) 2000-10-16 2005-05-03 Board Of Trustees Of The University Of Arkansas, N.A. Microvolume immunoabsorbant assays with amplified electrochemical detection
US7348183B2 (en) * 2000-10-16 2008-03-25 Board Of Trustees Of The University Of Arkansas Self-contained microelectrochemical bioassay platforms and methods
JP3817453B2 (ja) * 2001-09-25 2006-09-06 新光電気工業株式会社 半導体装置
JP4492280B2 (ja) * 2004-09-29 2010-06-30 日立電線株式会社 電子部品の実装構造及びそれを用いた光トランシーバ
US8624129B2 (en) * 2006-01-12 2014-01-07 Samsung Electronics Co., Ltd. Method of attaching a high power surface mount transistor to a printed circuit board
US7176707B1 (en) 2006-02-23 2007-02-13 Lockheed Martin Corporation Back side component placement and bonding
US7772501B2 (en) * 2006-04-25 2010-08-10 Molex Incorporated Flexible printed circuit board
KR100754080B1 (ko) 2006-07-13 2007-08-31 삼성전기주식회사 리지드-플렉서블 인쇄회로기판 및 그 제조방법
US7903417B2 (en) * 2006-10-10 2011-03-08 Deere & Company Electrical circuit assembly for high-power electronics
US20080084671A1 (en) * 2006-10-10 2008-04-10 Ronnie Dean Stahlhut Electrical circuit assembly for high-power electronics
US7982135B2 (en) * 2006-10-30 2011-07-19 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
JP5273922B2 (ja) * 2006-12-28 2013-08-28 株式会社アライドマテリアル 放熱部材および半導体装置
US7808788B2 (en) * 2007-06-29 2010-10-05 Delphi Technologies, Inc. Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
TWI377653B (en) * 2009-02-16 2012-11-21 Unimicron Technology Corp Package substrate strucutre with cavity and method for making the same
US8897023B2 (en) * 2009-05-15 2014-11-25 Hamilton Sundstrand Corporation Motor controller assembly with capacitor thermal isolation
TW201127228A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
TW201130405A (en) * 2010-02-23 2011-09-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
US8683681B2 (en) * 2010-12-07 2014-04-01 Raytheon Company Room temperature low contact pressure method
US9393263B2 (en) 2011-06-03 2016-07-19 Allergan, Inc. Dermal filler compositions including antioxidants
KR101443967B1 (ko) * 2012-10-22 2014-09-23 삼성전기주식회사 방열 기판 및 방열 기판 제조 방법
CN103118489B (zh) * 2013-01-24 2015-12-23 宁波舜宇光电信息有限公司 一种下沉式软硬结合板及其制造方法
ITMI20130520A1 (it) * 2013-04-05 2014-10-06 St Microelectronics Srl Realizzazione di un dissipatore di calore tramite saldatura ad onda
US9681583B2 (en) 2013-09-23 2017-06-13 Coriant Operations Inc. Fixation of heat sink on SFP/XFP cage
TWI611740B (zh) * 2015-02-05 2018-01-11 頎邦科技股份有限公司 可撓性基板
CN106793478A (zh) * 2017-03-31 2017-05-31 三禾电器(福建)有限公司 一种带有窗口的电路板
CN112492777B (zh) * 2019-09-12 2022-05-27 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
KR20210074609A (ko) * 2019-12-12 2021-06-22 삼성전기주식회사 인쇄회로기판

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JPH05160540A (ja) * 1991-12-04 1993-06-25 Seiko Epson Corp 回路基板ユニット
JPH05327166A (ja) * 1992-05-26 1993-12-10 Hitachi Ltd 電子部品実装方法
JPH06216492A (ja) * 1993-01-21 1994-08-05 Hitachi Ltd 電子装置
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Also Published As

Publication number Publication date
EP0766505A3 (de) 1998-12-23
EP0766505A2 (de) 1997-04-02
EP0766505B1 (de) 2004-03-31
US5616888A (en) 1997-04-01
DE69632003T2 (de) 2004-11-18

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