DE69628137T2 - Bildsensor mit organischen und inorganischen passivierungsschichten - Google Patents

Bildsensor mit organischen und inorganischen passivierungsschichten Download PDF

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Publication number
DE69628137T2
DE69628137T2 DE69628137T DE69628137T DE69628137T2 DE 69628137 T2 DE69628137 T2 DE 69628137T2 DE 69628137 T DE69628137 T DE 69628137T DE 69628137 T DE69628137 T DE 69628137T DE 69628137 T2 DE69628137 T2 DE 69628137T2
Authority
DE
Germany
Prior art keywords
organic
image sensor
passivation layers
inorganic passivation
inorganic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69628137T
Other languages
English (en)
Other versions
DE69628137D1 (de
Inventor
R Franklin
Carl Glasse
J Powell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE69628137D1 publication Critical patent/DE69628137D1/de
Publication of DE69628137T2 publication Critical patent/DE69628137T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE69628137T 1995-10-13 1996-10-10 Bildsensor mit organischen und inorganischen passivierungsschichten Expired - Lifetime DE69628137T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9520791.6A GB9520791D0 (en) 1995-10-13 1995-10-13 Image sensor
PCT/IB1996/001066 WO1997014186A1 (en) 1995-10-13 1996-10-10 Image sensor comprising organic and inorganic passivation layers

Publications (2)

Publication Number Publication Date
DE69628137D1 DE69628137D1 (de) 2003-06-18
DE69628137T2 true DE69628137T2 (de) 2004-01-15

Family

ID=10782129

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69628137T Expired - Lifetime DE69628137T2 (de) 1995-10-13 1996-10-10 Bildsensor mit organischen und inorganischen passivierungsschichten

Country Status (6)

Country Link
US (1) US6034725A (de)
EP (1) EP0797845B1 (de)
JP (1) JPH10511817A (de)
DE (1) DE69628137T2 (de)
GB (1) GB9520791D0 (de)
WO (1) WO1997014186A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4035194B2 (ja) 1996-03-13 2008-01-16 キヤノン株式会社 Ｘ線検出装置及びｘ線検出システム
JPH11307756A (ja) 1998-02-20 1999-11-05 Canon Inc 光電変換装置および放射線読取装置
JPH11331703A (ja) * 1998-03-20 1999-11-30 Toshiba Corp 撮像装置
DE19927694C1 (de) * 1999-06-17 2000-11-02 Lutz Fink Halbleitersensor mit einer Pixelstruktur
US20020121605A1 (en) * 1999-06-17 2002-09-05 Lutz Fink Semiconductor sensor and method for its wiring
US6300648B1 (en) * 1999-12-28 2001-10-09 Xerox Corporation Continuous amorphous silicon layer sensors using sealed metal back contact
US6288435B1 (en) * 1999-12-28 2001-09-11 Xerox Corporation Continuous amorphous silicon layer sensors using doped poly-silicon back contact
TW451447B (en) * 1999-12-31 2001-08-21 Samsung Electronics Co Ltd Contact structures of wirings and methods for manufacturing the same, and thin film transistor array panels including the same and methods for manufacturing the same
US6946717B2 (en) * 2001-01-30 2005-09-20 M/A-Com, Inc. High voltage semiconductor device
US6607951B2 (en) * 2001-06-26 2003-08-19 United Microelectronics Corp. Method for fabricating a CMOS image sensor
US6737626B1 (en) * 2001-08-06 2004-05-18 Pixim, Inc. Image sensors with underlying and lateral insulator structures
FR2849272B1 (fr) * 2002-12-19 2005-11-18 Commissariat Energie Atomique Dispositif de detection photo-electrique et notamment de rayonnement x ou y
CN101166996B (zh) * 2005-02-28 2013-04-17 先进燃料研究股份有限公司 用于辐射检测的装置和方法
JP2007101256A (ja) * 2005-09-30 2007-04-19 Fujifilm Corp Ｘ線撮像装置及びｘ線ｃｔ装置
JP5489542B2 (ja) 2008-07-01 2014-05-14 キヤノン株式会社 放射線検出装置及び放射線撮像システム
TWI424574B (zh) * 2009-07-28 2014-01-21 Prime View Int Co Ltd 數位ｘ光探測面板及其製作方法
KR101955336B1 (ko) * 2012-03-13 2019-03-07 삼성전자주식회사 광 센싱 트랜지스터, 이의 제조방법 및 이를 채용한 디스플레이 패널
US9520424B2 (en) * 2012-10-29 2016-12-13 Taiwan Semiconductor Manufacturing Company Limited Black level correction (BLC) structure
US9881954B2 (en) * 2014-06-11 2018-01-30 Semiconductor Energy Laboratory Co., Ltd. Imaging device
US10330799B2 (en) 2014-06-30 2019-06-25 Sharp Kabushiki Kaisha X-ray image pickup system
CN105914216B (zh) * 2016-05-05 2019-01-18 上海集成电路研发中心有限公司 一种图像传感器结构及其制作方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045057A (ja) * 1983-08-23 1985-03-11 Toshiba Corp 固体撮像装置の製造方法
JPS6218755A (ja) * 1985-07-18 1987-01-27 Toshiba Corp 固体撮像装置
JPH0785568B2 (ja) * 1989-04-05 1995-09-13 富士ゼロックス株式会社 密着型イメージセンサ装置
NL9100337A (nl) * 1991-02-26 1992-09-16 Philips Nv Halfgeleiderinrichting.
JPH04317373A (ja) * 1991-04-16 1992-11-09 Semiconductor Energy Lab Co Ltd 密着型イメージセンサ
JPH04317372A (ja) * 1991-04-17 1992-11-09 Nec Corp 半導体記憶装置
US5254480A (en) * 1992-02-20 1993-10-19 Minnesota Mining And Manufacturing Company Process for producing a large area solid state radiation detector
US5233181A (en) * 1992-06-01 1993-08-03 General Electric Company Photosensitive element with two layer passivation coating
DE4227096A1 (de) * 1992-08-17 1994-02-24 Philips Patentverwaltung Röntgenbilddetektor
US5399884A (en) * 1993-11-10 1995-03-21 General Electric Company Radiation imager with single passivation dielectric for transistor and diode
US5619033A (en) * 1995-06-07 1997-04-08 Xerox Corporation Layered solid state photodiode sensor array
US5859463A (en) * 1996-12-23 1999-01-12 General Electric Company Photosensitive imager contact pad structure

Also Published As

Publication number Publication date
EP0797845B1 (de) 2003-05-14
GB9520791D0 (en) 1995-12-13
US6034725A (en) 2000-03-07
DE69628137D1 (de) 2003-06-18
JPH10511817A (ja) 1998-11-10
WO1997014186A1 (en) 1997-04-17
EP0797845A1 (de) 1997-10-01

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