DE69624305D1 - Halbleiteranordnung mit einem ligbt element - Google Patents

Halbleiteranordnung mit einem ligbt element

Info

Publication number
DE69624305D1
DE69624305D1 DE69624305T DE69624305T DE69624305D1 DE 69624305 D1 DE69624305 D1 DE 69624305D1 DE 69624305 T DE69624305 T DE 69624305T DE 69624305 T DE69624305 T DE 69624305T DE 69624305 D1 DE69624305 D1 DE 69624305D1
Authority
DE
Germany
Prior art keywords
ligbt
semiconductor arrangement
semiconductor
arrangement
ligbt element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69624305T
Other languages
English (en)
Other versions
DE69624305T2 (de
Inventor
Willem Ludikhuize
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE69624305D1 publication Critical patent/DE69624305D1/de
Publication of DE69624305T2 publication Critical patent/DE69624305T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0692Surface layout
    • H01L29/0696Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1095Body region, i.e. base region, of DMOS transistors or IGBTs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
DE69624305T 1995-03-23 1996-03-11 Halbleiteranordnung mit einem ligbt element Expired - Fee Related DE69624305T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95200726 1995-03-23
PCT/IB1996/000192 WO1996029741A2 (en) 1995-03-23 1996-03-11 Semiconductor device provided with an ligbt element

Publications (2)

Publication Number Publication Date
DE69624305D1 true DE69624305D1 (de) 2002-11-21
DE69624305T2 DE69624305T2 (de) 2003-06-26

Family

ID=8220121

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69624305T Expired - Fee Related DE69624305T2 (de) 1995-03-23 1996-03-11 Halbleiteranordnung mit einem ligbt element

Country Status (6)

Country Link
US (1) US5796146A (de)
EP (1) EP0761016B1 (de)
JP (1) JPH10501103A (de)
DE (1) DE69624305T2 (de)
TW (1) TW298665B (de)
WO (1) WO1996029741A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000029449A (ko) * 1997-05-23 2000-05-25 롤페스 요하네스 게라투스 알베르투스 측방향엠오에스트랜지스터소자
US6144070A (en) * 1997-08-29 2000-11-07 Texas Instruments Incorporated High breakdown-voltage transistor with electrostatic discharge protection
US6252278B1 (en) * 1998-05-18 2001-06-26 Monolithic Power Systems, Inc. Self-aligned lateral DMOS with spacer drift region
US6028337A (en) * 1998-11-06 2000-02-22 Philips North America Corporation Lateral thin-film silicon-on-insulator (SOI) device having lateral depletion means for depleting a portion of drift region
DE102004041622A1 (de) * 2003-08-29 2005-03-24 Fuji Electric Holdings Co. Ltd., Kawasaki Halbleiterbauteil
WO2005093842A1 (ja) * 2004-03-26 2005-10-06 Sanken Electric Co., Ltd. 半導体装置
JP2007049061A (ja) * 2005-08-12 2007-02-22 Toshiba Corp 半導体装置
US7763937B2 (en) * 2006-11-15 2010-07-27 Freescale Semiconductor, Inc. Variable resurf semiconductor device and method
US8669640B2 (en) * 2009-07-14 2014-03-11 Freescale Semiconductor, Inc. Bipolar transistor
JP2011100847A (ja) * 2009-11-05 2011-05-19 Sharp Corp 半導体装置及びその製造方法
JP6455169B2 (ja) * 2015-01-19 2019-01-23 株式会社豊田中央研究所 半導体装置
JP6837384B2 (ja) * 2017-05-23 2021-03-03 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN109994546B (zh) * 2017-12-29 2022-05-27 中芯国际集成电路制造(上海)有限公司 一种横向双扩散金属氧化物半导体器件、电子装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4682195A (en) * 1985-09-30 1987-07-21 General Electric Company Insulated gate device with configured emitter contact pad
US4963951A (en) * 1985-11-29 1990-10-16 General Electric Company Lateral insulated gate bipolar transistors with improved latch-up immunity
EP0361589B1 (de) * 1988-09-22 2001-12-19 Koninklijke Philips Electronics N.V. Laterale bipolare Transistoranordnungen mit isolierter Steuerelektrode mit geteilter Anode
JP2650519B2 (ja) * 1991-07-25 1997-09-03 株式会社日立製作所 横型絶縁ゲートトランジスタ
US5227653A (en) * 1991-08-07 1993-07-13 North American Philips Corp. Lateral trench-gate bipolar transistors

Also Published As

Publication number Publication date
EP0761016B1 (de) 2002-10-16
DE69624305T2 (de) 2003-06-26
TW298665B (de) 1997-02-21
JPH10501103A (ja) 1998-01-27
EP0761016A1 (de) 1997-03-12
WO1996029741A2 (en) 1996-09-26
WO1996029741A3 (en) 1997-01-03
US5796146A (en) 1998-08-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee