DE69618264D1 - Verbesserungen bei der Herstellung von Kristallsubstraten - Google Patents

Verbesserungen bei der Herstellung von Kristallsubstraten

Info

Publication number
DE69618264D1
DE69618264D1 DE69618264T DE69618264T DE69618264D1 DE 69618264 D1 DE69618264 D1 DE 69618264D1 DE 69618264 T DE69618264 T DE 69618264T DE 69618264 T DE69618264 T DE 69618264T DE 69618264 D1 DE69618264 D1 DE 69618264D1
Authority
DE
Germany
Prior art keywords
manufacture
crystal substrates
substrates
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69618264T
Other languages
English (en)
Other versions
DE69618264T2 (de
Inventor
Peter John Ayliffe
Paul Mark Harrison
Martine Christopher Geear
James Wilson Parker
Robert George Peall
Roger William Harcourt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Nortel Networks Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nortel Networks Ltd filed Critical Nortel Networks Ltd
Publication of DE69618264D1 publication Critical patent/DE69618264D1/de
Application granted granted Critical
Publication of DE69618264T2 publication Critical patent/DE69618264T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147Semiconductor insulating substrates
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Weting (AREA)
  • Element Separation (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Light Receiving Elements (AREA)
DE69618264T 1995-03-11 1996-02-29 Verbesserungen bei der Herstellung von Kristallsubstraten Expired - Fee Related DE69618264T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9505001A GB2298956B (en) 1995-03-11 1995-03-11 Improvements in crystal substrate processing

Publications (2)

Publication Number Publication Date
DE69618264D1 true DE69618264D1 (de) 2002-02-07
DE69618264T2 DE69618264T2 (de) 2002-09-19

Family

ID=10771100

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69618264T Expired - Fee Related DE69618264T2 (de) 1995-03-11 1996-02-29 Verbesserungen bei der Herstellung von Kristallsubstraten

Country Status (5)

Country Link
US (1) US5933707A (de)
EP (1) EP0732739B1 (de)
JP (1) JPH08277200A (de)
DE (1) DE69618264T2 (de)
GB (1) GB2298956B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19743289C2 (de) * 1997-09-30 2000-02-17 Siemens Ag Mehrebenen-Zwischenträgersubstrat mit hoher Verdrahtungsdichte, insbesondere für Multichipmodule, und Verfahren zu seiner Herstellung
US6645790B2 (en) * 2001-01-03 2003-11-11 Anadigics, Inc. System and method for prototyping and fabricating complex microwave circuits
EP1327899A1 (de) * 2002-01-07 2003-07-16 Alcatel Eine Methode zur Herstellung eines optischen Moduls und ein optisches Modul
EP1376174A1 (de) * 2002-06-19 2004-01-02 Avanex Corporation Optisches Modul und zugehöriges Herstellungsverfahren
US20110189714A1 (en) * 2010-02-03 2011-08-04 Ayliffe Harold E Microfluidic cell sorter and method
US9452429B2 (en) 2006-02-02 2016-09-27 E. I. Spectra, Llc Method for mutiplexed microfluidic bead-based immunoassay
US9293311B1 (en) 2006-02-02 2016-03-22 E. I. Spectra, Llc Microfluidic interrogation device
US7520164B1 (en) * 2006-05-05 2009-04-21 E.I. Spectra, Llc Thin film particle sensor
US8171778B2 (en) * 2006-05-05 2012-05-08 E I Spectra, LLC Thin film particle sensor
US8616048B2 (en) * 2006-02-02 2013-12-31 E I Spectra, LLC Reusable thin film particle sensor
US20100057508A1 (en) * 2008-09-02 2010-03-04 Microsoft Corporation Structured implementation of business functionality changes
DE102009026550A1 (de) * 2009-05-28 2010-12-02 Robert Bosch Gmbh Integrierter Schaltkreis mit einer Antennenanordnung
US8804105B2 (en) 2012-03-27 2014-08-12 E. I. Spectra, Llc Combined optical imaging and electrical detection to characterize particles carried in a fluid

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0834264B2 (ja) * 1987-04-21 1996-03-29 住友電気工業株式会社 半導体装置およびその製造方法
US4826272A (en) * 1987-08-27 1989-05-02 American Telephone And Telegraph Company At&T Bell Laboratories Means for coupling an optical fiber to an opto-electronic device
FR2667443A1 (fr) * 1990-09-28 1992-04-03 Thomson Csf Procede de realisation d'un module hybride.
US5302547A (en) * 1993-02-08 1994-04-12 General Electric Company Systems for patterning dielectrics by laser ablation
GB2279804A (en) * 1993-07-02 1995-01-11 Plessey Semiconductors Ltd Insulating layers for multilayer wiring

Also Published As

Publication number Publication date
GB9505001D0 (en) 1995-04-26
US5933707A (en) 1999-08-03
DE69618264T2 (de) 2002-09-19
JPH08277200A (ja) 1996-10-22
GB2298956B (en) 1999-05-19
GB2298956A (en) 1996-09-18
EP0732739A1 (de) 1996-09-18
EP0732739B1 (de) 2002-01-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee