DE69607637D1 - 4,4'-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenol mit niediegem gehalt an metallionen und damit hergestellten photoresistszusammensetzungen - Google Patents
4,4'-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenol mit niediegem gehalt an metallionen und damit hergestellten photoresistszusammensetzungenInfo
- Publication number
- DE69607637D1 DE69607637D1 DE69607637T DE69607637T DE69607637D1 DE 69607637 D1 DE69607637 D1 DE 69607637D1 DE 69607637 T DE69607637 T DE 69607637T DE 69607637 T DE69607637 T DE 69607637T DE 69607637 D1 DE69607637 D1 DE 69607637D1
- Authority
- DE
- Germany
- Prior art keywords
- photoresis
- ethylidene
- methylethyl
- hydroxyphenyl
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C29/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring
- C07C29/74—Separation; Purification; Use of additives, e.g. for stabilisation
- C07C29/76—Separation; Purification; Use of additives, e.g. for stabilisation by physical treatment
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
- C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
- C07C39/15—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/535,701 US5656413A (en) | 1995-09-28 | 1995-09-28 | Low metal ion containing 4,4'-[1-[4-[1-(4-Hydroxyphenyl)-1-methylethyl]phenyl]ethylidene]bisphe nol and photoresist compositions therefrom |
PCT/US1996/015432 WO1997011929A1 (en) | 1995-09-28 | 1996-09-25 | Low metal ion containing 4,4'-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenol and photoresist compositions therefrom |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69607637D1 true DE69607637D1 (de) | 2000-05-11 |
DE69607637T2 DE69607637T2 (de) | 2000-11-16 |
Family
ID=24135403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69607637T Expired - Lifetime DE69607637T2 (de) | 1995-09-28 | 1996-09-25 | 4,4'-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenol mit niediegem gehalt an metallionen und damit hergestellten photoresistszusammensetzungen |
Country Status (7)
Country | Link |
---|---|
US (1) | US5656413A (de) |
EP (1) | EP0854850B1 (de) |
JP (1) | JP3895776B2 (de) |
KR (1) | KR100421270B1 (de) |
CN (3) | CN1092176C (de) |
DE (1) | DE69607637T2 (de) |
WO (1) | WO1997011929A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5830990A (en) * | 1992-07-10 | 1998-11-03 | Clariant Finance (Bvi) Limited | Low metals perfluorooctanoic acid and top anti-reflective coatings for photoresists |
US5837417A (en) * | 1994-12-30 | 1998-11-17 | Clariant Finance (Bvi) Limited | Quinone diazide compositions containing low metals p-cresol oligomers and process of producing the composition |
US5750031A (en) * | 1995-09-26 | 1998-05-12 | Clariant Finance (Bvi) Limited | Process for producing surfactant having a low metal ion level and developer produced therefrom |
US5962183A (en) * | 1995-11-27 | 1999-10-05 | Clariant Finance (Bvi) Limited | Metal ion reduction in photoresist compositions by chelating ion exchange resin |
US5853954A (en) * | 1996-12-18 | 1998-12-29 | Clariant Finance (Bvi) Limited | Fractionated novolak resin and photoresist composition therefrom |
US5936071A (en) * | 1998-02-02 | 1999-08-10 | Clariant Finance (Bvi) Limited | Process for making a photoactive compound and photoresist therefrom |
US6610465B2 (en) * | 2001-04-11 | 2003-08-26 | Clariant Finance (Bvi) Limited | Process for producing film forming resins for photoresist compositions |
JP2005075767A (ja) * | 2003-08-29 | 2005-03-24 | Idemitsu Kosan Co Ltd | フォトレジスト基材及びその精製方法、並びにフォトレジスト組成物 |
CN100503666C (zh) * | 2003-12-22 | 2009-06-24 | 狮王株式会社 | 超支化聚合物及其制造方法、以及含有该超支化聚合物的抗蚀剂组合物 |
WO2005097725A1 (ja) * | 2004-04-05 | 2005-10-20 | Idemitsu Kosan Co., Ltd. | カリックスレゾルシナレン化合物、フォトレジスト基材及びその組成物 |
US20060131240A1 (en) * | 2004-12-16 | 2006-06-22 | Romano Andrew R | Process for treating solvents |
US8647590B2 (en) * | 2006-03-16 | 2014-02-11 | Agilent Technologies, Inc. | Optical detection cell with micro-fluidic chip |
KR101392291B1 (ko) | 2007-04-13 | 2014-05-07 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 및 이를 이용한 박막트랜지스터기판의 제조방법 |
JP5541766B2 (ja) * | 2009-05-19 | 2014-07-09 | 株式会社ダイセル | フォトレジスト用高分子化合物の製造方法 |
JP5905207B2 (ja) | 2011-04-21 | 2016-04-20 | 丸善石油化学株式会社 | 金属不純物量の少ない半導体リソグラフィー用共重合体の製造方法及び該共重合体を製造するための重合開始剤の精製方法 |
WO2017038968A1 (ja) * | 2015-09-04 | 2017-03-09 | 三菱瓦斯化学株式会社 | 化合物の精製方法 |
JP6931198B2 (ja) * | 2015-09-04 | 2021-09-01 | 三菱瓦斯化学株式会社 | 化合物の精製方法 |
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US2929808A (en) * | 1956-04-04 | 1960-03-22 | Exxon Research Engineering Co | Removal of metal contaminants in polymerization processes |
US4033909A (en) * | 1974-08-13 | 1977-07-05 | Union Carbide Corporation | Stable phenolic resoles |
US4033910A (en) * | 1975-09-26 | 1977-07-05 | Union Carbide Corporation | Methyl formate as an adjuvant in phenolic foam formation |
GB1509354A (en) * | 1976-04-24 | 1978-05-04 | Maruzen Oil Co Ltd | Process for purifying halogenated alkenyl-phenol polymers |
US4250031A (en) * | 1977-03-01 | 1981-02-10 | Unitika Ltd. | Phenolic chelate resin and method of adsorption treatment |
US4195138A (en) * | 1978-06-26 | 1980-03-25 | The Dow Chemical Company | Chelate resins prepared from the cured reaction product of a polyalkylenepolyamine and epoxide |
US4452883A (en) * | 1983-05-17 | 1984-06-05 | Minnesota Mining And Manufacturing Company | Barrier resin for photothermographic color separation |
US4584261A (en) * | 1984-07-27 | 1986-04-22 | E. I. Du Pont De Nemours And Company | Process for etching nonphotosensitive layer under washoff photopolymer layer |
US4567130A (en) * | 1984-07-27 | 1986-01-28 | E. I. Du Pont De Nemours And Company | Process for etching single photopolymer layer utilizing chemically soluble pigments |
JPH063549B2 (ja) * | 1984-12-25 | 1994-01-12 | 株式会社東芝 | ポジ型フォトレジスト現像液組成物 |
US4636540A (en) * | 1985-07-08 | 1987-01-13 | Atlantic Richfield Company | Purification of polymer solutions |
JPS6232453A (ja) * | 1985-08-06 | 1987-02-12 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト用現像液 |
US4784937A (en) * | 1985-08-06 | 1988-11-15 | Tokyo Ohka Kogyo Co., Ltd. | Developing solution for positive-working photoresist comprising a metal ion free organic base and an anionic surfactant |
US4747954A (en) * | 1985-09-16 | 1988-05-31 | The Dow Chemical Company | Removal of metals from solutions |
US4721665A (en) * | 1986-09-29 | 1988-01-26 | Polychrome Corporation | Method for neutralizing acidic novolak resin in a lithographic coating composition |
JPS6472155A (en) * | 1987-09-12 | 1989-03-17 | Tama Kagaku Kogyo Kk | Developing solution for positive type photoresist |
GB8729510D0 (en) * | 1987-12-18 | 1988-02-03 | Ucb Sa | Photosensitive compositions containing phenolic resins & diazoquinone compounds |
JPH01228560A (ja) * | 1988-03-08 | 1989-09-12 | Hitachi Chem Co Ltd | 不純金属成分の低減された溶液の製造法 |
WO1990001726A1 (en) * | 1988-08-10 | 1990-02-22 | Macdermid, Incorporated | Light-sensitive novolac resins |
US5212044A (en) * | 1988-09-08 | 1993-05-18 | The Mead Corporation | Photoresist composition including polyphenol and sensitizer |
US5175078A (en) * | 1988-10-20 | 1992-12-29 | Mitsubishi Gas Chemical Company, Inc. | Positive type photoresist developer |
JPH03128903A (ja) * | 1989-07-13 | 1991-05-31 | Fine Kurei:Kk | 合成樹脂の改質方法および改質合成樹脂 |
DE3923426A1 (de) * | 1989-07-15 | 1991-01-17 | Hoechst Ag | Verfahren zur herstellung von novolak-harzen mit geringem metallionengehalt |
JPH061377B2 (ja) * | 1989-12-28 | 1994-01-05 | 日本ゼオン株式会社 | ポジ型レジスト組成物 |
JPH0465415A (ja) * | 1990-07-04 | 1992-03-02 | Hitachi Chem Co Ltd | 不純金属成分の低減されたノボラツク樹脂の製造法 |
US5446125A (en) * | 1991-04-01 | 1995-08-29 | Ocg Microelectronic Materials, Inc. | Method for removing metal impurities from resist components |
US5378802A (en) * | 1991-09-03 | 1995-01-03 | Ocg Microelectronic Materials, Inc. | Method for removing impurities from resist components and novolak resins |
JPH0768296B2 (ja) * | 1991-11-28 | 1995-07-26 | 丸善石油化学株式会社 | ビニルフェノール系重合体の金属除去方法 |
JPH0768297B2 (ja) * | 1991-11-28 | 1995-07-26 | 丸善石油化学株式会社 | フォトレジスト用ビニルフェノール系重合体の精製方法 |
JP3630422B2 (ja) * | 1991-12-18 | 2005-03-16 | クラリアント・ファイナンス・(ビーブイアイ)・リミテッド | ノボラック樹脂中の金属イオンの低減 |
DE69320468T2 (de) * | 1992-03-06 | 1999-04-22 | Clariant Finance (Bvi) Ltd., Road Town, Tortola | Photoresists mit einem niedrigem grad metallionen |
US5300628A (en) * | 1992-06-29 | 1994-04-05 | Ocg Microelectronic Materials, Inc. | Selected chelate resins and their use to remove multivalent metal impurities from resist components |
SG52770A1 (en) * | 1992-07-10 | 1998-09-28 | Hoechst Celanese Corp | Metal ion reduction in top anti-reflective coatings for photoresists |
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WO1994012912A1 (en) * | 1992-11-25 | 1994-06-09 | Hoechst Celanese Corporation | Metal ion reduction in bottom anti-reflective coatings for photoresists |
US5476750A (en) * | 1992-12-29 | 1995-12-19 | Hoechst Celanese Corporation | Metal ion reduction in the raw materials and using a Lewis base to control molecular weight of novolak resin to be used in positive photoresists |
US5286606A (en) * | 1992-12-29 | 1994-02-15 | Hoechst Celanese Corporation | Process for producing a developer having a low metal ion level |
WO1994014858A1 (en) * | 1992-12-29 | 1994-07-07 | Hoechst Celanese Corporation | Metal ion reduction in polyhydroxystyrene and photoresists |
US5472616A (en) * | 1993-10-27 | 1995-12-05 | Shipley Company, Inc. | Modified anion exchange process |
US5350714A (en) * | 1993-11-08 | 1994-09-27 | Shipley Company Inc. | Point-of-use purification |
US5500127A (en) * | 1994-03-14 | 1996-03-19 | Rohm And Haas Company | Purification process |
WO1996012214A1 (en) * | 1994-10-12 | 1996-04-25 | Hoechst Celanese Corporation | Low metal ion photoactive compounds and photoresists compositions produced therefrom |
US5837417A (en) * | 1994-12-30 | 1998-11-17 | Clariant Finance (Bvi) Limited | Quinone diazide compositions containing low metals p-cresol oligomers and process of producing the composition |
US5521052A (en) * | 1994-12-30 | 1996-05-28 | Hoechst Celanese Corporation | Metal ion reduction in novolak resin using an ion exchange catalyst in a polar solvent and photoresists compositions therefrom |
US5614352A (en) * | 1994-12-30 | 1997-03-25 | Hoechst Celanese Corporation | Metal ion reduction in novolak resins solution in PGMEA by chelating ion exchange resin |
-
1995
- 1995-09-28 US US08/535,701 patent/US5656413A/en not_active Expired - Lifetime
-
1996
- 1996-09-25 CN CN96197304A patent/CN1092176C/zh not_active Expired - Lifetime
- 1996-09-25 WO PCT/US1996/015432 patent/WO1997011929A1/en active IP Right Grant
- 1996-09-25 CN CNB011109858A patent/CN1175319C/zh not_active Expired - Lifetime
- 1996-09-25 EP EP96935977A patent/EP0854850B1/de not_active Expired - Lifetime
- 1996-09-25 KR KR10-1998-0702154A patent/KR100421270B1/ko not_active IP Right Cessation
- 1996-09-25 JP JP51362797A patent/JP3895776B2/ja not_active Expired - Lifetime
- 1996-09-25 DE DE69607637T patent/DE69607637T2/de not_active Expired - Lifetime
-
2001
- 2001-03-09 CN CNB011109866A patent/CN1176404C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100421270B1 (ko) | 2004-06-23 |
CN1312486A (zh) | 2001-09-12 |
CN1175319C (zh) | 2004-11-10 |
EP0854850A1 (de) | 1998-07-29 |
KR19990063688A (ko) | 1999-07-26 |
EP0854850B1 (de) | 2000-04-05 |
JPH11512713A (ja) | 1999-11-02 |
CN1176404C (zh) | 2004-11-17 |
CN1198149A (zh) | 1998-11-04 |
CN1092176C (zh) | 2002-10-09 |
JP3895776B2 (ja) | 2007-03-22 |
DE69607637T2 (de) | 2000-11-16 |
WO1997011929A1 (en) | 1997-04-03 |
US5656413A (en) | 1997-08-12 |
CN1312487A (zh) | 2001-09-12 |
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