DE69602996T2 - Temperaturgeregelter Halbleiterlasergerät und Temperaturregelungsverfahren - Google Patents

Temperaturgeregelter Halbleiterlasergerät und Temperaturregelungsverfahren

Info

Publication number
DE69602996T2
DE69602996T2 DE69602996T DE69602996T DE69602996T2 DE 69602996 T2 DE69602996 T2 DE 69602996T2 DE 69602996 T DE69602996 T DE 69602996T DE 69602996 T DE69602996 T DE 69602996T DE 69602996 T2 DE69602996 T2 DE 69602996T2
Authority
DE
Germany
Prior art keywords
control method
semiconductor laser
laser device
temperature
controlled semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69602996T
Other languages
English (en)
Other versions
DE69602996D1 (de
Inventor
Kazuyoshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69602996D1 publication Critical patent/DE69602996D1/de
Application granted granted Critical
Publication of DE69602996T2 publication Critical patent/DE69602996T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
DE69602996T 1995-08-18 1996-08-09 Temperaturgeregelter Halbleiterlasergerät und Temperaturregelungsverfahren Expired - Fee Related DE69602996T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7210888A JP2697700B2 (ja) 1995-08-18 1995-08-18 温度制御型半導体レーザ装置およびその温度制御方法

Publications (2)

Publication Number Publication Date
DE69602996D1 DE69602996D1 (de) 1999-07-29
DE69602996T2 true DE69602996T2 (de) 2000-02-24

Family

ID=16596760

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69602996T Expired - Fee Related DE69602996T2 (de) 1995-08-18 1996-08-09 Temperaturgeregelter Halbleiterlasergerät und Temperaturregelungsverfahren

Country Status (4)

Country Link
US (1) US5875204A (de)
EP (1) EP0762567B1 (de)
JP (1) JP2697700B2 (de)
DE (1) DE69602996T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121871A (ja) * 1997-10-15 1999-04-30 Fujitsu Ltd ペルチェ素子を有するモジュール
JP2000022263A (ja) * 1998-06-29 2000-01-21 Murata Mfg Co Ltd 半導体レーザ駆動回路および半導体レーザ装置
JP3470614B2 (ja) * 1998-09-30 2003-11-25 住友電気工業株式会社 発光素子モジュール
US6385222B1 (en) 1998-11-19 2002-05-07 The Furukawa Electric Co., Ltd. Semiconductor laser module, and method for driving the semiconductor laser module
US6301279B1 (en) * 1999-04-16 2001-10-09 Princeton Lightwave Inc. Semiconductor diode lasers with thermal sensor control of the active region temperature
EP1089406A4 (de) 1999-04-20 2005-11-02 Furukawa Electric Co Ltd Halbleiterlasermodul
US6996145B2 (en) 1999-11-01 2006-02-07 The Furukawa Electric Co., Ltd. Semiconductor laser module, and method for driving the semiconductor laser module
EP1168537A1 (de) * 2000-06-22 2002-01-02 The Furukawa Electric Co., Ltd. Halbleiterlasermodul und Verfahren zur Ansteuerung eines Halbleiterlasermodules
US6546030B2 (en) * 2000-06-29 2003-04-08 Fuji Photo Film Co., Ltd. Semiconductor laser unit employing an inorganic adhesive
DE10117020C2 (de) * 2001-04-05 2003-05-08 Unique M O D E Ag Optisches oder optoelektronisches Modul
DE102004047682A1 (de) * 2004-09-30 2006-04-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH LED-Array
DE102009003936B4 (de) * 2009-01-05 2011-02-24 Siemens Aktiengesellschaft Licht emittierendes Bauelement mit einer Konverterkeramik und einer Kühleinrichtung
CN103606546B (zh) * 2013-11-28 2017-06-20 华为技术有限公司 光器件
CN104836619B (zh) 2015-03-30 2017-08-29 青岛海信宽带多媒体技术有限公司 一种光器件
CN104767103B (zh) 2015-03-30 2017-12-19 青岛海信宽带多媒体技术有限公司 一种激光器用连接结构及激光器组件
CN110625256B (zh) * 2019-10-18 2021-06-15 中南大学 蝶形激光器光纤耦合与焊接装置
CN111551519A (zh) * 2020-05-19 2020-08-18 武汉奥博奥科技有限公司 一种氧气检测垂直腔面发射激光器
CN115692218A (zh) * 2021-07-21 2023-02-03 华为技术有限公司 一种光发射组件、光发射组件的封装方法和相关设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59152681A (ja) * 1983-02-21 1984-08-31 Hitachi Ltd 光通信装置
JPH0728077B2 (ja) * 1986-04-16 1995-03-29 株式会社トプコン 半導体レ−ザ−の発振周波数・発振出力安定化装置
JPH01122183A (ja) * 1987-11-06 1989-05-15 Hitachi Ltd 半導体レーザ装置
US5068865A (en) * 1988-06-09 1991-11-26 Nec Corporation Semiconductor laser module
US5216544A (en) * 1988-08-26 1993-06-01 Fuji Photo Film Co., Ltd. Beam-combining laser beam source device
JP3035852B2 (ja) * 1990-07-18 2000-04-24 富士通株式会社 半導体レーザモジュール
JPH04112591A (ja) * 1990-09-03 1992-04-14 Fujitsu Ltd 半導体レーザモジュール
US5266803A (en) * 1991-03-03 1993-11-30 Bio-Rad Labratories, Inc. Fiber optic storage phosphor imaging plate scanner
US5399877A (en) * 1991-06-03 1995-03-21 The United States Of America As Represented By The Administrator Of The National Aeronautice And Space Administration Radiation sensitive area detection device and method
US5267252A (en) * 1991-08-30 1993-11-30 Hoya Corporation Solid-state laser device comprising a temperature-controlled thermal conductive support
US5181214A (en) * 1991-11-18 1993-01-19 Harmonic Lightwaves, Inc. Temperature stable solid-state laser package
AU659270B2 (en) * 1992-02-20 1995-05-11 Sony Corporation Laser light beam generating apparatus
JPH07142803A (ja) * 1993-11-12 1995-06-02 Fuji Photo Film Co Ltd レーザーダイオードポンピング固体レーザー

Also Published As

Publication number Publication date
DE69602996D1 (de) 1999-07-29
JP2697700B2 (ja) 1998-01-14
JPH0964450A (ja) 1997-03-07
EP0762567A1 (de) 1997-03-12
US5875204A (en) 1999-02-23
EP0762567B1 (de) 1999-06-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee