DE69529582T2 - Passive Ausrichtung von opto-elektronischen Baugruppen und optischen Wellenleitern mittels "Flip-Chip" Bondtechnik - Google Patents
Passive Ausrichtung von opto-elektronischen Baugruppen und optischen Wellenleitern mittels "Flip-Chip" BondtechnikInfo
- Publication number
- DE69529582T2 DE69529582T2 DE69529582T DE69529582T DE69529582T2 DE 69529582 T2 DE69529582 T2 DE 69529582T2 DE 69529582 T DE69529582 T DE 69529582T DE 69529582 T DE69529582 T DE 69529582T DE 69529582 T2 DE69529582 T2 DE 69529582T2
- Authority
- DE
- Germany
- Prior art keywords
- opto
- flip
- chip
- optical waveguides
- bonding technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/299,176 US5499312A (en) | 1993-11-09 | 1994-08-31 | Passive alignment and packaging of optoelectronic components to optical waveguides using flip-chip bonding technology |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69529582D1 DE69529582D1 (de) | 2003-03-13 |
DE69529582T2 true DE69529582T2 (de) | 2003-12-11 |
Family
ID=23153625
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69529582T Expired - Fee Related DE69529582T2 (de) | 1994-08-31 | 1995-07-11 | Passive Ausrichtung von opto-elektronischen Baugruppen und optischen Wellenleitern mittels "Flip-Chip" Bondtechnik |
DE69526891T Expired - Fee Related DE69526891T2 (de) | 1994-08-31 | 1995-07-11 | Passive Ausrichtung von opto-elektronischen Baugruppen und optischen Wellenleitern mittels "Flip-Chip"-Bondtechnik |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69526891T Expired - Fee Related DE69526891T2 (de) | 1994-08-31 | 1995-07-11 | Passive Ausrichtung von opto-elektronischen Baugruppen und optischen Wellenleitern mittels "Flip-Chip"-Bondtechnik |
Country Status (4)
Country | Link |
---|---|
US (1) | US5499312A (de) |
EP (2) | EP1120673B1 (de) |
JP (1) | JP3720877B2 (de) |
DE (2) | DE69529582T2 (de) |
Families Citing this family (82)
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US5846694A (en) * | 1996-02-13 | 1998-12-08 | The Regents Of The University Of California | Microminiature optical waveguide structure and method for fabrication |
US5774614A (en) * | 1996-07-16 | 1998-06-30 | Gilliland; Patrick B. | Optoelectronic coupling and method of making same |
US8153957B2 (en) * | 1996-09-27 | 2012-04-10 | Digitaloptics Corporation East | Integrated optical imaging systems including an interior space between opposing substrates and associated methods |
US5912872A (en) | 1996-09-27 | 1999-06-15 | Digital Optics Corporation | Integrated optical apparatus providing separated beams on a detector and associated methods |
US20080136955A1 (en) * | 1996-09-27 | 2008-06-12 | Tessera North America. | Integrated camera and associated methods |
US5886971A (en) * | 1996-09-27 | 1999-03-23 | Digital Optics Corporation | Optical head structures including support substrates adjacent transparent substrates and related methods |
US5771218A (en) * | 1996-09-27 | 1998-06-23 | Digital Optics Corporation | Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same |
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DE19709842C1 (de) * | 1997-02-28 | 1998-10-15 | Siemens Ag | Elektrooptische Koppelbaugruppe |
US6335222B1 (en) * | 1997-09-18 | 2002-01-01 | Tessera, Inc. | Microelectronic packages with solder interconnections |
US6179627B1 (en) | 1998-04-22 | 2001-01-30 | Stratos Lightwave, Inc. | High speed interface converter module |
US6203333B1 (en) | 1998-04-22 | 2001-03-20 | Stratos Lightwave, Inc. | High speed interface converter module |
DE19819164C1 (de) * | 1998-04-24 | 2000-02-17 | Siemens Ag | Baugruppe |
FR2779536B1 (fr) * | 1998-06-09 | 2001-10-19 | Commissariat Energie Atomique | Assemblage permettant la connexion de fibres optiques avec des composants optiques ou optoelectroniques et procede de fabrication de cet assemblage |
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IT1308402B1 (it) * | 1999-03-03 | 2001-12-17 | Cselt Centro Studi Lab Telecom | Procedimento e dispositivo per accoppiare fibre ottiche e componentioptoelettronici. |
US6873800B1 (en) | 1999-05-26 | 2005-03-29 | Jds Uniphase Corporation | Hot pluggable optical transceiver in a small form pluggable package |
US7013088B1 (en) | 1999-05-26 | 2006-03-14 | Jds Uniphase Corporation | Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers |
US6213651B1 (en) | 1999-05-26 | 2001-04-10 | E20 Communications, Inc. | Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers |
US6952532B2 (en) * | 1999-05-27 | 2005-10-04 | Jds Uniphase Corporation | Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
US20020030872A1 (en) * | 1999-05-27 | 2002-03-14 | Edwin Dair | Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
US20040069997A1 (en) * | 1999-05-27 | 2004-04-15 | Edwin Dair | Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
US6632030B2 (en) | 1999-05-27 | 2003-10-14 | E20 Communications, Inc. | Light bending optical block for fiber optic modules |
US7116912B2 (en) * | 1999-05-27 | 2006-10-03 | Jds Uniphase Corporation | Method and apparatus for pluggable fiber optic modules |
US20020033979A1 (en) * | 1999-05-27 | 2002-03-21 | Edwin Dair | Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
US20010048793A1 (en) * | 1999-05-27 | 2001-12-06 | Edwin Dair | Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
US7004644B1 (en) | 1999-06-29 | 2006-02-28 | Finisar Corporation | Hermetic chip-scale package for photonic devices |
EP1100123A1 (de) | 1999-11-09 | 2001-05-16 | Corning Incorporated | Verfahren zur Herstellung von Flipchiplothöckern durch Tauchbeloten |
US6792178B1 (en) | 2000-01-12 | 2004-09-14 | Finisar Corporation | Fiber optic header with integrated power monitor |
EP1122567A1 (de) | 2000-02-02 | 2001-08-08 | Corning Incorporated | Passive Ausrichtung unter Verwendung von geneigter Sockelwand |
US6866426B1 (en) | 2000-04-07 | 2005-03-15 | Shipley Company, L.L.C. | Open face optical fiber array for coupling to integrated optic waveguides and optoelectronic submounts |
US6848839B2 (en) | 2000-04-07 | 2005-02-01 | Shipley Company, L.L.C. | Methods and devices for coupling optoelectronic packages |
GB2365989B (en) * | 2000-05-08 | 2003-05-14 | Mitel Semiconductor Ab | Optic fiber interface device on folded circuit board |
US6741778B1 (en) | 2000-05-23 | 2004-05-25 | International Business Machines Corporation | Optical device with chip level precision alignment |
US6788853B2 (en) * | 2000-06-28 | 2004-09-07 | Shipley Company, L.L.C. | Method for cleaving integrated optic waveguides to provide a smooth waveguide endface |
US20040212802A1 (en) * | 2001-02-20 | 2004-10-28 | Case Steven K. | Optical device with alignment compensation |
US6546172B2 (en) | 2001-02-20 | 2003-04-08 | Avanti Optics Corporation | Optical device |
US6546173B2 (en) * | 2001-02-20 | 2003-04-08 | Avanti Optics Corporation | Optical module |
US6956999B2 (en) | 2001-02-20 | 2005-10-18 | Cyberoptics Corporation | Optical device |
US6443631B1 (en) | 2001-02-20 | 2002-09-03 | Avanti Optics Corporation | Optical module with solder bond |
US6595699B1 (en) * | 2001-08-03 | 2003-07-22 | National Semiconductor Corporation | Optoelectronic package with controlled fiber standoff |
US6655854B1 (en) | 2001-08-03 | 2003-12-02 | National Semiconductor Corporation | Optoelectronic package with dam structure to provide fiber standoff |
US7446261B2 (en) | 2001-09-06 | 2008-11-04 | Finisar Corporation | Flexible circuit boards with tooling cutouts for optoelectronic modules |
US7439449B1 (en) | 2002-02-14 | 2008-10-21 | Finisar Corporation | Flexible circuit for establishing electrical connectivity with optical subassembly |
US7001083B1 (en) * | 2001-09-21 | 2006-02-21 | National Semiconductor Corporation | Technique for protecting photonic devices in optoelectronic packages with clear overmolding |
TW523111U (en) * | 2002-02-26 | 2003-03-01 | Ind Tech Res Inst | Passive alignment packaging structure of photoelectric device and fiber connector |
JP2003303975A (ja) * | 2002-04-08 | 2003-10-24 | Opnext Japan Inc | モニタ用フォトダイオード付光モジュール。 |
GB2408111A (en) * | 2002-08-20 | 2005-05-18 | Cyberoptics Corp | Optical alignment mount with height adjustment |
US7526207B2 (en) * | 2002-10-18 | 2009-04-28 | Finisar Corporation | Flexible circuit design for improved laser bias connections to optical subassemblies |
US7343058B2 (en) * | 2003-04-22 | 2008-03-11 | Intel Corporation | Efficient light coupler from off-chip to on-chip waveguides |
US20070110361A1 (en) * | 2003-08-26 | 2007-05-17 | Digital Optics Corporation | Wafer level integration of multiple optical elements |
US7499614B2 (en) | 2003-10-24 | 2009-03-03 | International Business Machines Corporation | Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boards |
US7027694B2 (en) * | 2003-11-20 | 2006-04-11 | Agilent Technologies, Inc. | Alignment assembly and method for an optics module |
KR100481978B1 (ko) * | 2004-03-05 | 2005-04-14 | 엘에스전선 주식회사 | 경사면을 가진 광섬유를 이용한 광 송수신 모듈 및 그제조방법 |
US7275937B2 (en) | 2004-04-30 | 2007-10-02 | Finisar Corporation | Optoelectronic module with components mounted on a flexible circuit |
US7311240B2 (en) | 2004-04-30 | 2007-12-25 | Finisar Corporation | Electrical circuits with button plated contacts and assembly methods |
US7425135B2 (en) * | 2004-04-30 | 2008-09-16 | Finisar Corporation | Flex circuit assembly |
US7629537B2 (en) * | 2004-07-09 | 2009-12-08 | Finisar Corporation | Single layer flex circuit |
KR100635375B1 (ko) * | 2004-09-14 | 2006-10-17 | 한국전자통신연구원 | 트랜시버 모듈 및 수동정렬을 위한 광학 벤치 |
TWI250735B (en) * | 2004-11-25 | 2006-03-01 | Ind Tech Res Inst | Tunable type light transceiver module |
JP4631671B2 (ja) * | 2005-11-29 | 2011-02-16 | オムロン株式会社 | 光ケーブルモジュール、および光ケーブルモジュールを備える電子機器 |
WO2007116998A1 (ja) * | 2006-04-07 | 2007-10-18 | Omron Corporation | 光ケーブルモジュール |
JP2009042400A (ja) * | 2007-08-07 | 2009-02-26 | Omron Corp | フィルム光導波路パッケージ、フィルム光導波路モジュールおよび電子機器 |
JP2011258741A (ja) * | 2010-06-09 | 2011-12-22 | Fuji Xerox Co Ltd | 光伝送装置 |
US8724937B2 (en) | 2011-12-20 | 2014-05-13 | International Business Machines Corporation | Fiber to wafer interface |
US8901576B2 (en) | 2012-01-18 | 2014-12-02 | International Business Machines Corporation | Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer |
US8534927B1 (en) | 2012-03-23 | 2013-09-17 | International Business Machines Corporation | Flexible fiber to wafer interface |
US9243784B2 (en) | 2012-12-20 | 2016-01-26 | International Business Machines Corporation | Semiconductor photonic package |
US9400356B2 (en) | 2013-03-14 | 2016-07-26 | International Business Machines Corporation | Fiber pigtail with integrated lid |
US8923665B2 (en) | 2013-03-15 | 2014-12-30 | International Business Machines Corporation | Material structures for front-end of the line integration of optical polarization splitters and rotators |
US9651746B2 (en) * | 2013-03-27 | 2017-05-16 | Ccs Technology, Inc. | Optoelectronic device and method for assembling an optoelectronic device |
US9323012B1 (en) | 2014-10-27 | 2016-04-26 | Laxense Inc. | Hybrid integrated optical device with high alignment tolerance |
US9323011B1 (en) | 2015-06-09 | 2016-04-26 | Laxense Inc. | Hybrid integrated optical device with passively aligned laser chips having submicrometer alignment accuracy |
US9513435B1 (en) | 2015-10-19 | 2016-12-06 | Laxense Inc. | Hybrid integrated optical device enabling high tolerance optical chip bonding and the method to make the same |
WO2018214008A1 (zh) | 2017-05-23 | 2018-11-29 | 华为技术有限公司 | 一种光模块结构及其制作方法 |
EP3789805B1 (de) * | 2019-09-04 | 2023-08-09 | Ams Ag | Verbundstruktur und verfahren zur herstellung einer verbundstruktur |
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US4070516A (en) * | 1976-10-18 | 1978-01-24 | International Business Machines Corporation | Multilayer module having optical channels therein |
CA1267468C (en) * | 1983-11-21 | 1990-04-03 | OPTICS MOUNTING | |
GB2208943B (en) * | 1987-08-19 | 1991-07-31 | Plessey Co Plc | Alignment of fibre arrays |
US5015059A (en) * | 1988-01-15 | 1991-05-14 | E. I. Du Pont De Nemours And Company | Optical fiber connector assemblies and methods of making the assemblies |
US4883743A (en) * | 1988-01-15 | 1989-11-28 | E. I. Du Pont De Nemours And Company | Optical fiber connector assemblies and methods of making the assemblies |
US5098804A (en) * | 1989-01-13 | 1992-03-24 | E. I. Du Pont De Nemours And Company | Multiplexer-demultiplexer for integrated optic circuit |
US5016958A (en) * | 1989-02-07 | 1991-05-21 | E. I. Du Pont De Nemours And Company | Optical switch having a phase change region therein |
US5005320A (en) * | 1990-03-30 | 1991-04-09 | E. I. Du Pont De Nemours And Company | Method and apparatus for tapering an end of an elongated object |
US5026135A (en) * | 1990-04-20 | 1991-06-25 | E. I. Du Pont De Nemours And Company | Moisture sealing of optical waveguide devices with doped silicon dioxide |
CA2040682A1 (en) * | 1990-04-20 | 1991-10-21 | Bruce L. Booth | Moisture sealing of optical waveguide devices with doped silicon dioxide having a silicon monoxide undercoat |
US5062681A (en) * | 1990-05-02 | 1991-11-05 | E. I. Du Pont De Nemours And Company | Slot-coupling of optical waveguide to optical waveguide devices |
US5150440A (en) * | 1990-10-11 | 1992-09-22 | E. I. Du Pont De Nemours And Company | Coupling of optical fiber to optical waveguide device |
GB2255672B (en) * | 1991-05-10 | 1994-11-30 | Northern Telecom Ltd | Opto-electronic components |
JPH0688917A (ja) * | 1991-11-07 | 1994-03-29 | Nec Corp | 光導波路素子と光ファイバ端末との接続方法 |
JPH0688918A (ja) * | 1991-11-07 | 1994-03-29 | Nec Corp | 光導波路デバイスおよびその製造方法 |
EP0562211A1 (de) * | 1992-03-25 | 1993-09-29 | International Business Machines Corporation | Selbstausrichtende Faserkoppler |
US5249733A (en) * | 1992-07-16 | 1993-10-05 | At&T Bell Laboratories | Solder self-alignment methods |
-
1994
- 1994-08-31 US US08/299,176 patent/US5499312A/en not_active Expired - Fee Related
-
1995
- 1995-07-11 EP EP01100336A patent/EP1120673B1/de not_active Expired - Lifetime
- 1995-07-11 EP EP95110816A patent/EP0699931B1/de not_active Expired - Lifetime
- 1995-07-11 DE DE69529582T patent/DE69529582T2/de not_active Expired - Fee Related
- 1995-07-11 DE DE69526891T patent/DE69526891T2/de not_active Expired - Fee Related
- 1995-08-24 JP JP21614195A patent/JP3720877B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1120673B1 (de) | 2003-02-05 |
DE69526891D1 (de) | 2002-07-11 |
JPH0875957A (ja) | 1996-03-22 |
JP3720877B2 (ja) | 2005-11-30 |
EP0699931B1 (de) | 2002-06-05 |
DE69526891T2 (de) | 2002-11-07 |
EP1120673A1 (de) | 2001-08-01 |
DE69529582D1 (de) | 2003-03-13 |
US5499312A (en) | 1996-03-12 |
EP0699931A1 (de) | 1996-03-06 |
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