DE69527529D1 - Siliziumhalbleiterdiode, ihr Schaltungsmodul und Struktur mit einem isolierendem Körper und Herstellungsverfahren dafür - Google Patents
Siliziumhalbleiterdiode, ihr Schaltungsmodul und Struktur mit einem isolierendem Körper und Herstellungsverfahren dafürInfo
- Publication number
- DE69527529D1 DE69527529D1 DE69527529T DE69527529T DE69527529D1 DE 69527529 D1 DE69527529 D1 DE 69527529D1 DE 69527529 T DE69527529 T DE 69527529T DE 69527529 T DE69527529 T DE 69527529T DE 69527529 D1 DE69527529 D1 DE 69527529D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- circuit module
- insulating body
- silicon semiconductor
- semiconductor diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP95402057A EP0762494B1 (de) | 1995-09-12 | 1995-09-12 | Siliziumhalbleiterdiode, ihr Schaltungsmodul und Struktur mit einem isolierendem Körper und Herstellungsverfahren dafür |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69527529D1 true DE69527529D1 (de) | 2002-08-29 |
DE69527529T2 DE69527529T2 (de) | 2002-12-12 |
Family
ID=8221524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69527529T Expired - Fee Related DE69527529T2 (de) | 1995-09-12 | 1995-09-12 | Siliziumhalbleiterdiode, ihr Schaltungsmodul und Struktur mit einem isolierendem Körper und Herstellungsverfahren dafür |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0762494B1 (de) |
DE (1) | DE69527529T2 (de) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1276210B (de) * | 1961-08-31 | 1968-08-29 | Siemens Ag | Halbleiterbauelement |
US3818584A (en) * | 1967-09-06 | 1974-06-25 | Tokyo Shibaura Electric Co | Method for manufacturing a semiconductor apparatus |
US4168960A (en) * | 1978-04-18 | 1979-09-25 | Westinghouse Electric Corp. | Method of making a glass encapsulated diode |
-
1995
- 1995-09-12 DE DE69527529T patent/DE69527529T2/de not_active Expired - Fee Related
- 1995-09-12 EP EP95402057A patent/EP0762494B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69527529T2 (de) | 2002-12-12 |
EP0762494B1 (de) | 2002-07-24 |
EP0762494A1 (de) | 1997-03-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |