DE69523860D1 - Prüfkarte für Hochtemperaturverwendung - Google Patents

Prüfkarte für Hochtemperaturverwendung

Info

Publication number
DE69523860D1
DE69523860D1 DE69523860T DE69523860T DE69523860D1 DE 69523860 D1 DE69523860 D1 DE 69523860D1 DE 69523860 T DE69523860 T DE 69523860T DE 69523860 T DE69523860 T DE 69523860T DE 69523860 D1 DE69523860 D1 DE 69523860D1
Authority
DE
Germany
Prior art keywords
high temperature
test card
temperature use
card
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69523860T
Other languages
English (en)
Other versions
DE69523860T2 (de
Inventor
Masao Okubo
Nobuyuki Murakami
Kouji Katahira
Hiroshi Iwata
Kazumasa Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Publication of DE69523860D1 publication Critical patent/DE69523860D1/de
Application granted granted Critical
Publication of DE69523860T2 publication Critical patent/DE69523860T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
DE69523860T 1994-10-17 1995-03-15 Prüfkarte für Hochtemperaturverwendung Expired - Fee Related DE69523860T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6278447A JP2632136B2 (ja) 1994-10-17 1994-10-17 高温測定用プローブカード

Publications (2)

Publication Number Publication Date
DE69523860D1 true DE69523860D1 (de) 2001-12-20
DE69523860T2 DE69523860T2 (de) 2002-08-29

Family

ID=17597470

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69523860T Expired - Fee Related DE69523860T2 (de) 1994-10-17 1995-03-15 Prüfkarte für Hochtemperaturverwendung

Country Status (7)

Country Link
US (1) US5670889A (de)
EP (1) EP0708338B1 (de)
JP (1) JP2632136B2 (de)
KR (1) KR100188861B1 (de)
DE (1) DE69523860T2 (de)
ES (1) ES2167402T3 (de)
TW (1) TW263558B (de)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
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US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
WO1997043653A1 (en) * 1996-05-17 1997-11-20 Formfactor, Inc. Contact tip structures for microelectronic interconnection elements and methods of making same
US5751157A (en) * 1996-07-22 1998-05-12 Probe Technology Method and apparatus for aligning probes
US6603322B1 (en) * 1996-12-12 2003-08-05 Ggb Industries, Inc. Probe card for high speed testing
JP3193659B2 (ja) * 1997-02-25 2001-07-30 インターナショナル・ビジネス・マシーンズ・コーポレ−ション プロービング方法
JP3142801B2 (ja) * 1997-09-04 2001-03-07 松下電器産業株式会社 半導体集積回路の検査方法、プローブカード及びバーンイン用ボード
JP3616236B2 (ja) * 1997-09-26 2005-02-02 株式会社ルネサステクノロジ プローブカードおよびそれを用いたウエハテスト方法
US6011405A (en) * 1997-10-28 2000-01-04 Qualitau, Inc. Apparatus and method for probing multiple integrated circuit dice in a semiconductor wafer
EP0922960A1 (de) 1997-12-12 1999-06-16 Padar Tecnologie di Riccioni Roberto S.a.s. Prüfgerät für Mikroschaltungen
US5952843A (en) * 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
US6064215A (en) * 1998-04-08 2000-05-16 Probe Technology, Inc. High temperature probe card for testing integrated circuits
JP2000121666A (ja) * 1998-10-15 2000-04-28 Micronics Japan Co Ltd プローブ及びプローブカード
US6420884B1 (en) * 1999-01-29 2002-07-16 Advantest Corp. Contact structure formed by photolithography process
US6163162A (en) * 1999-01-11 2000-12-19 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6297657B1 (en) * 1999-01-11 2001-10-02 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6535003B2 (en) * 1999-01-29 2003-03-18 Advantest, Corp. Contact structure having silicon finger contactor
JP4388620B2 (ja) * 1999-04-16 2009-12-24 株式会社アドバンテスト プローブカード及びプローブカード製造方法
US6196866B1 (en) * 1999-04-30 2001-03-06 International Business Machines Corporation Vertical probe housing
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6414477B1 (en) * 1999-06-07 2002-07-02 Applied Precision, Inc. Method for optimizing probe card analysis and scrub mark analysis data
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
US6304092B1 (en) * 2000-01-28 2001-10-16 Credence Systems Corporation Self-aligning docking assembly for semiconductor tester
JP3500105B2 (ja) * 2000-02-10 2004-02-23 日本発条株式会社 導電性接触子用支持体及びコンタクトプローブユニット
US6633175B1 (en) 2000-03-06 2003-10-14 Wenworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6566898B2 (en) 2000-03-06 2003-05-20 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6927586B2 (en) * 2000-03-06 2005-08-09 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
JP2002022771A (ja) * 2000-07-10 2002-01-23 Japan Electronic Materials Corp テスト用プローブカード及びそれに用いられるプローブ支持部
US6906539B2 (en) * 2000-07-19 2005-06-14 Texas Instruments Incorporated High density, area array probe card apparatus
US6462568B1 (en) * 2000-08-31 2002-10-08 Micron Technology, Inc. Conductive polymer contact system and test method for semiconductor components
KR100871579B1 (ko) * 2001-01-31 2008-12-02 웬트워쓰 라보라토리즈, 인크. 니켈 합금 프로브 카드 프레임 층
US6462569B2 (en) * 2001-02-20 2002-10-08 Andy Chen Probe card
JP2002267687A (ja) * 2001-03-12 2002-09-18 Advantest Corp プローブカード及び試験装置
US7396236B2 (en) 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
US6856150B2 (en) 2001-04-10 2005-02-15 Formfactor, Inc. Probe card with coplanar daughter card
US6972578B2 (en) 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
US7071714B2 (en) 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
US20030234660A1 (en) * 2002-06-24 2003-12-25 Jain Sunil K. Direct landing technology for wafer probe
KR100470970B1 (ko) * 2002-07-05 2005-03-10 삼성전자주식회사 반도체 검사장치용 프로브카드의 니들고정장치 및 방법
US7474113B2 (en) * 2002-10-25 2009-01-06 Intel Corporation Flexible head probe for sort interface units
US7230420B2 (en) 2003-04-17 2007-06-12 Infinitum Solutions, Inc. Magnetoresistive element lifecycle tester with temperature control
US6943546B2 (en) * 2003-04-17 2005-09-13 Infinitum Solutions, Inc. Magnetoresistive element lifecycle tester
TWM259163U (en) * 2004-05-14 2005-03-11 Via Tech Inc Covering structure of probe card
WO2008070673A2 (en) * 2006-12-04 2008-06-12 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
KR100610266B1 (ko) * 2004-07-28 2006-08-08 주식회사 좋은기술 열회로를 갖는 웨이퍼 및 이의 전기공급시스템
US7167010B2 (en) * 2004-09-02 2007-01-23 Micron Technology, Inc. Pin-in elastomer electrical contactor and methods and processes for making and using the same
KR100975904B1 (ko) * 2005-06-27 2010-08-16 가부시키가이샤 아드반테스트 콘택터, 그 콘택터를 구비한 콘택트 스트럭처, 프로브카드, 시험 장치, 콘택트 스트럭처 제조방법, 및 콘택트스트럭처 제조장치
TW200739083A (en) * 2005-09-30 2007-10-16 Sv Probe Pte Ltd Cantilever probe structure for a probe card assembly
KR100723206B1 (ko) 2005-12-29 2007-05-29 삼성전기주식회사 니들 연결용 ｐｃｂ를 구비한 프로브 카드
US20080036483A1 (en) * 2006-08-08 2008-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Probe card for flip chip testing
US20080122469A1 (en) * 2006-11-28 2008-05-29 Visera Technologies, Company Ltd. Probe card for testing image-sensing chips
KR100843224B1 (ko) * 2007-01-04 2008-07-02 삼성전자주식회사 웨이퍼 테스트용 프로브 카드
TW200846668A (en) * 2007-01-23 2008-12-01 Nictech Co Ltd Probe and probe card having the same
US8305098B2 (en) * 2007-04-26 2012-11-06 Advantest (Singapore) Pte Ltd Element usable with the method, and a standalone probe card tester formable using the method
TW200900703A (en) * 2007-06-15 2009-01-01 Nictech Co Ltd Probe, probe assembly and probe card having the same
KR100867330B1 (ko) * 2007-06-15 2008-11-06 주식회사 엔아이씨테크 프로브 카드용 프로브 조립체
JP2010532473A (ja) * 2007-07-02 2010-10-07 イ・チェハ プローブアセンブリー及びその製造方法
US7888955B2 (en) 2007-09-25 2011-02-15 Formfactor, Inc. Method and apparatus for testing devices using serially controlled resources
US7977959B2 (en) * 2007-09-27 2011-07-12 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US7816930B2 (en) * 2007-10-12 2010-10-19 On Semiconductor High temperature range electrical circuit testing
JP5069542B2 (ja) * 2007-12-03 2012-11-07 株式会社日本マイクロニクス プローブカード
US20090164931A1 (en) * 2007-12-19 2009-06-25 Formfactor, Inc. Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System
US20090224793A1 (en) * 2008-03-07 2009-09-10 Formfactor, Inc. Method And Apparatus For Designing A Custom Test System
US8122309B2 (en) 2008-03-11 2012-02-21 Formfactor, Inc. Method and apparatus for processing failures during semiconductor device testing
TWI367329B (en) * 2008-06-19 2012-07-01 King Yuan Electronics Co Ltd Probe card assembly
TWI367331B (en) 2008-06-19 2012-07-01 King Yuan Electronics Co Ltd Probe card assembly and probes therein
US8095841B2 (en) 2008-08-19 2012-01-10 Formfactor, Inc. Method and apparatus for testing semiconductor devices with autonomous expected value generation
US7944225B2 (en) * 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
TWI368743B (en) * 2008-11-04 2012-07-21 King Yuan Electronics Co Ltd Probe card assembly and probes therein
TWI399547B (zh) * 2009-07-22 2013-06-21 King Yuan Electronics Co Ltd 具同心圓探針座之半導體測試設備
US9059240B2 (en) 2012-06-05 2015-06-16 International Business Machines Corporation Fixture for shaping a laminate substrate
CN103543298B (zh) * 2012-07-13 2016-03-23 旺矽科技股份有限公司 探针固持结构及其光学检测装置
JP6649055B2 (ja) * 2015-11-25 2020-02-19 株式会社キッツエスシーティー 高真空弁
TWI567395B (zh) * 2016-05-06 2017-01-21 致茂電子股份有限公司 電流探針
JP6815176B2 (ja) * 2016-12-01 2021-01-20 ニデック エス ブイ プローブ プライベート リミテッドＮｉｄｅｃ Ｓｖ Ｐｒｏｂｅ Ｐｔｅ． Ｌｔｄ． プローブカード
PH12020050134A1 (en) * 2019-06-12 2021-09-01 Jf Microtechnology Sdn Bhd Wedged contact fingers for integrated circuit testing apparatus
CN115704857A (zh) * 2021-08-09 2023-02-17 苏州联讯仪器有限公司 激光器芯片用测试探针台
KR102441689B1 (ko) * 2022-07-28 2022-09-08 주식회사 유니밴스 커넥팅 프로브 카드

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US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
US4161692A (en) * 1977-07-18 1979-07-17 Cerprobe Corporation Probe device for integrated circuit wafers
US4523144A (en) * 1980-05-27 1985-06-11 Japan Electronic Materials Corp. Complex probe card for testing a semiconductor wafer
JPS5929151B2 (ja) * 1981-08-03 1984-07-18 日本電子材料株式会社 半導体ウエハ−試験装置
US4719417A (en) * 1983-05-03 1988-01-12 Wentworth Laboratories, Inc. Multi-level test probe assembly for IC chips
GB8512916D0 (en) * 1985-05-22 1985-06-26 Horgan M F Probe cards
US5134365A (en) * 1989-07-11 1992-07-28 Nihon Denshizairyo Kabushiki Kaisha Probe card in which contact pressure and relative position of each probe end are correctly maintained
JP3038859B2 (ja) * 1989-09-29 2000-05-08 ジェイエスアール株式会社 異方導電性シート
JPH06140484A (ja) * 1992-10-28 1994-05-20 Nippon Telegr & Teleph Corp <Ntt> プローブカード

Also Published As

Publication number Publication date
EP0708338A3 (de) 1996-07-31
ES2167402T3 (es) 2002-05-16
DE69523860T2 (de) 2002-08-29
JPH08114625A (ja) 1996-05-07
KR100188861B1 (ko) 1999-06-01
TW263558B (en) 1995-11-21
JP2632136B2 (ja) 1997-07-23
EP0708338B1 (de) 2001-11-14
KR960014942A (ko) 1996-05-22
US5670889A (en) 1997-09-23
EP0708338A2 (de) 1996-04-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee