DE69516865D1 - Matrixarchitektur mit verbesserter leitweglenkung für lineare asics - Google Patents
Matrixarchitektur mit verbesserter leitweglenkung für lineare asicsInfo
- Publication number
- DE69516865D1 DE69516865D1 DE69516865T DE69516865T DE69516865D1 DE 69516865 D1 DE69516865 D1 DE 69516865D1 DE 69516865 T DE69516865 T DE 69516865T DE 69516865 T DE69516865 T DE 69516865T DE 69516865 D1 DE69516865 D1 DE 69516865D1
- Authority
- DE
- Germany
- Prior art keywords
- asics
- linear
- improved guide
- matrix architecture
- architecture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011159 matrix material Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
- H01L27/11801—Masterslice integrated circuits using bipolar technology
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/222,736 US5440153A (en) | 1994-04-01 | 1994-04-01 | Array architecture with enhanced routing for linear asics |
PCT/US1995/004053 WO1995027311A1 (en) | 1994-04-01 | 1995-03-30 | ARRAY ARCHITECTURE WITH ENHANCED ROUTING FOR LINEAR ASICs |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69516865D1 true DE69516865D1 (de) | 2000-06-15 |
DE69516865T2 DE69516865T2 (de) | 2000-10-12 |
Family
ID=22833465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69516865T Expired - Fee Related DE69516865T2 (de) | 1994-04-01 | 1995-03-30 | Matrixarchitektur mit verbesserter leitweglenkung für lineare asics |
Country Status (5)
Country | Link |
---|---|
US (1) | US5440153A (de) |
EP (1) | EP0754352B1 (de) |
JP (1) | JPH09511363A (de) |
DE (1) | DE69516865T2 (de) |
WO (1) | WO1995027311A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5659189A (en) * | 1995-06-07 | 1997-08-19 | Lsi Logic Corporation | Layout configuration for an integrated circuit gate array |
US5708288A (en) * | 1995-11-02 | 1998-01-13 | Motorola, Inc. | Thin film silicon on insulator semiconductor integrated circuit with electrostatic damage protection and method |
JP3152145B2 (ja) * | 1996-02-28 | 2001-04-03 | 日本電気株式会社 | 半導体装置 |
US5783963A (en) * | 1996-02-29 | 1998-07-21 | Lexmark International, Inc. | ASIC with selectable output drivers |
US6462977B2 (en) | 2000-08-17 | 2002-10-08 | David Earl Butz | Data storage device having virtual columns and addressing layers |
US7283381B2 (en) | 2000-08-17 | 2007-10-16 | David Earl Butz | System and methods for addressing a matrix incorporating virtual columns and addressing layers |
US6756963B2 (en) * | 2001-09-28 | 2004-06-29 | Three-Five Systems, Inc. | High contrast LCD microdisplay |
US7989917B2 (en) * | 2002-01-31 | 2011-08-02 | Nxp B.V. | Integrated circuit device including a resistor having a narrow-tolerance resistance value coupled to an active component |
US20090182229A1 (en) * | 2008-01-10 | 2009-07-16 | Robert Gideon Wodnicki | UltraSound System With Highly Integrated ASIC Architecture |
DE102008064046A1 (de) * | 2008-10-02 | 2010-04-08 | Continental Teves Ag & Co. Ohg | Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes |
DE102008064047A1 (de) * | 2008-10-02 | 2010-04-08 | Continental Teves Ag & Co. Ohg | Sensorelement und Trägerelement zur Herstellung eines Sensors |
US8431968B2 (en) | 2010-07-28 | 2013-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electromigration resistant standard cell device |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3808475A (en) * | 1972-07-10 | 1974-04-30 | Amdahl Corp | Lsi chip construction and method |
NL176029C (nl) * | 1973-02-01 | 1985-02-01 | Philips Nv | Geintegreerde logische schakeling met komplementaire transistoren. |
JPS57160145A (en) * | 1981-03-27 | 1982-10-02 | Fujitsu Ltd | Manufacture of semiconductor integrated circuit |
FR2524206B1 (fr) * | 1982-03-26 | 1985-12-13 | Thomson Csf Mat Tel | Circuit integre prediffuse, et procede d'interconnexion des cellules de ce circuit |
JPS58166742A (ja) * | 1982-03-29 | 1983-10-01 | Nec Corp | マスタ−スライス基板 |
EP0131463B1 (de) * | 1983-07-09 | 1989-03-15 | Fujitsu Limited | "Master-slice"-Halbleiteranordnung |
JPS6035532A (ja) * | 1983-07-29 | 1985-02-23 | Fujitsu Ltd | マスタスライス集積回路装置 |
JPS60101951A (ja) * | 1983-11-08 | 1985-06-06 | Sanyo Electric Co Ltd | ゲ−トアレイ |
US4623911A (en) * | 1983-12-16 | 1986-11-18 | Rca Corporation | High circuit density ICs |
US4745084A (en) * | 1986-11-12 | 1988-05-17 | Vlsi Technology, Inc. | Method of making a customized semiconductor integrated device |
US4851893A (en) * | 1987-11-19 | 1989-07-25 | Exar Corporation | Programmable active/passive cell structure |
JP2692099B2 (ja) * | 1988-01-14 | 1997-12-17 | 日本電気株式会社 | マスタースライス方式の集積回路 |
EP0382415B1 (de) * | 1989-02-09 | 1994-09-28 | Sony Corporation | Integrierte Halbleiterschaltungsanordnungen |
JP2632420B2 (ja) * | 1989-02-23 | 1997-07-23 | 三菱電機株式会社 | 半導体集積回路 |
JPH0329342A (ja) * | 1989-06-26 | 1991-02-07 | Toshiba Corp | 半導体装置 |
US4978633A (en) * | 1989-08-22 | 1990-12-18 | Harris Corporation | Hierarchical variable die size gate array architecture |
JPH0434973A (ja) * | 1990-05-30 | 1992-02-05 | Toshiba Corp | 半導体基板 |
US5063429A (en) * | 1990-09-17 | 1991-11-05 | Ncr Corporation | High density input/output cell arrangement for integrated circuits |
-
1994
- 1994-04-01 US US08/222,736 patent/US5440153A/en not_active Expired - Fee Related
-
1995
- 1995-03-30 JP JP7525877A patent/JPH09511363A/ja not_active Ceased
- 1995-03-30 DE DE69516865T patent/DE69516865T2/de not_active Expired - Fee Related
- 1995-03-30 EP EP95916923A patent/EP0754352B1/de not_active Expired - Lifetime
- 1995-03-30 WO PCT/US1995/004053 patent/WO1995027311A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0754352A1 (de) | 1997-01-22 |
US5440153A (en) | 1995-08-08 |
JPH09511363A (ja) | 1997-11-11 |
EP0754352B1 (de) | 2000-05-10 |
WO1995027311A1 (en) | 1995-10-12 |
DE69516865T2 (de) | 2000-10-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |