DE69511940T2 - Chip inductance arrangement - Google Patents

Chip inductance arrangement

Info

Publication number
DE69511940T2
DE69511940T2 DE69511940T DE69511940T DE69511940T2 DE 69511940 T2 DE69511940 T2 DE 69511940T2 DE 69511940 T DE69511940 T DE 69511940T DE 69511940 T DE69511940 T DE 69511940T DE 69511940 T2 DE69511940 T2 DE 69511940T2
Authority
DE
Germany
Prior art keywords
chip
substrate
multilayer
solder bumps
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69511940T
Other languages
German (de)
Other versions
DE69511940D1 (en
Inventor
David John Pedder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intarsia Corp
Original Assignee
Intarsia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intarsia Corp filed Critical Intarsia Corp
Publication of DE69511940D1 publication Critical patent/DE69511940D1/en
Application granted granted Critical
Publication of DE69511940T2 publication Critical patent/DE69511940T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances

Abstract

An inductor chip device for mounting on multichip-module, direct-chip-attach or surface-mount assemblies comprises a dielectric substrate (12), a spiral metallisation structure (14) defined on one major surface of the substrate, and a plurality of solder bumps (18, 19) defined on the other major surface of the substrate, the spiral structure being electrically connected to the plurality of solder bumps by means of metal-filled vias. Single or multilayer inductors may be defined, the latter providing higher inductance values in the same chip area. The multilayer inductors are constructed using a multilayer metal-polyimide or similar dielectric structure. The chip inductor provides a very small, accurate, discrete device with high inductance, high Q-factor and high self-resonant frequency. <IMAGE>
DE69511940T 1994-06-03 1995-05-22 Chip inductance arrangement Expired - Fee Related DE69511940T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9411107A GB2290171B (en) 1994-06-03 1994-06-03 Inductor chip device

Publications (2)

Publication Number Publication Date
DE69511940D1 DE69511940D1 (en) 1999-10-14
DE69511940T2 true DE69511940T2 (en) 2000-05-04

Family

ID=10756121

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69511940T Expired - Fee Related DE69511940T2 (en) 1994-06-03 1995-05-22 Chip inductance arrangement

Country Status (6)

Country Link
EP (1) EP0685857B1 (en)
JP (1) JPH07335439A (en)
AT (1) ATE184419T1 (en)
DE (1) DE69511940T2 (en)
ES (1) ES2139841T3 (en)
GB (1) GB2290171B (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292016B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Inductor device
WO1999033108A1 (en) * 1997-12-22 1999-07-01 Conexant Systems, Inc. Wireless inter-chip communication system and method
US6303423B1 (en) 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
JP2001358551A (en) 2000-06-15 2001-12-26 Matsushita Electric Ind Co Ltd Filter
DE10144464C2 (en) * 2001-09-10 2003-07-17 Infineon Technologies Ag Electronic component with an induction coil for high-frequency applications and method for producing the same
FR2830683A1 (en) * 2001-10-10 2003-04-11 St Microelectronics Sa Integrated circuit with inductance comprises spiral channel in which metal deposit forms inductance winding
KR20030048691A (en) * 2001-12-12 2003-06-25 삼성전자주식회사 low value, low variation high frequency inductor and method for manufacturing the same
US8384189B2 (en) 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
DE102006057332B4 (en) 2006-12-05 2018-01-25 Infineon Technologies Ag Assembly comprising a substrate and a chip mounted on the substrate
NL1036092C (en) * 2008-10-21 2010-04-22 Tetradon B V METHOD AND DEVICE FOR A MODULAR BUILT-IN TRANSFORMER
EP3140838B1 (en) 2014-05-05 2021-08-25 3D Glass Solutions, Inc. Inductive device in a photo-definable glass structure
KR102479144B1 (en) 2016-02-25 2022-12-20 3디 글래스 솔루션즈 인코포레이티드 3d capacitor and capacitor array fabricating photoactive substrates
US11161773B2 (en) 2016-04-08 2021-11-02 3D Glass Solutions, Inc. Methods of fabricating photosensitive substrates suitable for optical coupler
JP6390825B1 (en) 2017-03-01 2018-09-19 株式会社村田製作所 Mounting board
CA3067812C (en) 2017-07-07 2023-03-14 3D Glass Solutions, Inc. 2d and 3d rf lumped element devices for rf system in a package photoactive glass substrates
WO2019118761A1 (en) 2017-12-15 2019-06-20 3D Glass Solutions, Inc. Coupled transmission line resonate rf filter
WO2019136024A1 (en) 2018-01-04 2019-07-11 3D Glass Solutions, Inc. Impedance matching conductive structure for high efficiency rf circuits
WO2020060824A1 (en) 2018-09-17 2020-03-26 3D Glass Solutions, Inc. High efficiency compact slotted antenna with a ground plane
CA3107810A1 (en) 2018-12-28 2020-07-02 3D Glass Solutions, Inc. Heterogenous integration for rf, microwave and mm wave systems in photoactive glass substrates
WO2020139955A1 (en) 2018-12-28 2020-07-02 3D Glass Solutions, Inc. Annular capacitor rf, microwave and mm wave systems
CA3135975C (en) 2019-04-05 2022-11-22 3D Glass Solutions, Inc. Glass based empty substrate integrated waveguide devices
WO2020214788A1 (en) 2019-04-18 2020-10-22 3D Glass Solutions, Inc. High efficiency die dicing and release
JP2023516817A (en) * 2020-04-17 2023-04-20 スリーディー グラス ソリューションズ，インク broadband induction

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873127A (en) * 1981-10-28 1983-05-02 Hitachi Ltd Solder melting connection for ic chip
DE3502770A1 (en) * 1985-01-28 1986-07-31 Siemens AG, 1000 Berlin und 8000 München METHOD FOR PRODUCING A FLAT COIL AND FLAT COIL FOR A SHOCK SHAFT PIPE
JPS6215850A (en) * 1985-07-13 1987-01-24 Oki Electric Ind Co Ltd Multi-chip package substrate
JP2615151B2 (en) * 1988-08-19 1997-05-28 株式会社村田製作所 Chip coil and method of manufacturing the same
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same
DE69021438T2 (en) * 1989-05-16 1996-01-25 Marconi Gec Ltd Method for producing a flip-chip solder structure for arrangements with gold metallization.
JPH04245410A (en) * 1991-01-30 1992-09-02 Sharp Corp Printed coil for double-tuned circuit use
US5349743A (en) * 1991-05-02 1994-09-27 At&T Bell Laboratories Method of making a multilayer monolithic magnet component
GB2263582B (en) * 1992-01-21 1995-11-01 Dale Electronics Laser-formed electrical component and method for making same

Also Published As

Publication number Publication date
DE69511940D1 (en) 1999-10-14
GB2290171B (en) 1998-01-21
ES2139841T3 (en) 2000-02-16
EP0685857B1 (en) 1999-09-08
ATE184419T1 (en) 1999-09-15
EP0685857A1 (en) 1995-12-06
GB9411107D0 (en) 1994-07-27
GB2290171A (en) 1995-12-13
JPH07335439A (en) 1995-12-22

Similar Documents

Publication Publication Date Title
DE69511940T2 (en) Chip inductance arrangement
US4941067A (en) Thermal shunt for electronic circuits
DE60026978T2 (en) MULTIPLE HOUSING WITH INTEGRATED RF CAPABILITIES
DE60119927T2 (en) ELECTRONIC BALLAST FOR A DISCHARGE LAMP
US6618268B2 (en) Apparatus for delivering power to high performance electronic assemblies
US20100136840A1 (en) Apparatus for providing controlled impedance in an electrical contact
GB2288074B (en) Ball grid array arrangement
CA2239277A1 (en) Passive element circuit
EP0873046A4 (en) Printed wiring board device
EP1895589A3 (en) Semiconductor package substrate
US6636416B2 (en) Electronic assembly with laterally connected capacitors and manufacturing method
EP1085572A3 (en) Low pass filter integral with semiconductor package
US5744869A (en) Apparatus for mounting a flip-chip semiconductor device
EP1579746A1 (en) Mounting capacitors under ball grid array
US5198887A (en) Semiconductor chip carrier
US6642811B2 (en) Built-in power supply filter for an integrated circuit
JP2000182851A (en) Inductor
TW434747B (en) Semiconductor device
US20040217442A1 (en) Semiconductor device
EP1161124A3 (en) Surface-mounting type electronic circuit unit suitable for miniaturization
US6933596B2 (en) Ultra wideband BGA
DE69529709D1 (en) Inductor arrangement
DE102005027945B4 (en) Low-loss electrical component with an amplifier
US7057114B2 (en) Circuit board with added impedance
DE19648308A1 (en) Radio communication module

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: INTARSIA CORPORATION, FREMONT, CALIF., US

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee