DE69508129D1 - Epoxydharzzusammensetzung und Formmassen daraus - Google Patents

Epoxydharzzusammensetzung und Formmassen daraus

Info

Publication number
DE69508129D1
DE69508129D1 DE69508129T DE69508129T DE69508129D1 DE 69508129 D1 DE69508129 D1 DE 69508129D1 DE 69508129 T DE69508129 T DE 69508129T DE 69508129 T DE69508129 T DE 69508129T DE 69508129 D1 DE69508129 D1 DE 69508129D1
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
molding compounds
compounds therefrom
therefrom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69508129T
Other languages
English (en)
Other versions
DE69508129T2 (de
Inventor
Miwa Kamino
Toshio Shimizu
Masaru Miyagawa
Osamu Tagaya
Takafumi Nagata
Shinji Kida
Nobuyuki Nishiwaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69508129D1 publication Critical patent/DE69508129D1/de
Application granted granted Critical
Publication of DE69508129T2 publication Critical patent/DE69508129T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
DE69508129T 1994-04-08 1995-04-07 Epoxydharzzusammensetzung und Formmassen daraus Expired - Lifetime DE69508129T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07076394A JP3923542B2 (ja) 1994-04-08 1994-04-08 樹脂モールド品及びそれを用いた重電機器

Publications (2)

Publication Number Publication Date
DE69508129D1 true DE69508129D1 (de) 1999-04-15
DE69508129T2 DE69508129T2 (de) 1999-11-04

Family

ID=13440883

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69508129T Expired - Lifetime DE69508129T2 (de) 1994-04-08 1995-04-07 Epoxydharzzusammensetzung und Formmassen daraus

Country Status (6)

Country Link
EP (1) EP0676448B1 (de)
JP (1) JP3923542B2 (de)
KR (1) KR0175110B1 (de)
CN (1) CN1066764C (de)
DE (1) DE69508129T2 (de)
MY (1) MY116631A (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09165496A (ja) * 1995-12-13 1997-06-24 Toshiba Corp 注形用エポキシ樹脂組成物及びその製造方法
EP0899304B1 (de) * 1997-08-27 2005-03-16 Huntsman Advanced Materials (Switzerland) GmbH Hydrophobes Epoxidharzsystem
JP4520003B2 (ja) * 2000-04-14 2010-08-04 株式会社カネカ 硬化性組成物
DE10357407A1 (de) * 2003-12-04 2005-07-07 Siemens Ag Elektrische Schalteinrichtung mit einem elektrisch isolierenden Stoffgemisch
JP5192162B2 (ja) * 2007-03-02 2013-05-08 日本特殊陶業株式会社 無機材料部品
JP2011512441A (ja) * 2008-02-15 2011-04-21 ダウ グローバル テクノロジーズ リミティド ライアビリティ カンパニー シリコーンポリエーテルを含む熱硬化性組成物、その製造、および使用
DE102008044199A1 (de) 2008-11-28 2010-06-02 Wacker Chemie Ag Siloxan-Mischungen enthaltende Epoxidharze und Verfahren zu ihrer Herstellung und deren Verwendung
CN102938279B (zh) * 2012-11-26 2014-11-05 浙江理工大学 一种耐热环氧树脂绝缘子的制备方法
JP6191262B2 (ja) * 2013-06-13 2017-09-06 パナソニックＩｐマネジメント株式会社 酸素透過性の熱硬化性エポキシ樹脂組成物とそれを用いた電子機器
JP5914759B2 (ja) * 2013-10-29 2016-05-11 ポリプラスチックス株式会社 耐コロナ性樹脂組成物、樹脂組成物の耐コロナ性発現方法及び耐コロナ性部材
JP6690206B2 (ja) 2014-12-26 2020-04-28 株式会社デンソー 樹脂成形体およびその製造方法
CN108641297A (zh) * 2018-05-17 2018-10-12 姚子巍 一种低导热系数环氧树脂复合材料制备方法
CN113498007A (zh) * 2020-04-01 2021-10-12 大原祐子 具有抗噪层的喇叭振动片及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401775A (en) * 1982-06-24 1983-08-30 Rca Corporation Epoxy encapsulating formulation
US4624998A (en) * 1985-12-30 1986-11-25 Dow Corning Corporation Silicone-modified epoxy resins having improved impact resistance
US5120803A (en) * 1988-09-07 1992-06-09 Mitsui Toatsu Chemicals, Inc. Resin compositions for sealing semiconductor
CA2010331A1 (en) * 1989-03-02 1990-09-02 James O. Peterson Low stress epoxy encapsulant compositions
US5319005A (en) * 1992-01-27 1994-06-07 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component

Also Published As

Publication number Publication date
KR0175110B1 (ko) 1999-10-01
JP3923542B2 (ja) 2007-06-06
KR950029318A (ko) 1995-11-22
CN1066764C (zh) 2001-06-06
MY116631A (en) 2004-03-31
DE69508129T2 (de) 1999-11-04
CN1111659A (zh) 1995-11-15
JPH07278413A (ja) 1995-10-24
EP0676448B1 (de) 1999-03-10
EP0676448A1 (de) 1995-10-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8328 Change in the person/name/address of the agent

Representative=s name: LEINE WAGNER DR. HERRGUTH, 30163 HANNOVER