DE69505087T2 - Mikrowellenplasmabrenner und Verfahren zur dessen Erzeugung - Google Patents

Mikrowellenplasmabrenner und Verfahren zur dessen Erzeugung

Info

Publication number
DE69505087T2
DE69505087T2 DE69505087T DE69505087T DE69505087T2 DE 69505087 T2 DE69505087 T2 DE 69505087T2 DE 69505087 T DE69505087 T DE 69505087T DE 69505087 T DE69505087 T DE 69505087T DE 69505087 T2 DE69505087 T2 DE 69505087T2
Authority
DE
Germany
Prior art keywords
producing
plasma torch
microwave plasma
microwave
torch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69505087T
Other languages
English (en)
Other versions
DE69505087D1 (de
Inventor
Toru Kawase
Yoshinobu Nagano
Tadashi Kimura
Yoshikazu Yoshida
Shinichi Mizugushi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69505087D1 publication Critical patent/DE69505087D1/de
Application granted granted Critical
Publication of DE69505087T2 publication Critical patent/DE69505087T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K10/00—Welding or cutting by means of a plasma
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/30—Plasma torches using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/34—Details, e.g. electrodes, nozzles
    • H05H1/3478—Geometrical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/34—Details, e.g. electrodes, nozzles
    • H05H1/3468—Vortex generators

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Geometry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
DE69505087T 1994-10-26 1995-10-24 Mikrowellenplasmabrenner und Verfahren zur dessen Erzeugung Expired - Fee Related DE69505087T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26233294 1994-10-26
JP26532194 1994-10-28

Publications (2)

Publication Number Publication Date
DE69505087D1 DE69505087D1 (de) 1998-11-05
DE69505087T2 true DE69505087T2 (de) 1999-03-11

Family

ID=26545505

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69505087T Expired - Fee Related DE69505087T2 (de) 1994-10-26 1995-10-24 Mikrowellenplasmabrenner und Verfahren zur dessen Erzeugung

Country Status (7)

Country Link
US (1) US5734143A (de)
EP (1) EP0710054B1 (de)
KR (1) KR100189311B1 (de)
CN (1) CN1057422C (de)
DE (1) DE69505087T2 (de)
MY (1) MY138630A (de)
TW (1) TW285746B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017115438A1 (de) * 2017-06-06 2018-12-06 Fricke Und Mallah Microwave Technology Gmbh Vorrichtung zum erzeugen eines plasmastrahls im mhz- und ghzbereich mit tem- und hohlleitermoden

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US6215092B1 (en) 1999-06-08 2001-04-10 Alcatel Plasma overcladding process and apparatus having multiple plasma torches
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KR100689037B1 (ko) * 2005-08-24 2007-03-08 삼성전자주식회사 마이크로파 공명 플라즈마 발생장치 및 그것을 구비하는플라즈마 처리 시스템
JP4822813B2 (ja) * 2005-11-07 2011-11-24 コマツ産機株式会社 熱切断加工機
JP4852997B2 (ja) * 2005-11-25 2012-01-11 東京エレクトロン株式会社 マイクロ波導入装置及びプラズマ処理装置
US7679024B2 (en) * 2005-12-23 2010-03-16 Lam Research Corporation Highly efficient gas distribution arrangement for plasma tube of a plasma processing chamber
US7562638B2 (en) * 2005-12-23 2009-07-21 Lam Research Corporation Methods and arrangement for implementing highly efficient plasma traps
US20070284342A1 (en) * 2006-06-09 2007-12-13 Morten Jorgensen Plasma treatment method and apparatus
US8748785B2 (en) * 2007-01-18 2014-06-10 Amastan Llc Microwave plasma apparatus and method for materials processing
KR101119627B1 (ko) * 2007-03-29 2012-03-07 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
US9000321B2 (en) * 2007-06-22 2015-04-07 Komatsu Industries Corporation Thermal cutter with sound absorbent walls
JP5421551B2 (ja) * 2008-06-11 2014-02-19 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US8800484B2 (en) * 2008-07-09 2014-08-12 Tokyo Electron Limited Plasma processing apparatus
KR101100916B1 (ko) 2008-12-02 2012-01-02 (주)트리플코어스코리아 상압 플라즈마 발생 장치 및 이를 이용한 상압 플라즈마 발생 방법
WO2010064818A2 (ko) * 2008-12-02 2010-06-10 트리플코어스코리아 상압 플라즈마 발생 장치 및 이를 이용한 상압 플라즈마 발생 방법
DE102011015263B4 (de) * 2010-03-26 2014-07-24 Hq-Dielectrics Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
IT1399441B1 (it) * 2010-04-12 2013-04-19 Cebora Spa Torcia per il taglio al plasma.
US10658161B2 (en) * 2010-10-15 2020-05-19 Applied Materials, Inc. Method and apparatus for reducing particle defects in plasma etch chambers
US10477665B2 (en) * 2012-04-13 2019-11-12 Amastan Technologies Inc. Microwave plasma torch generating laminar flow for materials processing
JP6323849B2 (ja) 2012-08-28 2018-05-16 アジレント・テクノロジーズ・インクＡｇｉｌｅｎｔ Ｔｅｃｈｎｏｌｏｇｉｅｓ， Ｉｎｃ． 電磁導波路およびプラズマ源を含む機器、プラズマ生成方法
FR2995913B1 (fr) * 2012-09-24 2014-10-10 Commissariat Energie Atomique Procede de formation d'une couche de silicium epitaxiee.
US9374853B2 (en) 2013-02-08 2016-06-21 Letourneau University Method for joining two dissimilar materials and a microwave system for accomplishing the same
JP5717888B2 (ja) * 2013-02-25 2015-05-13 東京エレクトロン株式会社 プラズマ処理装置
US9550694B2 (en) 2014-03-31 2017-01-24 Corning Incorporated Methods and apparatus for material processing using plasma thermal source
US9533909B2 (en) 2014-03-31 2017-01-03 Corning Incorporated Methods and apparatus for material processing using atmospheric thermal plasma reactor
US20160200618A1 (en) * 2015-01-08 2016-07-14 Corning Incorporated Method and apparatus for adding thermal energy to a glass melt
CN107926107B (zh) * 2015-07-31 2020-07-03 安捷伦科技有限公司 微波等离子体产生室
US11930582B2 (en) 2018-05-01 2024-03-12 Sunbeam Technologies, Llc Method and apparatus for torsional magnetic reconnection
WO2019212595A1 (en) * 2018-05-01 2019-11-07 Sunbeam Technologies, Llc Method and apparatus for torsional magnetic reconnection
US20200258718A1 (en) * 2019-02-07 2020-08-13 Mattson Technology, Inc. Gas Supply With Angled Injectors In Plasma Processing Apparatus
JP2022527863A (ja) * 2019-04-05 2022-06-06 パイロウェーブ・インコーポレイテッド マイクロ波熱分解システムのための内部冷却されるインピーダンスチューナ
CN111715489B (zh) * 2020-07-01 2022-07-05 矿冶科技集团有限公司 大尺寸筒形件可磨耗涂层喷涂方法
CN113097676B (zh) * 2021-03-25 2022-03-29 广东省蓝波湾智能科技有限公司 一种波导同轴转换器

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017115438A1 (de) * 2017-06-06 2018-12-06 Fricke Und Mallah Microwave Technology Gmbh Vorrichtung zum erzeugen eines plasmastrahls im mhz- und ghzbereich mit tem- und hohlleitermoden

Also Published As

Publication number Publication date
EP0710054B1 (de) 1998-09-30
CN1127978A (zh) 1996-07-31
KR960013547A (ko) 1996-05-22
EP0710054A1 (de) 1996-05-01
MY138630A (en) 2009-07-31
US5734143A (en) 1998-03-31
CN1057422C (zh) 2000-10-11
DE69505087D1 (de) 1998-11-05
TW285746B (de) 1996-09-11
KR100189311B1 (ko) 1999-06-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee