DE69503260T2 - Verbindungsanordnung einer elektrischen Schaltung - Google Patents

Verbindungsanordnung einer elektrischen Schaltung

Info

Publication number
DE69503260T2
DE69503260T2 DE69503260T DE69503260T DE69503260T2 DE 69503260 T2 DE69503260 T2 DE 69503260T2 DE 69503260 T DE69503260 T DE 69503260T DE 69503260 T DE69503260 T DE 69503260T DE 69503260 T2 DE69503260 T2 DE 69503260T2
Authority
DE
Germany
Prior art keywords
electrical circuit
connection arrangement
arrangement
connection
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69503260T
Other languages
English (en)
Other versions
DE69503260D1 (de
Inventor
Elwyn Paul Michael Wakefield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Ltd Great Britain
Original Assignee
SGS Thomson Microelectronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics Ltd filed Critical SGS Thomson Microelectronics Ltd
Publication of DE69503260D1 publication Critical patent/DE69503260D1/de
Application granted granted Critical
Publication of DE69503260T2 publication Critical patent/DE69503260T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Metallurgy (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
DE69503260T 1994-01-11 1995-01-10 Verbindungsanordnung einer elektrischen Schaltung Expired - Fee Related DE69503260T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9400384A GB9400384D0 (en) 1994-01-11 1994-01-11 Circuit connection in an electrical assembly

Publications (2)

Publication Number Publication Date
DE69503260D1 DE69503260D1 (de) 1998-08-13
DE69503260T2 true DE69503260T2 (de) 1998-11-05

Family

ID=10748607

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69503260T Expired - Fee Related DE69503260T2 (de) 1994-01-11 1995-01-10 Verbindungsanordnung einer elektrischen Schaltung

Country Status (5)

Country Link
US (1) US5561594A (de)
EP (1) EP0662732B1 (de)
JP (1) JPH07263092A (de)
DE (1) DE69503260T2 (de)
GB (1) GB9400384D0 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10159119A1 (de) * 2001-12-01 2003-06-18 Semikron Elektronik Gmbh Umrichter in Druckkontaktierung

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US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5897326A (en) * 1993-11-16 1999-04-27 Eldridge; Benjamin N. Method of exercising semiconductor devices
US6023103A (en) * 1994-11-15 2000-02-08 Formfactor, Inc. Chip-scale carrier for semiconductor devices including mounted spring contacts
KR100335168B1 (ko) * 1994-11-15 2002-05-04 이고르 와이. 칸드로스 반도체 장치에 일시 접속후 영구 접속하는 방법
US6229320B1 (en) * 1994-11-18 2001-05-08 Fujitsu Limited IC socket, a test method using the same and an IC socket mounting mechanism
TW441227B (en) * 1995-05-26 2001-06-16 E Tec Ag Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board
US20020004320A1 (en) 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US5694296A (en) * 1995-12-20 1997-12-02 Motorola, Inc. Multipoint electrical interconnection having deformable J-hooks
US5774341A (en) * 1995-12-20 1998-06-30 Motorola, Inc. Solderless electrical interconnection including metallized hook and loop fasteners
US6007348A (en) * 1996-05-07 1999-12-28 Advanced Intercommunications Corporation Solder ball terminal
CH693478A5 (fr) 1996-05-10 2003-08-15 E Tec Ag Socle de connexion de deux composants électriques.
US5764486A (en) * 1996-10-10 1998-06-09 Hewlett Packard Company Cost effective structure and method for interconnecting a flip chip with a substrate
US5829988A (en) * 1996-11-14 1998-11-03 Amkor Electronics, Inc. Socket assembly for integrated circuit chip carrier package
JP2856195B2 (ja) * 1997-05-20 1999-02-10 日本電気株式会社 回路基板に対するデバイスの実装構造
AU8280398A (en) * 1997-06-30 1999-01-19 Formfactor, Inc. Sockets for semiconductor devices with spring contact elements
US5944199A (en) * 1997-11-25 1999-08-31 Micron Technology, Inc. Integrated circuit package support system
AU3407699A (en) * 1998-05-22 1999-12-13 Reipur Technology A/S Means for providing electrical contact
US6272741B1 (en) * 1998-07-24 2001-08-14 Autosplice, Inc. Hybrid solder ball and pin grid array circuit board interconnect system and method
US6323437B1 (en) * 1998-07-30 2001-11-27 Lucent Technologies Inc. Spring clamp adapted for coupling with a circuit board
US6627483B2 (en) * 1998-12-04 2003-09-30 Formfactor, Inc. Method for mounting an electronic component
JP3829050B2 (ja) * 2000-08-29 2006-10-04 松下電器産業株式会社 一体型電子部品
JP4744689B2 (ja) * 2000-12-11 2011-08-10 パナソニック株式会社 粘性流体転写装置及び電子部品実装装置
JP2003234433A (ja) * 2001-10-01 2003-08-22 Matsushita Electric Ind Co Ltd 半導体装置、半導体装置の実装方法、ならびに実装体およびその製造方法
JP3899075B2 (ja) 2002-03-05 2007-03-28 リカ デンシ アメリカ， インコーポレイテッド 電子パッケージと試験機器をインターフェースするための装置
US20040000428A1 (en) * 2002-06-26 2004-01-01 Mirng-Ji Lii Socketless package to circuit board assemblies and methods of using same
US20040163717A1 (en) * 2003-02-21 2004-08-26 Cookson Electronics, Inc. MEMS device assembly
US20050012212A1 (en) * 2003-07-17 2005-01-20 Cookson Electronics, Inc. Reconnectable chip interface and chip package
US20050056946A1 (en) * 2003-09-16 2005-03-17 Cookson Electronics, Inc. Electrical circuit assembly with improved shock resistance
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
US20050151273A1 (en) * 2003-12-30 2005-07-14 Arnold Richard W. Semiconductor chip package
US7838997B2 (en) 2005-06-14 2010-11-23 John Trezza Remote chip attachment
US8456015B2 (en) 2005-06-14 2013-06-04 Cufer Asset Ltd. L.L.C. Triaxial through-chip connection
US7781886B2 (en) 2005-06-14 2010-08-24 John Trezza Electronic chip contact structure
US7534722B2 (en) 2005-06-14 2009-05-19 John Trezza Back-to-front via process
US7560813B2 (en) 2005-06-14 2009-07-14 John Trezza Chip-based thermo-stack
US7786592B2 (en) 2005-06-14 2010-08-31 John Trezza Chip capacitive coupling
US7687400B2 (en) 2005-06-14 2010-03-30 John Trezza Side stacking apparatus and method
US7851348B2 (en) 2005-06-14 2010-12-14 Abhay Misra Routingless chip architecture
US7946331B2 (en) 2005-06-14 2011-05-24 Cufer Asset Ltd. L.L.C. Pin-type chip tooling
US7521806B2 (en) 2005-06-14 2009-04-21 John Trezza Chip spanning connection
US7767493B2 (en) 2005-06-14 2010-08-03 John Trezza Post & penetration interconnection
US7687397B2 (en) 2006-06-06 2010-03-30 John Trezza Front-end processed wafer having through-chip connections
US7670874B2 (en) 2007-02-16 2010-03-02 John Trezza Plated pillar package formation
CN102301469A (zh) * 2009-01-30 2011-12-28 惠普开发有限公司 具有焊球和管脚的集成电路附接结构
US8274181B2 (en) * 2009-04-06 2012-09-25 Fsp Technology Inc. Structure for transmission in power supply
CN102215638B (zh) * 2010-04-09 2013-03-06 昌硕科技(上海)有限公司 在表面贴装技术工艺中焊接通孔直插式元件的方法
US8535956B2 (en) * 2012-02-14 2013-09-17 International Business Machines Corporation Chip attach frame

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US4373778A (en) * 1980-12-30 1983-02-15 International Business Machines Corporation Connector implemented with fiber optic means and site therein for integrated circuit chips
US4433886A (en) * 1981-12-17 1984-02-28 Elco Corporation Connector mounting for integrated circuit chip packages
US4508405A (en) * 1982-04-29 1985-04-02 Augat Inc. Electronic socket having spring probe contacts
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
JPH01235261A (ja) * 1988-03-15 1989-09-20 Hitachi Ltd 半導体装置及びその製造方法
US5399982A (en) * 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
JPH0574532A (ja) * 1990-01-18 1993-03-26 Kel Corp 電気コネクタ
JPH03268440A (ja) * 1990-03-19 1991-11-29 Hitachi Ltd 半導体チップの実装構造
JP2936819B2 (ja) * 1991-07-24 1999-08-23 日本電気株式会社 Ｉｃチップの実装構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10159119A1 (de) * 2001-12-01 2003-06-18 Semikron Elektronik Gmbh Umrichter in Druckkontaktierung
DE10159119B4 (de) * 2001-12-01 2005-02-17 Semikron Elektronik Gmbh Umrichter in Druckkontaktierung

Also Published As

Publication number Publication date
EP0662732B1 (de) 1998-07-08
GB9400384D0 (en) 1994-03-09
US5561594A (en) 1996-10-01
JPH07263092A (ja) 1995-10-13
DE69503260D1 (de) 1998-08-13
EP0662732A1 (de) 1995-07-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee