DE69430019D1 - Herstellungsverfahren für ein Leiterrahmen-Material - Google Patents

Herstellungsverfahren für ein Leiterrahmen-Material

Info

Publication number
DE69430019D1
DE69430019D1 DE69430019T DE69430019T DE69430019D1 DE 69430019 D1 DE69430019 D1 DE 69430019D1 DE 69430019 T DE69430019 T DE 69430019T DE 69430019 T DE69430019 T DE 69430019T DE 69430019 D1 DE69430019 D1 DE 69430019D1
Authority
DE
Germany
Prior art keywords
manufacturing process
lead frame
frame material
lead
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69430019T
Other languages
English (en)
Other versions
DE69430019T2 (de
Inventor
Akio Uesugi
Tsutomu Kakei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of DE69430019D1 publication Critical patent/DE69430019D1/de
Application granted granted Critical
Publication of DE69430019T2 publication Critical patent/DE69430019T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Printing Plates And Materials Therefor (AREA)
DE69430019T 1993-03-24 1994-03-23 Herstellungsverfahren für ein Leiterrahmen-Material Expired - Lifetime DE69430019T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08779993A JP3156945B2 (ja) 1993-03-24 1993-03-24 リード・フレーム形成用材の作製方法

Publications (2)

Publication Number Publication Date
DE69430019D1 true DE69430019D1 (de) 2002-04-11
DE69430019T2 DE69430019T2 (de) 2002-07-11

Family

ID=13925034

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69430019T Expired - Lifetime DE69430019T2 (de) 1993-03-24 1994-03-23 Herstellungsverfahren für ein Leiterrahmen-Material

Country Status (4)

Country Link
US (1) US6309698B1 (de)
EP (1) EP0617332B1 (de)
JP (1) JP3156945B2 (de)
DE (1) DE69430019T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3281714B2 (ja) * 1994-03-10 2002-05-13 富士写真フイルム株式会社 リード・フレーム形成材料
JP3262448B2 (ja) * 1994-03-14 2002-03-04 富士写真フイルム株式会社 リード・フレーム形成材料
US20050074552A1 (en) * 2003-10-07 2005-04-07 Howard Ge Photoresist coating process for microlithography
KR101232249B1 (ko) * 2004-08-10 2013-02-12 간또 가가꾸 가부시끼가이샤 반도체 기판 세정액 및 반도체 기판 세정방법
CN101425468B (zh) * 2007-10-29 2012-07-04 飞思卡尔半导体（中国）有限公司 经过涂敷的引线框
US9129951B2 (en) 2013-10-17 2015-09-08 Freescale Semiconductor, Inc. Coated lead frame bond finger
CN111405772B (zh) * 2020-03-10 2021-04-20 昆山一鼎工业科技有限公司 半导体器件的表面处理方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3647443A (en) * 1969-09-12 1972-03-07 Eastman Kodak Co Light-sensitive quinone diazide polymers and polymer compositions
JPS5645127B2 (de) * 1974-02-25 1981-10-24
US4089733A (en) * 1975-09-12 1978-05-16 Amp Incorporated Method of forming complex shaped metal-plastic composite lead frames for IC packaging
US4148649A (en) * 1977-02-09 1979-04-10 Polychrome Corporation Method for producing lithographic printing plates
US4259434A (en) * 1977-10-24 1981-03-31 Fuji Photo Film Co., Ltd. Method for developing positive acting light-sensitive planographic printing plate
JPS5734557A (en) * 1980-08-07 1982-02-24 Toray Ind Inc Preventing method for sticking of surface of water-developable photosensitive polyamide resin layer
DE3045516A1 (de) * 1980-12-03 1982-07-08 Basf Ag, 6700 Ludwigshafen Lichtempfindliches mehrschichtenmaterial und verfahren zur herstellung von haftschichten dafuer
US4527185A (en) * 1981-01-12 1985-07-02 Avx Corporation Integrated circuit device and subassembly
JPS5856360A (ja) * 1981-09-29 1983-04-04 Sumitomo Metal Mining Co Ltd Ｉｃ用リ−ドフレ−ム及びその製造方法
US4451845A (en) * 1981-12-22 1984-05-29 Avx Corporation Lead frame device including ceramic encapsulated capacitor and IC chip
US4441118A (en) * 1983-01-13 1984-04-03 Olin Corporation Composite copper nickel alloys with improved solderability shelf life
CH668654A5 (en) * 1985-04-13 1989-01-13 Kurt Etter Dr Continuous prodn. equipment for presensitised lithographic plates - incorporates station for oxidn. or silicate treatment of strip or plate between preliminary and final rinses
JPS6227192A (ja) * 1985-07-26 1987-02-05 Fuji Photo Film Co Ltd 平版印刷版用支持体の製造方法
JPS62154766A (ja) * 1985-12-27 1987-07-09 Nec Corp 半導体装置用リ−ドフレ−ムの製造方法
JPS62196191A (ja) * 1986-02-24 1987-08-29 Fuji Photo Film Co Ltd 平版印刷版用支持体の製造方法
US4795694A (en) * 1986-06-20 1989-01-03 Siemens Aktiengesellschaft Manufacture of fine structures for semiconductor contacting
US4872946A (en) * 1987-02-23 1989-10-10 Fuji Photo Film Co., Ltd. Method of manufacturing supports for lithographic printing plate
US5183724A (en) * 1990-12-18 1993-02-02 Amkor Electronics, Inc. Method of producing a strip of lead frames for integrated circuit dies in a continuous system

Also Published As

Publication number Publication date
US6309698B1 (en) 2001-10-30
DE69430019T2 (de) 2002-07-11
EP0617332A1 (de) 1994-09-28
EP0617332B1 (de) 2002-03-06
JP3156945B2 (ja) 2001-04-16
JPH06275756A (ja) 1994-09-30

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: FUJIFILM CORP., TOKIO/TOKYO, JP