DE69425221T2 - Verfahren und Vorrichtung zum Beschichten von flächigen Trägern unter Verwendung eines oszillierenden Futters - Google Patents

Verfahren und Vorrichtung zum Beschichten von flächigen Trägern unter Verwendung eines oszillierenden Futters

Info

Publication number
DE69425221T2
DE69425221T2 DE69425221T DE69425221T DE69425221T2 DE 69425221 T2 DE69425221 T2 DE 69425221T2 DE 69425221 T DE69425221 T DE 69425221T DE 69425221 T DE69425221 T DE 69425221T DE 69425221 T2 DE69425221 T2 DE 69425221T2
Authority
DE
Germany
Prior art keywords
flat substrates
coating flat
chuck
oscillating
oscillating chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69425221T
Other languages
English (en)
Other versions
DE69425221D1 (de
Inventor
Michael L Parodi
Roy E Hurtig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Systems Inc
Original Assignee
Semiconductor Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Systems Inc filed Critical Semiconductor Systems Inc
Publication of DE69425221D1 publication Critical patent/DE69425221D1/de
Application granted granted Critical
Publication of DE69425221T2 publication Critical patent/DE69425221T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69425221T 1993-11-12 1994-11-10 Verfahren und Vorrichtung zum Beschichten von flächigen Trägern unter Verwendung eines oszillierenden Futters Expired - Fee Related DE69425221T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15203693A 1993-11-12 1993-11-12

Publications (2)

Publication Number Publication Date
DE69425221D1 DE69425221D1 (de) 2000-08-17
DE69425221T2 true DE69425221T2 (de) 2000-12-21

Family

ID=22541281

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69425221T Expired - Fee Related DE69425221T2 (de) 1993-11-12 1994-11-10 Verfahren und Vorrichtung zum Beschichten von flächigen Trägern unter Verwendung eines oszillierenden Futters

Country Status (5)

Country Link
US (1) US5798140A (de)
EP (1) EP0653683B1 (de)
JP (1) JPH07273020A (de)
KR (1) KR100307852B1 (de)
DE (1) DE69425221T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5902399A (en) * 1995-07-27 1999-05-11 Micron Technology, Inc. Method and apparatus for improved coating of a semiconductor wafer
TW357389B (en) * 1996-12-27 1999-05-01 Tokyo Electric Ltd Apparatus and method for supplying process solution to surface of substrate to be processed
AT409462B (de) * 1998-10-08 2002-08-26 Thallner Erich Vorrichtung zum belacken von substraten
EP1124252A2 (de) * 2000-02-10 2001-08-16 Applied Materials, Inc. Verfahren und Vorrichtung zur Verarbeitung von Substraten
KR100413849B1 (ko) * 2000-12-28 2004-01-07 장영철 포토레지스트 도포 장치 및 방법
FR2833193B1 (fr) * 2001-12-11 2004-02-27 Valeo Climatisation Procede et installation de traitement de surfaces metalliques, notamment de surfaces d'echangeurs thermiques
US20030224105A1 (en) * 2002-05-30 2003-12-04 Symyx Technologies, Inc. Apparatus and methods for forming films on substrates
WO2004073048A2 (en) * 2002-05-30 2004-08-26 Symyx Technologies, Inc. Apparatus and methods for forming films on substrates
US20040071888A1 (en) * 2002-05-30 2004-04-15 Symyx Technologies, Inc. Apparatus and method of research for creating and testing thin films
US20040047994A1 (en) * 2002-09-09 2004-03-11 Robert Becker Method and apparatus for the removal of excess coating material from a honeycomb body
TWI232493B (en) * 2003-02-27 2005-05-11 Innolux Display Corp Method for photo-resistor coating
JP4464763B2 (ja) * 2004-08-20 2010-05-19 東京エレクトロン株式会社 現像装置及び現像方法
US7662436B1 (en) * 2005-05-27 2010-02-16 Infineon Technologies Ag Method of spin coating a film of non-uniform thickness
KR101017889B1 (ko) * 2009-01-05 2011-03-04 (주) 예스티 웨이퍼 쉐이커
US10871720B2 (en) * 2014-10-02 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for supporting a semiconductor wafer and method of vibrating a semiconductor wafer
FR3097142B1 (fr) * 2019-06-11 2022-05-27 Commissariat Energie Atomique Procédé de dépôt

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US505582A (en) * 1893-09-26 Speed-measure
FR2169768A1 (de) * 1972-10-02 1973-09-14 Kodak Pathe
US4001659A (en) * 1974-09-12 1977-01-04 Headway Research, Inc. Apparatus for spinning a microelectronic substrate
US4124411A (en) * 1976-09-02 1978-11-07 U.S. Philips Corporation Method of providing a layer of solid material on a substrate in which liquid from which the solid material can be formed, is spread over the substrate surface
US4271209A (en) * 1980-04-16 1981-06-02 Calspan Corporation Method and apparatus for coating the grooved bottoms of substrates
JPS6074624A (ja) * 1983-09-30 1985-04-26 Fujitsu Ltd レジスト膜の形成方法
JPS61236543A (ja) * 1985-04-12 1986-10-21 Internatl Rectifier Corp Japan Ltd フオトレジスト塗布装置
JPS6354725A (ja) * 1986-08-25 1988-03-09 Fuji Photo Film Co Ltd スピンコ−テイング方法及びその装置
US4806504A (en) * 1986-09-11 1989-02-21 Fairchild Semiconductor Corporation Planarization method
JPS63100972A (ja) * 1986-10-16 1988-05-06 Toshiba Corp 塗布装置
US4850299A (en) * 1988-05-24 1989-07-25 Merullo John G Semiconductor wafer coating apparatus with angular oscillation means
JPH0666255B2 (ja) * 1989-05-02 1994-08-24 三菱電機株式会社 スピン塗布装置及び方法
US5366757A (en) * 1992-10-30 1994-11-22 International Business Machines Corporation In situ resist control during spray and spin in vapor

Also Published As

Publication number Publication date
KR950015549A (ko) 1995-06-17
KR100307852B1 (ko) 2001-12-01
EP0653683A1 (de) 1995-05-17
US5798140A (en) 1998-08-25
DE69425221D1 (de) 2000-08-17
EP0653683B1 (de) 2000-07-12
JPH07273020A (ja) 1995-10-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee