DE69421738D1 - Halbleiter-Schmelzsicherungstrukturen - Google Patents
Halbleiter-SchmelzsicherungstrukturenInfo
- Publication number
- DE69421738D1 DE69421738D1 DE69421738T DE69421738T DE69421738D1 DE 69421738 D1 DE69421738 D1 DE 69421738D1 DE 69421738 T DE69421738 T DE 69421738T DE 69421738 T DE69421738 T DE 69421738T DE 69421738 D1 DE69421738 D1 DE 69421738D1
- Authority
- DE
- Germany
- Prior art keywords
- fuse structures
- semiconductor fuse
- semiconductor
- structures
- fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4167793A | 1993-04-01 | 1993-04-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69421738D1 true DE69421738D1 (de) | 1999-12-30 |
| DE69421738T2 DE69421738T2 (de) | 2000-06-29 |
Family
ID=21917753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1994621738 Expired - Fee Related DE69421738T2 (de) | 1993-04-01 | 1994-03-22 | Halbleiter-Schmelzsicherungstrukturen |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0618620B1 (de) |
| JP (1) | JPH06302699A (de) |
| DE (1) | DE69421738T2 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5650355A (en) * | 1995-03-30 | 1997-07-22 | Texas Instruments Incorporated | Process of making and process of trimming a fuse in a top level metal and in a step |
| US6624499B2 (en) * | 2002-02-28 | 2003-09-23 | Infineon Technologies Ag | System for programming fuse structure by electromigration of silicide enhanced by creating temperature gradient |
| JP2006286723A (ja) * | 2005-03-31 | 2006-10-19 | Yamaha Corp | 半導体装置および同装置におけるヒューズ素子の切断方法 |
| US7645645B2 (en) * | 2006-03-09 | 2010-01-12 | International Business Machines Corporation | Electrically programmable fuse structures with terminal portions residing at different heights, and methods of fabrication thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2625089A1 (de) * | 1976-06-04 | 1977-12-15 | Bosch Gmbh Robert | Anordnung zum auftrennen von leiterbahnen auf integrierten schaltkreisen |
| US4209894A (en) * | 1978-04-27 | 1980-07-01 | Texas Instruments Incorporated | Fusible-link semiconductor memory |
| JPS6084837A (ja) * | 1983-10-17 | 1985-05-14 | Hitachi Ltd | 半導体集積回路装置 |
| JPH0719842B2 (ja) * | 1985-05-23 | 1995-03-06 | 三菱電機株式会社 | 半導体装置の冗長回路 |
-
1994
- 1994-03-22 EP EP19940302043 patent/EP0618620B1/de not_active Expired - Lifetime
- 1994-03-22 DE DE1994621738 patent/DE69421738T2/de not_active Expired - Fee Related
- 1994-03-31 JP JP6274294A patent/JPH06302699A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE69421738T2 (de) | 2000-06-29 |
| JPH06302699A (ja) | 1994-10-28 |
| EP0618620B1 (de) | 1999-11-24 |
| EP0618620A1 (de) | 1994-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69631098D1 (de) | Halbleiterstrukturen | |
| DE69625265D1 (de) | Halbleiterstrukturen | |
| DE69433878T2 (de) | Kühlkörper | |
| BR9402128A (pt) | Fusível miniaturizado | |
| DE69407455T2 (de) | Halbleiterlaser | |
| DE59406106D1 (de) | Leistungshalbleiterbauelement | |
| DE69411364D1 (de) | Halbleiterlaser | |
| DE69415592D1 (de) | Sicherung | |
| FI945204A0 (fi) | Puolijohdekomponentti | |
| BR9400988A (pt) | Fusível | |
| DE69407374T2 (de) | Halbleiterlaser | |
| DE69421738T2 (de) | Halbleiter-Schmelzsicherungstrukturen | |
| DE9403685U1 (de) | Kühlkörper | |
| DE69402115D1 (de) | Halbleiterlaser | |
| DE69432168D1 (de) | Halbleitergehäuse | |
| DE9309654U1 (de) | Sicherungstrennschalter | |
| KR940025770U (ko) | 방열판 | |
| DE9208693U1 (de) | Sicherungstrennschalter | |
| KR950007353U (ko) | 반도체 제조장치 | |
| DE9410437U1 (de) | Schmelzsicherung | |
| DE69308097T2 (de) | Zweifachsicherungselement | |
| DE69423497D1 (de) | Sicherungsanordnung | |
| KR950021462U (ko) | 칩휴즈 | |
| KR950015482U (ko) | 휴즈장치 | |
| KR950015709U (ko) | 퓨즈 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8339 | Ceased/non-payment of the annual fee |