DE69417215D1 - Zusammenbaueinheit - Google Patents
ZusammenbaueinheitInfo
- Publication number
- DE69417215D1 DE69417215D1 DE69417215T DE69417215T DE69417215D1 DE 69417215 D1 DE69417215 D1 DE 69417215D1 DE 69417215 T DE69417215 T DE 69417215T DE 69417215 T DE69417215 T DE 69417215T DE 69417215 D1 DE69417215 D1 DE 69417215D1
- Authority
- DE
- Germany
- Prior art keywords
- pct
- sec
- semiconductor components
- substrate surfaces
- date
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2210/00—Converter types
- B60L2210/20—AC to AC converters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2240/00—Control parameters of input or output; Target parameters
- B60L2240/40—Drive Train control parameters
- B60L2240/52—Drive Train control parameters related to converters
- B60L2240/526—Operating parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/72—Electric energy management in electromobility
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Connection Of Plates (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB939301049A GB9301049D0 (en) | 1993-01-20 | 1993-01-20 | Mounting assembly |
PCT/GB1994/000110 WO1994017649A1 (en) | 1993-01-20 | 1994-01-20 | Mounting assembly for power semiconductors |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69417215D1 true DE69417215D1 (de) | 1999-04-22 |
Family
ID=10728988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69417215T Expired - Lifetime DE69417215D1 (de) | 1993-01-20 | 1994-01-20 | Zusammenbaueinheit |
Country Status (9)
Country | Link |
---|---|
US (1) | US5586004A (de) |
EP (1) | EP0680685B1 (de) |
JP (1) | JPH08505985A (de) |
AT (1) | ATE177896T1 (de) |
AU (1) | AU696858B2 (de) |
CA (1) | CA2152359A1 (de) |
DE (1) | DE69417215D1 (de) |
GB (1) | GB9301049D0 (de) |
WO (1) | WO1994017649A1 (de) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19514545A1 (de) * | 1995-04-20 | 1996-10-24 | Daimler Benz Ag | Anordnung von mehreren mit elektronischen Bauelementen versehenen Mikrokühleinrichtungen |
FR2745437A1 (fr) * | 1996-02-28 | 1997-08-29 | Leroy Somer Moteurs | Carter de refroidissement pour appareil electrique, une machine tournante comportant un tel carter, ainsi que le procede de fabrication d'un tel carter |
US5822188A (en) * | 1996-04-10 | 1998-10-13 | Intergraph Corporation | Removable circuit board with ducted cooling |
DE19645635C1 (de) * | 1996-11-06 | 1998-04-23 | Telefunken Microelectron | Steuergerät zur Ansteuerung des Elektromotors von Kraftfahrzeugen |
JP3366244B2 (ja) * | 1998-02-04 | 2003-01-14 | 富士通株式会社 | 電子機器 |
US6239502B1 (en) * | 1999-11-22 | 2001-05-29 | Bae Systems Controls | Phase change assisted heat sink |
US6469901B1 (en) | 2000-05-15 | 2002-10-22 | 3C Interactive, Inc. | System and method for cartridge-based, geometry-variant scalable electronic systems |
US6462949B1 (en) * | 2000-08-07 | 2002-10-08 | Thermotek, Inc. | Electronic enclosure cooling system |
WO2002028159A1 (en) * | 2000-09-28 | 2002-04-04 | 3C Interactive, Inc. | Apparatus, system, and method for hybrid-geometry resource cartridge-based, geometry-variant scalable electronic systems |
JP3829641B2 (ja) * | 2001-04-17 | 2006-10-04 | 株式会社日立製作所 | パワー半導体モジュール |
US6580608B1 (en) * | 2001-12-21 | 2003-06-17 | Intel Corporation | Method and apparatus for thermally controlling multiple electronic components |
TW545623U (en) * | 2001-12-27 | 2003-08-01 | Chin-Wen Wang | Rotation type CPU cooling device |
US6980450B2 (en) * | 2002-01-24 | 2005-12-27 | Inverters Unlimited, Inc. | High power density inverter and components thereof |
DE10222471A1 (de) * | 2002-05-22 | 2003-12-18 | Lenze Drive Systems Gmbh | Kühlkörper für einen Frequenzumrichter |
US6904236B2 (en) * | 2002-06-03 | 2005-06-07 | Olympus Corporation | Camera and photographing lens barrel |
US6673649B1 (en) * | 2002-07-05 | 2004-01-06 | Micron Technology, Inc. | Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages |
TW592029B (en) * | 2003-04-11 | 2004-06-11 | Delta Electronics Inc | Electronic apparatus with natural convection structure |
US6778389B1 (en) * | 2003-07-03 | 2004-08-17 | Visteon Global Technologies, Inc. | Microelectronic package with tubular housing |
US7180736B2 (en) * | 2003-07-10 | 2007-02-20 | Visteon Global Technologies, Inc. | Microelectronic package within cylindrical housing |
TWI302821B (en) * | 2005-08-18 | 2008-11-01 | Ind Tech Res Inst | Flexible circuit board with heat sink |
TW200741470A (en) * | 2006-04-19 | 2007-11-01 | Tyan Computer Corp | Multi-processor system and tubelike computer architecture thereof |
US7686469B2 (en) | 2006-09-30 | 2010-03-30 | Ruud Lighting, Inc. | LED lighting fixture |
US9243794B2 (en) | 2006-09-30 | 2016-01-26 | Cree, Inc. | LED light fixture with fluid flow to and from the heat sink |
US20090086491A1 (en) * | 2007-09-28 | 2009-04-02 | Ruud Lighting, Inc. | Aerodynamic LED Floodlight Fixture |
US9028087B2 (en) | 2006-09-30 | 2015-05-12 | Cree, Inc. | LED light fixture |
TWI337837B (en) * | 2007-06-08 | 2011-02-21 | Ama Precision Inc | Heat sink and modular heat sink |
JP4788666B2 (ja) * | 2007-06-15 | 2011-10-05 | 株式会社デンソー | パワーモジュール |
US7887216B2 (en) | 2008-03-10 | 2011-02-15 | Cooper Technologies Company | LED-based lighting system and method |
US7796388B2 (en) * | 2008-03-17 | 2010-09-14 | Ut-Battelle, Llc | Direct cooled power electronics substrate |
US8123382B2 (en) | 2008-10-10 | 2012-02-28 | Cooper Technologies Company | Modular extruded heat sink |
FI122215B (fi) * | 2009-03-13 | 2011-10-14 | Abb Oy | Järjestely moottoriohjainta varten |
DE102009024370B4 (de) * | 2009-06-09 | 2014-04-30 | Semikron Elektronik Gmbh & Co. Kg | Stromrichteranordnung mit Kühleinrichtung und Herstellungsverfahren hierzu |
US9220180B2 (en) * | 2010-12-09 | 2015-12-22 | Richard Anthony Dunn, JR. | System and methods for scalable parallel data processing and process control |
USD669045S1 (en) * | 2010-05-19 | 2012-10-16 | Nippon Mektron, Ltd. | Flexible printed circuit board |
USD669046S1 (en) * | 2010-05-19 | 2012-10-16 | Nippon Mektron, Ltd | Flexible printed circuit board |
US8279597B2 (en) * | 2010-05-27 | 2012-10-02 | International Business Machines Corporation | Heatsink allowing in-situ maintenance in a stackable module |
US8174826B2 (en) | 2010-05-27 | 2012-05-08 | International Business Machines Corporation | Liquid cooling system for stackable modules in energy-efficient computing systems |
US8358503B2 (en) * | 2010-05-28 | 2013-01-22 | International Business Machines Corporation | Stackable module for energy-efficient computing systems |
US8179674B2 (en) | 2010-05-28 | 2012-05-15 | International Business Machines Corporation | Scalable space-optimized and energy-efficient computing system |
US20120169202A1 (en) * | 2010-12-28 | 2012-07-05 | Tahoe Lighting Concept, Inc. | Light emitting diode (led) and organic light emitting diode (oled) lighting sources |
DE102011004022B4 (de) * | 2011-02-14 | 2015-12-24 | Osram Gmbh | Leuchtvorrichtung |
JP5285097B2 (ja) * | 2011-02-21 | 2013-09-11 | 株式会社リョーサン | ヒートシンク |
FR2989861A1 (fr) * | 2012-04-20 | 2013-10-25 | No Rack | Baie de serveurs informatiques |
EP2672618A1 (de) * | 2012-06-04 | 2013-12-11 | ABB Oy | Modularer Motorwechselrichter mit durch Kühlkörper gebildeten inneren Kühlkanal und ringförmigen Kondensator auf der Aussenseite |
US8842432B2 (en) * | 2012-09-22 | 2014-09-23 | Facebook, Inc. | Arrangement of computing assets in a data center |
JP5657716B2 (ja) * | 2013-01-15 | 2015-01-21 | ファナック株式会社 | 放熱器を備えたモータ駆動装置 |
JP5695115B2 (ja) * | 2013-03-30 | 2015-04-01 | 三協立山株式会社 | ヒートシンク及びその製造方法 |
WO2016065485A1 (en) | 2014-10-31 | 2016-05-06 | Algozen Corporation | A mounting apparatus, for mounting at least one heat dissipating electrical device, optionally including a heat sink body for solid, gas and fluid heat exchange, and circuit board assembly providing interface between circuits |
TWI539894B (zh) * | 2014-11-28 | 2016-06-21 | 財團法人工業技術研究院 | 功率模組 |
JP5976235B1 (ja) * | 2015-03-25 | 2016-08-23 | 三菱電機株式会社 | 電力変換装置 |
DE112016005528T5 (de) | 2015-12-04 | 2018-08-30 | Rohm Co., Ltd. | Leistungsmodulvorrichtung, Kühlstruktur und elektrisches Fahrzeug oder elektrisches Hybridfahrzeug |
US9920892B2 (en) | 2016-02-12 | 2018-03-20 | Gary D. Yurich | Modular LED system for a lighting assembly |
FR3091141B1 (fr) * | 2018-12-21 | 2021-06-25 | Valeo Siemens Eautomotive France Sas | Ensemble électrique d’une barre de connexion électrique et d’un module de refroidissement |
US11659696B2 (en) * | 2019-11-21 | 2023-05-23 | Zoox, Inc. | Vehicle computer cooling architecture |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL291309A (de) * | 1962-08-29 | |||
JPS57118656A (en) * | 1981-01-16 | 1982-07-23 | Nec Corp | Mounting structure of large scale integrated circuit (lsi) |
DE8429523U1 (de) * | 1984-10-08 | 1984-11-29 | Nixdorf Computer Ag, 4790 Paderborn | Kühlkörper für elektronische Bauelemente und/oder Geräte |
US4880050A (en) * | 1988-06-20 | 1989-11-14 | The Boeing Company | Thermal management system |
US5063475A (en) * | 1990-03-19 | 1991-11-05 | International Business Machines Corporation | Multileveled electronic assembly with cooling means |
DE69220228T2 (de) * | 1991-08-01 | 1997-09-25 | Wavedriver Ltd | Batteriegespeistes elektrisches Fahrzeug und elektrisches Versorgungssystem |
GB9116661D0 (en) * | 1991-08-01 | 1991-09-18 | The Technology Partnership Ltd | Vehicle cooling system |
-
1993
- 1993-01-20 GB GB939301049A patent/GB9301049D0/en active Pending
-
1994
- 1994-01-20 DE DE69417215T patent/DE69417215D1/de not_active Expired - Lifetime
- 1994-01-20 EP EP94904293A patent/EP0680685B1/de not_active Expired - Lifetime
- 1994-01-20 AU AU58415/94A patent/AU696858B2/en not_active Ceased
- 1994-01-20 CA CA002152359A patent/CA2152359A1/en not_active Abandoned
- 1994-01-20 AT AT94904293T patent/ATE177896T1/de active
- 1994-01-20 US US08/464,739 patent/US5586004A/en not_active Expired - Fee Related
- 1994-01-20 WO PCT/GB1994/000110 patent/WO1994017649A1/en active IP Right Grant
- 1994-01-20 JP JP6516798A patent/JPH08505985A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0680685B1 (de) | 1999-03-17 |
EP0680685A1 (de) | 1995-11-08 |
CA2152359A1 (en) | 1994-08-04 |
WO1994017649A1 (en) | 1994-08-04 |
AU5841594A (en) | 1994-08-15 |
JPH08505985A (ja) | 1996-06-25 |
US5586004A (en) | 1996-12-17 |
GB9301049D0 (en) | 1993-03-10 |
ATE177896T1 (de) | 1999-04-15 |
AU696858B2 (en) | 1998-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |