DE69417215D1 - Zusammenbaueinheit - Google Patents

Zusammenbaueinheit

Info

Publication number
DE69417215D1
DE69417215D1 DE69417215T DE69417215T DE69417215D1 DE 69417215 D1 DE69417215 D1 DE 69417215D1 DE 69417215 T DE69417215 T DE 69417215T DE 69417215 T DE69417215 T DE 69417215T DE 69417215 D1 DE69417215 D1 DE 69417215D1
Authority
DE
Germany
Prior art keywords
pct
sec
semiconductor components
substrate surfaces
date
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69417215T
Other languages
English (en)
Inventor
Ross Martin Green
Michael Kellaway
David Shemmans
David James Mcshane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wavedriver Ltd
Original Assignee
Wavedriver Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wavedriver Ltd filed Critical Wavedriver Ltd
Application granted granted Critical
Publication of DE69417215D1 publication Critical patent/DE69417215D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2210/00—Converter types
    • B60L2210/20—AC to AC converters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00—Control parameters of input or output; Target parameters
    • B60L2240/40—Drive Train control parameters
    • B60L2240/52—Drive Train control parameters related to converters
    • B60L2240/526—Operating parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/72—Electric energy management in electromobility

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Of Plates (AREA)
DE69417215T 1993-01-20 1994-01-20 Zusammenbaueinheit Expired - Lifetime DE69417215D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB939301049A GB9301049D0 (en) 1993-01-20 1993-01-20 Mounting assembly
PCT/GB1994/000110 WO1994017649A1 (en) 1993-01-20 1994-01-20 Mounting assembly for power semiconductors

Publications (1)

Publication Number Publication Date
DE69417215D1 true DE69417215D1 (de) 1999-04-22

Family

ID=10728988

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69417215T Expired - Lifetime DE69417215D1 (de) 1993-01-20 1994-01-20 Zusammenbaueinheit

Country Status (9)

Country Link
US (1) US5586004A (de)
EP (1) EP0680685B1 (de)
JP (1) JPH08505985A (de)
AT (1) ATE177896T1 (de)
AU (1) AU696858B2 (de)
CA (1) CA2152359A1 (de)
DE (1) DE69417215D1 (de)
GB (1) GB9301049D0 (de)
WO (1) WO1994017649A1 (de)

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DE19514545A1 (de) * 1995-04-20 1996-10-24 Daimler Benz Ag Anordnung von mehreren mit elektronischen Bauelementen versehenen Mikrokühleinrichtungen
FR2745437A1 (fr) * 1996-02-28 1997-08-29 Leroy Somer Moteurs Carter de refroidissement pour appareil electrique, une machine tournante comportant un tel carter, ainsi que le procede de fabrication d'un tel carter
US5822188A (en) * 1996-04-10 1998-10-13 Intergraph Corporation Removable circuit board with ducted cooling
DE19645635C1 (de) * 1996-11-06 1998-04-23 Telefunken Microelectron Steuergerät zur Ansteuerung des Elektromotors von Kraftfahrzeugen
JP3366244B2 (ja) * 1998-02-04 2003-01-14 富士通株式会社 電子機器
US6239502B1 (en) * 1999-11-22 2001-05-29 Bae Systems Controls Phase change assisted heat sink
US6469901B1 (en) 2000-05-15 2002-10-22 3C Interactive, Inc. System and method for cartridge-based, geometry-variant scalable electronic systems
US6462949B1 (en) * 2000-08-07 2002-10-08 Thermotek, Inc. Electronic enclosure cooling system
WO2002028159A1 (en) * 2000-09-28 2002-04-04 3C Interactive, Inc. Apparatus, system, and method for hybrid-geometry resource cartridge-based, geometry-variant scalable electronic systems
JP3829641B2 (ja) * 2001-04-17 2006-10-04 株式会社日立製作所 パワー半導体モジュール
US6580608B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Method and apparatus for thermally controlling multiple electronic components
TW545623U (en) * 2001-12-27 2003-08-01 Chin-Wen Wang Rotation type CPU cooling device
US6980450B2 (en) * 2002-01-24 2005-12-27 Inverters Unlimited, Inc. High power density inverter and components thereof
DE10222471A1 (de) * 2002-05-22 2003-12-18 Lenze Drive Systems Gmbh Kühlkörper für einen Frequenzumrichter
US6904236B2 (en) * 2002-06-03 2005-06-07 Olympus Corporation Camera and photographing lens barrel
US6673649B1 (en) * 2002-07-05 2004-01-06 Micron Technology, Inc. Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
TW592029B (en) * 2003-04-11 2004-06-11 Delta Electronics Inc Electronic apparatus with natural convection structure
US6778389B1 (en) * 2003-07-03 2004-08-17 Visteon Global Technologies, Inc. Microelectronic package with tubular housing
US7180736B2 (en) * 2003-07-10 2007-02-20 Visteon Global Technologies, Inc. Microelectronic package within cylindrical housing
TWI302821B (en) * 2005-08-18 2008-11-01 Ind Tech Res Inst Flexible circuit board with heat sink
TW200741470A (en) * 2006-04-19 2007-11-01 Tyan Computer Corp Multi-processor system and tubelike computer architecture thereof
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US20090086491A1 (en) * 2007-09-28 2009-04-02 Ruud Lighting, Inc. Aerodynamic LED Floodlight Fixture
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
TWI337837B (en) * 2007-06-08 2011-02-21 Ama Precision Inc Heat sink and modular heat sink
JP4788666B2 (ja) * 2007-06-15 2011-10-05 株式会社デンソー パワーモジュール
US7887216B2 (en) 2008-03-10 2011-02-15 Cooper Technologies Company LED-based lighting system and method
US7796388B2 (en) * 2008-03-17 2010-09-14 Ut-Battelle, Llc Direct cooled power electronics substrate
US8123382B2 (en) 2008-10-10 2012-02-28 Cooper Technologies Company Modular extruded heat sink
FI122215B (fi) * 2009-03-13 2011-10-14 Abb Oy Järjestely moottoriohjainta varten
DE102009024370B4 (de) * 2009-06-09 2014-04-30 Semikron Elektronik Gmbh & Co. Kg Stromrichteranordnung mit Kühleinrichtung und Herstellungsverfahren hierzu
US9220180B2 (en) * 2010-12-09 2015-12-22 Richard Anthony Dunn, JR. System and methods for scalable parallel data processing and process control
USD669045S1 (en) * 2010-05-19 2012-10-16 Nippon Mektron, Ltd. Flexible printed circuit board
USD669046S1 (en) * 2010-05-19 2012-10-16 Nippon Mektron, Ltd Flexible printed circuit board
US8279597B2 (en) * 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8174826B2 (en) 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8358503B2 (en) * 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
US20120169202A1 (en) * 2010-12-28 2012-07-05 Tahoe Lighting Concept, Inc. Light emitting diode (led) and organic light emitting diode (oled) lighting sources
DE102011004022B4 (de) * 2011-02-14 2015-12-24 Osram Gmbh Leuchtvorrichtung
JP5285097B2 (ja) * 2011-02-21 2013-09-11 株式会社リョーサン ヒートシンク
FR2989861A1 (fr) * 2012-04-20 2013-10-25 No Rack Baie de serveurs informatiques
EP2672618A1 (de) * 2012-06-04 2013-12-11 ABB Oy Modularer Motorwechselrichter mit durch Kühlkörper gebildeten inneren Kühlkanal und ringförmigen Kondensator auf der Aussenseite
US8842432B2 (en) * 2012-09-22 2014-09-23 Facebook, Inc. Arrangement of computing assets in a data center
JP5657716B2 (ja) * 2013-01-15 2015-01-21 ファナック株式会社 放熱器を備えたモータ駆動装置
JP5695115B2 (ja) * 2013-03-30 2015-04-01 三協立山株式会社 ヒートシンク及びその製造方法
WO2016065485A1 (en) 2014-10-31 2016-05-06 Algozen Corporation A mounting apparatus, for mounting at least one heat dissipating electrical device, optionally including a heat sink body for solid, gas and fluid heat exchange, and circuit board assembly providing interface between circuits
TWI539894B (zh) * 2014-11-28 2016-06-21 財團法人工業技術研究院 功率模組
JP5976235B1 (ja) * 2015-03-25 2016-08-23 三菱電機株式会社 電力変換装置
DE112016005528T5 (de) 2015-12-04 2018-08-30 Rohm Co., Ltd. Leistungsmodulvorrichtung, Kühlstruktur und elektrisches Fahrzeug oder elektrisches Hybridfahrzeug
US9920892B2 (en) 2016-02-12 2018-03-20 Gary D. Yurich Modular LED system for a lighting assembly
FR3091141B1 (fr) * 2018-12-21 2021-06-25 Valeo Siemens Eautomotive France Sas Ensemble électrique d’une barre de connexion électrique et d’un module de refroidissement
US11659696B2 (en) * 2019-11-21 2023-05-23 Zoox, Inc. Vehicle computer cooling architecture

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291309A (de) * 1962-08-29
JPS57118656A (en) * 1981-01-16 1982-07-23 Nec Corp Mounting structure of large scale integrated circuit (lsi)
DE8429523U1 (de) * 1984-10-08 1984-11-29 Nixdorf Computer Ag, 4790 Paderborn Kühlkörper für elektronische Bauelemente und/oder Geräte
US4880050A (en) * 1988-06-20 1989-11-14 The Boeing Company Thermal management system
US5063475A (en) * 1990-03-19 1991-11-05 International Business Machines Corporation Multileveled electronic assembly with cooling means
DE69220228T2 (de) * 1991-08-01 1997-09-25 Wavedriver Ltd Batteriegespeistes elektrisches Fahrzeug und elektrisches Versorgungssystem
GB9116661D0 (en) * 1991-08-01 1991-09-18 The Technology Partnership Ltd Vehicle cooling system

Also Published As

Publication number Publication date
EP0680685B1 (de) 1999-03-17
EP0680685A1 (de) 1995-11-08
CA2152359A1 (en) 1994-08-04
WO1994017649A1 (en) 1994-08-04
AU5841594A (en) 1994-08-15
JPH08505985A (ja) 1996-06-25
US5586004A (en) 1996-12-17
GB9301049D0 (en) 1993-03-10
ATE177896T1 (de) 1999-04-15
AU696858B2 (en) 1998-09-17

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Legal Events

Date Code Title Description
8332 No legal effect for de