CA2145081A1 - Liquid-coolant cooling element - Google Patents
Liquid-coolant cooling elementInfo
- Publication number
- CA2145081A1 CA2145081A1 CA002145081A CA2145081A CA2145081A1 CA 2145081 A1 CA2145081 A1 CA 2145081A1 CA 002145081 A CA002145081 A CA 002145081A CA 2145081 A CA2145081 A CA 2145081A CA 2145081 A1 CA2145081 A1 CA 2145081A1
- Authority
- CA
- Canada
- Prior art keywords
- liquid
- cooling element
- cooling
- coolant cooling
- coolant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/04—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to a liquid-coolant cooling element for cooling heat-generating disk-shaped compo-nents. According to the invention, the liquid-coolant cooling element comprises a main body (2) which is provided with at least one cooling plate (4), which has a cooling channel (24) led in a double spiral, the ends of which channel open respectively into a collecting chamber (18, 20), this main body (2) having at least one inlet and outlet channel (12, 14), which open respectively into a passage bore (16), which are respectively connected in terms of flow to a collecting chamber (18, 20) of at least one cooling plate (4, 32).
Thus, using said liquid-coolant cooling element, a plurality of power semiconductor components of different contact surfaces can be cooled at a high packing density.
Thus, using said liquid-coolant cooling element, a plurality of power semiconductor components of different contact surfaces can be cooled at a high packing density.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEG9212752.5U | 1992-09-22 | ||
DE9212752U DE9212752U1 (en) | 1992-09-22 | 1992-09-22 | |
PCT/DE1993/000833 WO1994007265A1 (en) | 1992-09-22 | 1993-09-09 | Liquid-coolant cooling element |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2145081A1 true CA2145081A1 (en) | 1994-03-31 |
CA2145081C CA2145081C (en) | 2003-11-11 |
Family
ID=6884015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002145081A Expired - Fee Related CA2145081C (en) | 1992-09-22 | 1993-09-09 | Liquid-coolant cooling element |
Country Status (5)
Country | Link |
---|---|
US (1) | US5539617A (en) |
EP (1) | EP0662246A1 (en) |
CA (1) | CA2145081C (en) |
DE (1) | DE9212752U1 (en) |
WO (1) | WO1994007265A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9212752U1 (en) * | 1992-09-22 | 1993-03-04 | Siemens Ag, 8000 Muenchen, De | |
DE4327895A1 (en) * | 1993-08-19 | 1995-02-23 | Abb Management Ag | Power converter module |
FR2787920B1 (en) * | 1998-12-28 | 2003-10-17 | Alstom | METHOD FOR ASSEMBLING A CHIP TO A BRAZED CIRCUIT MEMBER |
US6604492B2 (en) | 2001-02-28 | 2003-08-12 | Porter Instrument Company, Inc. | Vaporizer |
US6434003B1 (en) * | 2001-04-24 | 2002-08-13 | York International Corporation | Liquid-cooled power semiconductor device heatsink |
US20050259807A1 (en) * | 2003-02-28 | 2005-11-24 | Pita Madoch | Method and network for providing access to an information network |
CN100379038C (en) * | 2004-07-16 | 2008-04-02 | 宏齐科技股份有限公司 | Water-cooled LED heat sink |
DE102005014513B4 (en) * | 2005-03-30 | 2011-05-12 | Att Advanced Temperature Test Systems Gmbh | Device and method for tempering a substrate, and method for producing the device |
US7262967B2 (en) * | 2005-06-29 | 2007-08-28 | Intel Corporation | Systems for low cost coaxial liquid cooling |
US8149579B2 (en) * | 2008-03-28 | 2012-04-03 | Johnson Controls Technology Company | Cooling member |
US7876561B2 (en) * | 2007-01-22 | 2011-01-25 | Johnson Controls Technology Company | Cooling systems for variable speed drives and inductors |
US8495890B2 (en) * | 2007-01-22 | 2013-07-30 | Johnson Controls Technology Company | Cooling member |
US7492594B2 (en) * | 2007-05-03 | 2009-02-17 | Hamilton Sundstrand Corporation | Electronic circuit modules cooling |
US7957166B2 (en) * | 2007-10-30 | 2011-06-07 | Johnson Controls Technology Company | Variable speed drive |
US8120915B2 (en) * | 2008-08-18 | 2012-02-21 | General Electric Company | Integral heat sink with spiral manifolds |
US20110317369A1 (en) * | 2010-06-29 | 2011-12-29 | General Electric Company | Heat sinks with millichannel cooling |
CN101984507A (en) * | 2010-08-27 | 2011-03-09 | 中国电力科学研究院 | Novel water-cooled radiator for thyristor |
TW201211739A (en) * | 2010-09-09 | 2012-03-16 | Asia Vital Components Co Ltd | Heat exchanger structure |
CN102394230B (en) * | 2011-11-11 | 2013-07-17 | 电子科技大学 | Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component |
EP3459110B1 (en) * | 2016-07-01 | 2020-08-26 | Siemens Aktiengesellschaft | Cooling box unit and power electronics device having a cooling box unit |
DE102017220278A1 (en) * | 2017-11-14 | 2019-05-16 | Robert Bosch Gmbh | Cooling element for electronic module |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3361195A (en) * | 1966-09-23 | 1968-01-02 | Westinghouse Electric Corp | Heat sink member for a semiconductor device |
US4183042A (en) * | 1977-02-18 | 1980-01-08 | Pavel Kafunek | Power semiconductor device |
CS233062B1 (en) * | 1983-04-20 | 1985-02-14 | Vladimir Motycka | Liquid cooler for power semiconductor elements cooling |
DE3466833D1 (en) * | 1983-11-02 | 1987-11-19 | Bbc Brown Boveri & Cie | Cooling body for the liquid cooling of power semiconductor devices |
DE3605554A1 (en) * | 1986-02-21 | 1987-08-27 | Licentia Gmbh | Closable heat sink |
US4700272A (en) * | 1986-06-26 | 1987-10-13 | Digital Equipment Corporation | Apparatus and method for compensation of thermal expansion of cooling fluid in enclosed electronic packages |
CH677293A5 (en) * | 1989-01-16 | 1991-04-30 | Asea Brown Boveri | Power semiconductor heat sink - has meandering flow path containing insulating hose filled with cooling fluid |
US5088006A (en) * | 1991-04-25 | 1992-02-11 | International Business Machines Corporation | Liquid film interface cooling system for semiconductor wafer processing |
DE9212752U1 (en) * | 1992-09-22 | 1993-03-04 | Siemens Ag, 8000 Muenchen, De |
-
1992
- 1992-09-22 DE DE9212752U patent/DE9212752U1/de not_active Expired - Lifetime
-
1993
- 1993-09-09 EP EP93918970A patent/EP0662246A1/en not_active Ceased
- 1993-09-09 CA CA002145081A patent/CA2145081C/en not_active Expired - Fee Related
- 1993-09-09 WO PCT/DE1993/000833 patent/WO1994007265A1/en not_active Application Discontinuation
- 1993-09-09 US US08/406,844 patent/US5539617A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5539617A (en) | 1996-07-23 |
EP0662246A1 (en) | 1995-07-12 |
CA2145081C (en) | 2003-11-11 |
DE9212752U1 (en) | 1993-03-04 |
WO1994007265A1 (en) | 1994-03-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |