EP0662246A1 - Liquid-coolant cooling element - Google Patents

Liquid-coolant cooling element

Info

Publication number
EP0662246A1
EP0662246A1 EP93918970A EP93918970A EP0662246A1 EP 0662246 A1 EP0662246 A1 EP 0662246A1 EP 93918970 A EP93918970 A EP 93918970A EP 93918970 A EP93918970 A EP 93918970A EP 0662246 A1 EP0662246 A1 EP 0662246A1
Authority
EP
European Patent Office
Prior art keywords
cooling
heat sink
liquid heat
liquid
base body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP93918970A
Other languages
German (de)
French (fr)
Inventor
Alfred Bochtler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0662246A1 publication Critical patent/EP0662246A1/en
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/04—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a liquid heat sink for cooling heat-generating disk-shaped components.
  • Liquid heat sinks are already known today for cooling power semiconductor components. The increase in the switching power of semiconductor components is coupled with the generation of higher heat loss. Liquid heat sinks generally have a greater cooling capacity and more easily withstand the shock and transition states because their thermal inertia makes it possible to compensate for short heat pulses with only a slight increase in temperature.
  • the heat sinks are constructed as cylindrical or cuboid bodies with supply and discharge connections. A system of either parallel or otherwise interconnected channels is formed inside the heat sink.
  • the distribution of the cooling liquid is carried out with the aid of trained partition walls, or different arrangements of pins are put in the way of the liquid flow. All of these arrangements serve to enlarge the contact area which gives off the heat to the cooling liquid.
  • a heat sink arrangement for semiconductor components which consists of a heat sink, a reversing piece and an end piece.
  • the heat sink and the reversing piece are provided with channels.
  • These cooling and reversing ducts preferably have the same shape and dimensions and are offset from one another such that at least two adjacent cooling ducts are connected to one another by a reversing duct.
  • This reversal piece can consist of metal or also of plastic. In addition to the reversal channels, it contains outflow channels on the periphery and a central inflow channel. channel. This reversing piece is enclosed in the end piece and fastened with it to the surface of the heat sink facing away from the semiconductor body.
  • the end piece contains an annular collecting channel, which is arranged in such a way that all drainage channels of the reversing piece open into it. In addition, this collecting duct is connected to an outlet. An inlet in the end piece lies opposite the opening of the inflow channel of the reversing piece. The coolant runs between the inlet and outlet under the surface of the semiconductor body to be cooled by this configuration of the heat sink arrangement in serpentines.
  • the reversing piece and the end piece can also form a structural unit.
  • the contact surfaces between these parts must be machined in such a way that a tight seal results, or corresponding seals must be placed between them.
  • the outlay for producing this heat sink arrangement is very large, since the cooling channels in the heat sink and the reversing channels in the reversing piece must be created very precisely, so that the opening of each reversing channel is directly opposite parts of the opening of at least two cooling channels in the assembled state.
  • a cooling box which is composed of a substantially rectangular connection plate and two cooling pots arranged around it.
  • the cooling pots have comparatively wide and thick collars on the circumference, which are used for screw connection to the connection plate.
  • the part of the connection plate projecting over the cooling pots is also used as a power connection.
  • the interior of the cooling pots contains a liquid distributor in the form of a plurality of webs which are connected to a central passage and an eccentric passage, so that there is an asymmetrical liquid flow with a relatively large pressure drop inside the cooling pots. This reduction in pressure drop creates a relative great thermal resistance.
  • This thermal resistance indicates how much heat can be dissipated from the disk-shaped semiconductor cell to the coolant. Due to the constructive shape of the cooling pots, the heat exchange area is also limited.
  • the heat exchange surface is understood to mean that part of the surface of the cooling pots which is directly swept by the cooling liquid.
  • a cooling box is known from DE-AS-21 60 302, consisting of two round cooling pots with their flat heat transfer surfaces on the disc cells and a plate-shaped connecting piece for cooling liquid and electricity lying between them and tightly connected to them. Connections, the connection piece having inlet and outlet channels directed inwards from the edge, each of which opens into a passage opening which is approximately at right angles to them and penetrates the connection piece.
  • the cooling liquid reaches the outlet channel via the inlet channel, first passage opening, cooling pots and second passage opening.
  • the connector is a circular plate with radially aligned, mutually aligned inlet and outlet channels and through bores arranged symmetrically to the center of the connector.
  • the cooling pots On their side facing the connection part, the cooling pots have uninterrupted concentric ring channels, the partitions of which extend as far as the end faces of the connection piece and each of which is in flow connection with the passage bores.
  • This design of the cooling pots allows simple manufacture of these parts as turned parts in automatic lathes, ie in automatic lathes.
  • a very low thermal resistance of the cooling box is achieved by using concentric and interrupted ring channels for guiding the cooling liquid, with all ring channels parallel to one another being supplied with cooling liquid from the inlet channel simultaneously through the passage bore.
  • the coolant flow in other concentric ring channels, the utilization of the entire surface of the cooling box as a heat exchange surface.
  • the invention is based on the object of specifying a liquid heat sink for cooling heat-generating, disk-shaped components, which makes it possible to cool a plurality of such power semiconductor components with any diameter with a high packing density.
  • the liquid heat sink consists of a base body which is provided with at least one cooling plate which has a bifilar cooling channel, the ends of which each open into a collecting chamber, this base body having at least one inlet and outlet channel , each of which opens into a passage bore, which are each in flow connection with a collecting chamber of at least one cooling plate.
  • liquid heat sink As a result of this configuration of the liquid heat sink according to the invention, a maximum of six disk-shaped power semiconductor components with different diameters can be cooled in a cube-shaped base body (smallest structural unit). Such a liquid heat sink takes up much less space than a tension bandage with six disk-shaped power semiconductor components.
  • other wiring components elements of the power semiconductor components are arranged directly around the liquid heat sink. This results in a compact structure, for example of a converter valve of a high-performance converter.
  • the packing density achieved by the liquid heat sink according to the invention is very high.
  • the cooling plates are each arranged in a corresponding recess in the base body. As a result, only one centering device is required, which simplifies assembly.
  • the cooling channels of the cooling plates are connected in series and / or in parallel in terms of flow. As a result, the number of liquid connections is considerably reduced.
  • FIG. 1 shows a cross section through a first embodiment of the liquid heat sink and FIG. 2 shows an associated top view of the liquid heat sink according to FIG. 1, FIG. 3 shows a second embodiment of the liquid heat sink and FIG. 4 shows a third embodiment of the liquid heat sink illustrated.
  • Figure 1 illustrates a cross section through a liquid heat sink according to the invention for cooling heat-generating disk-shaped components.
  • This liquid heat sink consists of a base body 2 and at least one cooling plate 4.
  • the base body 2 is cube-shaped and is provided with two fastening flanges 6 and 8. Metal or plastic can be provided as the material for this base body 2.
  • the base body 2 has a corresponding recess 10 for receiving the cooling plate 4 for each cooling plate 4.
  • the base body 2 also contains an inlet and outlet channel 12 and 14, of which only the outlet channel 14 can be seen in this illustration, and passage bores 16.
  • the passage bores 16 are arranged in the base body 2 in such a way that they Outlet channel 12 or 14 fluidly connects to a collecting chamber 18 or 20 of the cooling plate 4 (FIG. 2).
  • the base body 2 also has additional threaded bores 22, which are used for fastening purposes.
  • the inlet or outlet channel 12 or 14, which opens into a through bore 16, is provided with an internal thread so that a connection of a coolant hose can be detachably connected to the inlet or outlet channel 12 or 14.
  • the inlet and outlet channels 12 and 14 and the associated passage bore 16 are arranged approximately at right angles to one another in the base body.
  • the cooling plate 4 which is arranged in the corresponding recess 10 of the base body 2, contains, according to FIG. 2, which shows a top view of the liquid cooling body according to FIG. 1, the cooling plate 4 being cut open, a bifilar cooling channel 24.
  • the ends of this bifilar ge led cooling channel 24 each open into a collecting chamber 18 or 20, which are each connected in terms of flow to a passage bore 16 of the base body 2.
  • the material of the cooling plate 4 is good heat-conducting material, for example aluminum or copper.
  • the bifilar cooling channel 24 can be milled into the cooling plate 4, for example. So that each collection chamber 18 and 20 is connected in terms of flow to a passage bore 16, the cooling plate 4 is provided with a centering device 26.
  • This centering device 26 consists in each case of a bore in the cooling plate 4 and in the base body 2 and a pin 28 (FIG. 1), each half of which is inserted in these bores. Since the cooling plate 4 is arranged in a corresponding recess 10 of the base body, the cooling plate 4 and the base body 2 can be clearly assigned to one another by means of a centering pin 28. Since the cooling plate 4 is so simply constructed, this construction allows simple manufacture as a turned part in an automatic lathe, ie in automatic lathes. Further processing takes place in boring mills, by means of which the base body 2 is also produced. There is also the possibility of producing the cooling plate 4 as a cast part.
  • the cooling plate 4 is connected in a suitable manner to the base body 2 (soldering, welding, gluing, Kaitverfor ⁇ men).
  • the course of the coolant is indicated by arrows.
  • the supplied coolant flows through the inlet channel 12 and the associated passage bore 16 through the base body 2 to a first collecting chamber 18 of the cooling plate 4. From there, the coolant flows through the bifilar cooling channel 24 to the second collecting chamber 20, as a result of which the partition walls 30 flow around this cooling channel 24 in the opposite direction. From the second collecting chamber 20, the cooling liquid flows out of the base body 2 of this liquid cooling body through the assigned passage bore 16 and the outlet channel 14.
  • Outlet channel 14 into a passage bore 16, each of which is connected in terms of flow to a collecting chamber 20 or 18 of the two cooling plates 4.
  • the number of cooling plates becomes 4 or 32 and their flow-related interconnection selected.
  • the spatial extent of the base body 2 is selected as a function of the number of cooling plates 4 and / or 32, the use of this liquid cooling body also being considered.
  • This liquid heat sink can thus be used to cool a plurality of power semiconductor components with different contact areas at a high packing density, the spatial dimension of such a packed liquid heat sink being very compact compared to a conventional clamping assembly.

Abstract

The invention concerns a liquid-coolant cooling element designed to cool disc-shaped heat-generating components. The invention calls for the cooling element to comprise a main body (2) fitted with at least one heat-transfer plate (4) with a double-spiral coolant channel (24) each end of which is connected to a collector chamber (18, 20). The main body (2) has at least one inlet and output channel (12, 14), each of which is connected to a bore (16), each bore being connected to allow liquid flow with the collector chamber (12, 14) of at least one heat-transfer plate (4, 32). This cooling-element design can thus be used to cool several densely packed power semiconductor components with different contact-surface areas.

Description

FlüssigkeitskühlkörperLiquid heatsink
Die Erfindung bezieht sich auf einen Flüssigkeitskühlkörper zum Kühlen von wärmeerzeugenden scheibenförmigen Bauelemen- ten.The invention relates to a liquid heat sink for cooling heat-generating disk-shaped components.
Flüssigkeitskühlkörper sind heute bereits zum Kühlen von Leistungs-Halbleiterbauelementen bekannt. Die Steigerung der Schaltleistung von Halbleiterbauelementen ist mit der Erzeugung einer höheren Verlustwärme gekoppelt. Flüssig¬ keitskühlkörper haben allgemein eine größere Kühlleistung und halten leichter den Stoß- und Übergangszuständen Stand, weil ihre Wärmeträgheit es ermöglicht, kurze Wärmeimpulse mit einem nur geringfügigen Temperaturanstieg auszuglei- chen. Die Kühlkörper sind in vielen Fällen als zylinder- oder quaderförmige Körper mit Zuleitungs- und Ableitungs¬ stutzen konstruiert. Im Inneren des Kühlkörpers ist ein System von entweder parallelen oder anders miteinander verbundenen Kanälen ausgebildet. In einigen Fällen wird die Verteilung der Kühlflüssigkeit mit Hilfe von ausgebildeten Trennwänden durchgeführt oder es werden dem Flüssigkeits¬ strom verschiedene Aufstellungen von Stiften in den Weg gestellt. Alle diese Anordnungen dienen zur Vergrößerung der Kontaktfläche, die die Wärme an die Kühlflüssigkeit abgibt.Liquid heat sinks are already known today for cooling power semiconductor components. The increase in the switching power of semiconductor components is coupled with the generation of higher heat loss. Liquid heat sinks generally have a greater cooling capacity and more easily withstand the shock and transition states because their thermal inertia makes it possible to compensate for short heat pulses with only a slight increase in temperature. In many cases, the heat sinks are constructed as cylindrical or cuboid bodies with supply and discharge connections. A system of either parallel or otherwise interconnected channels is formed inside the heat sink. In some cases, the distribution of the cooling liquid is carried out with the aid of trained partition walls, or different arrangements of pins are put in the way of the liquid flow. All of these arrangements serve to enlarge the contact area which gives off the heat to the cooling liquid.
Aus der DE-OS-16 39 047 ist eine Kühlkörperanordnung für Halbleiterbauelemente bekannt, die aus einem Kühlkörper, einem Umkehrstück und einem Endstück besteht. Der Kühl- körper und das Umkehrstück sind mit Kanälen versehen. Diese Kühl- und Umkehrkanäle haben vorzugsweise die gleiche Form und Abmessungen und sind so gegeneinander versetzt, daß mindestens zwei benachbart liegende Kühlkanäle durch einen Umkehrkanal miteinander in Verbindung stehen. Dieses Um- kehrstück kann aus Metall oder auch aus Kunststoff beste¬ hen. Es enthält außer den Umkehrkanälen an der Peripherie gelegene Abflußkanäle und einen zentral liegenden Zufluß- kanal. Dieses Umkehrstück ist eingeschlossen in das End¬ stück und mit diesen an der von dem Halbleiterkörper abge¬ wandten Fläche des Kühlkörpers befestigt. Das Endstück ent¬ hält einen kreisringförmigen Sammelkanal, der so angeordnet ist, daß alle Abflußkanäle des Umkehrstücks darin münden. Außerdem ist dieser Sammelkanal mit einem Auslaß verbunden. Ein Einlaß im Endstück liegt gegenüber der Öffnung des Zu¬ flußkanals des Umkehrstücks. Das Kühlmittel verläuft zwi¬ schen Einlaß und Auslaß unter der zu kühlenden Fläche des Halbleiterkörpers durch diese Ausgestaltung der Kühlkörper¬ anordnung in Serpentinen. Das Umkehrstück und das Endstück kann auch eine Baueinheit bilden.From DE-OS-16 39 047 a heat sink arrangement for semiconductor components is known, which consists of a heat sink, a reversing piece and an end piece. The heat sink and the reversing piece are provided with channels. These cooling and reversing ducts preferably have the same shape and dimensions and are offset from one another such that at least two adjacent cooling ducts are connected to one another by a reversing duct. This reversal piece can consist of metal or also of plastic. In addition to the reversal channels, it contains outflow channels on the periphery and a central inflow channel. channel. This reversing piece is enclosed in the end piece and fastened with it to the surface of the heat sink facing away from the semiconductor body. The end piece contains an annular collecting channel, which is arranged in such a way that all drainage channels of the reversing piece open into it. In addition, this collecting duct is connected to an outlet. An inlet in the end piece lies opposite the opening of the inflow channel of the reversing piece. The coolant runs between the inlet and outlet under the surface of the semiconductor body to be cooled by this configuration of the heat sink arrangement in serpentines. The reversing piece and the end piece can also form a structural unit.
Wenn die Kühlkörperanordnung aus mehreren Teilen besteht, müssen die Berührungsflächen zwischen diesen Teilen so be¬ arbeitet sein, daß sich ein dichter Abschluß ergibt, oder es müssen entsprechende Dichtungen dazwischen gelegt wer¬ den. Außerdem ist der Aufwand zur Herstellung dieser Kühl¬ körperanordnung sehr groß, da die Kühlkanäle im Kühlkörper und die Umkehrkanäle im Umkehrstück sehr genau erstellt werden müssen, damit die Öffnung jedes Umkehrkanals Teile der Öffnung von mindestens zwei Kühlkanälen unmittelbar im zusammengebauten Zustand gegenüber liegen.If the heat sink arrangement consists of several parts, the contact surfaces between these parts must be machined in such a way that a tight seal results, or corresponding seals must be placed between them. In addition, the outlay for producing this heat sink arrangement is very large, since the cooling channels in the heat sink and the reversing channels in the reversing piece must be created very precisely, so that the opening of each reversing channel is directly opposite parts of the opening of at least two cooling channels in the assembled state.
Aus der DE-OS-19 14 790 ist eine Kühldose bekannt, die aus einer im wesentlichen rechteckförmigen Anschlußplatte und zwei um diese angeordneten Kühltöpfen zusammengesetzt ist. Die Kühltöpfe weisen verhältnismäßig breite und dicke Bünde am Umfang auf, die zur Schraubverbindung mit der Anschluß- platte dienen. Der über die Kühltöpfe vorspringende Teil der Anschlußplatte ist als Stromanschluß mitbenutzt. Die Kühltöpfe enthalten im Inneren einen Flüssigkeitsverteiler in Form mehrerer Stege, die mit einem mittigen Durchlaß und einem außermittigen Durchlaß in Verbindung stehen, so daß im Inneren der Kühltöpfe eine unsymmetrische Flüssigkeits¬ strömung mit verhältnismäßig großem Druckabfall herrscht. Durch diese Minderung des Druckabfalls entsteht ein relativ großer Wärmewiderstand. Dieser Wärmewiderstand sagt aus, wie viel Wärme von der scheibenförmigen Halbleiterzelle an das Kühlmittel abgeführt werden kann. Bedingt durch die konstruktive Form der Kühltöpfe ist außerdem die Wär e- austauschfläche begrenzt. Unter Wärmeaustauschfläche wird der Teil der Oberfläche der Kühltöpfe verstanden, der un¬ mittelbar von der Kühlflüssigkeit überstrichen wird.From DE-OS-19 14 790 a cooling box is known which is composed of a substantially rectangular connection plate and two cooling pots arranged around it. The cooling pots have comparatively wide and thick collars on the circumference, which are used for screw connection to the connection plate. The part of the connection plate projecting over the cooling pots is also used as a power connection. The interior of the cooling pots contains a liquid distributor in the form of a plurality of webs which are connected to a central passage and an eccentric passage, so that there is an asymmetrical liquid flow with a relatively large pressure drop inside the cooling pots. This reduction in pressure drop creates a relative great thermal resistance. This thermal resistance indicates how much heat can be dissipated from the disk-shaped semiconductor cell to the coolant. Due to the constructive shape of the cooling pots, the heat exchange area is also limited. The heat exchange surface is understood to mean that part of the surface of the cooling pots which is directly swept by the cooling liquid.
Aus -der DE-AS-21 60 302 ist eine Kühldose bekannt, beste- hend aus zwei mit ihren flachen Wärmeübergangsflächen an den Scheibenzellen anliegenden runden Kühltöpfen und einem zwischen ihnen liegenden, mit ihnen dicht verbundenen plat- tenförmigen Anschlußstück für Kühlflüssigkeits- und Strom- anschlüsse, wobei das Anschlußstück vom Rand nach Innen ge- richtete Ein- und Auslaßkanäle aufweist, die je in eine an¬ nähernd im rechten Winkel zu ihnen stehende, das Anschlu߬ stück durchdringende Durchlaßöffnung münden. Die Kühlflüs¬ sigkeit gelangt über Einlaßkanal, erste Durchlaßöffnung, Kühltöpfe und zweite Durchlaßöffnung zum Ausgangskanal. Das Anschlußstück ist eine kreisförmige Platte mit radial aus¬ gerichteten, gegenseitig fluchtenden Ein- und Auslaßkanälen und symmetrisch zum Zentrum des Anschlußstückes angeordne¬ ten Durchlaßbohrungen. Die Kühltöpfe weisen auf ihrer dem Anschlußteil zugewandten Seite ununterbrochene, konzentri- sehe Ringkanäle auf, deren Trennwände bis an die Stirnsei¬ ten des Anschlußstückes reichen und von denen jeder mit den Durchlaßbohrungen in strömungsmäßiger Verbindung steht.A cooling box is known from DE-AS-21 60 302, consisting of two round cooling pots with their flat heat transfer surfaces on the disc cells and a plate-shaped connecting piece for cooling liquid and electricity lying between them and tightly connected to them. Connections, the connection piece having inlet and outlet channels directed inwards from the edge, each of which opens into a passage opening which is approximately at right angles to them and penetrates the connection piece. The cooling liquid reaches the outlet channel via the inlet channel, first passage opening, cooling pots and second passage opening. The connector is a circular plate with radially aligned, mutually aligned inlet and outlet channels and through bores arranged symmetrically to the center of the connector. On their side facing the connection part, the cooling pots have uninterrupted concentric ring channels, the partitions of which extend as far as the end faces of the connection piece and each of which is in flow connection with the passage bores.
Diese Konstruktion der Kühltöpfe erlaubt eine einfache Herstellung dieser Teile als Drehteile in Drehautomaten, d.h. in automatischen Drehmaschinen. Durch die Verwendung konzentrischer und unterbrochener Ringkanäle zur Führung der Kühlflüssigkeit, wobei alle zueinander parallelen Ringkanäle gleichzeitig über die Durchlaßbohrung von dem Einlaßkanal mit Kühlflüssigkeit gespeist werden, wird ein sehr niedriger Wärmewiderstand der Kühldose erreicht. Darüber hinaus ermöglicht die Kühlmittelführung in zuein- ander konzentrischen Ringkanälen die Ausnutzung der, ge¬ samten Fläche der Kühldose als Wärmeaustauschfläche.This design of the cooling pots allows simple manufacture of these parts as turned parts in automatic lathes, ie in automatic lathes. A very low thermal resistance of the cooling box is achieved by using concentric and interrupted ring channels for guiding the cooling liquid, with all ring channels parallel to one another being supplied with cooling liquid from the inlet channel simultaneously through the passage bore. In addition, the coolant flow in other concentric ring channels, the utilization of the entire surface of the cooling box as a heat exchange surface.
Müssen mehr als zwei scheibenförmige Bauelemente gekühlt werden, so werden weitere Kühldosen benötigt, die zusammen mit diesen scheibenförmigen Bauelementen zu einem Spannver¬ band verknüpft werden. Dadurch sind zusätzliche Flüssig¬ keitsanschlüsse erforderlich. Außerdem können jeweils nur scheibenförmige Bauelemente mit gleichem Durchmesser in einem gemeinsamen Spannverband angeordnet werden. Ferner benötigt ein derartiger Spannverband einen ausreichenden Platz, wobei keine hohe Packungsdichte erreicht wird.If more than two disk-shaped components have to be cooled, then additional cooling boxes are required which are linked together with these disk-shaped components to form a clamping band. As a result, additional liquid connections are required. In addition, only disc-shaped components with the same diameter can be arranged in a common clamping assembly. Furthermore, such a tension bandage requires sufficient space, with no high packing density being achieved.
Der Erfindung liegt nun die Aufgabe zugrunde, einen Flüs- sigkeitskühlkörper zum Kühlen von wärmeerzeugenden schei¬ benförmigen Bauelementen anzugeben, der es erlaubt, mehrere derartige Leistungshalbleiter-Bauelemente mit beliebigen Durchmessern bei hoher Packungsdichte, zu kühlen.The invention is based on the object of specifying a liquid heat sink for cooling heat-generating, disk-shaped components, which makes it possible to cool a plurality of such power semiconductor components with any diameter with a high packing density.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß der Flüssigkeitskühlkörper aus einem Grundkörper besteht, der mit wenigstens einer Kühlplatte versehen ist, die einen bifilar geführten Kühlkanal aufweist, dessen Enden jeweils in einer Sammelkammer münden, wobei dieser Grundkörper we- nigstens einen Ein- und Auslaßkanal aufweist, die jeweils in einer Durchlaßbohrung münden, die jeweils in strömungs¬ mäßiger Verbindung mit einer Sammelkammer wenigstens einer Kühlplatte stehen.This object is achieved according to the invention in that the liquid heat sink consists of a base body which is provided with at least one cooling plate which has a bifilar cooling channel, the ends of which each open into a collecting chamber, this base body having at least one inlet and outlet channel , each of which opens into a passage bore, which are each in flow connection with a collecting chamber of at least one cooling plate.
Durch diese Ausgestaltung des erfindungsgemäßen Flüssig¬ keitskühlkörpers können bei einem würfelförmigen Grundkör¬ per (kleinste Baueinheit) maximal sechs scheibenförmige Leistungshalbleiter-Bauelemente mit unterschiedlichen Durchmessern gekühlt werden. Ein derartiger Flüssigkeits- kühlkörper benötigt gegenüber einem Spannverband mit sechs scheibenförmigen Leistungshalbleiter-Bauelementen viel weniger Platz. Außerdem können weitere Beschaltungsbauele- mente der Leistungshalbleiter-Bauelemente unmittelbar um den Flüssigkeitskühlkörper herum angeordnet werden. Somit erhält man einen kompakten Aufbau beispielsweise eines Stromrichterventils eines Hochleistungsstromrichters. Die Packungsdichte, die durch den erfindungsgemäßen Flüssig¬ keitskühlkörper erreicht wird, ist sehr hoch.As a result of this configuration of the liquid heat sink according to the invention, a maximum of six disk-shaped power semiconductor components with different diameters can be cooled in a cube-shaped base body (smallest structural unit). Such a liquid heat sink takes up much less space than a tension bandage with six disk-shaped power semiconductor components. In addition, other wiring components elements of the power semiconductor components are arranged directly around the liquid heat sink. This results in a compact structure, for example of a converter valve of a high-performance converter. The packing density achieved by the liquid heat sink according to the invention is very high.
Bei einer vorteilhaften Ausgestaltung des Flüssigkeits¬ kühlkörpers sind die Kühlplatten jeweils in einer korres- pondierenden Ausnehmung des Grundkörpers angeordnet. Da¬ durch wird nur noch eine Zentriervorrichtung benötigt wo¬ durch sich die Montage sehr vereinfacht.In an advantageous embodiment of the liquid heat sink, the cooling plates are each arranged in a corresponding recess in the base body. As a result, only one centering device is required, which simplifies assembly.
Bei einer weiteren vorteilhaften Ausgestaltung des Flüε- Ξigkeitskühlkörpers sind die Kühlkanäle der Kühlplatten strömungsmäßig in Reihe und/oder parallel geschaltet. Da¬ durch reduziert sich die Anzahl der Flüssigkeitsanschlüsse erheblich.In a further advantageous embodiment of the liquid heat sink, the cooling channels of the cooling plates are connected in series and / or in parallel in terms of flow. As a result, the number of liquid connections is considerably reduced.
Weitere Ausgestaltungsmerkmale sind den Unteransprüchen 5 bis 8 zu entnehmen.Further design features can be found in subclaims 5 to 8.
Zur weiteren Erläuterung wird auf die Zeichnung Bezug ge¬ nommen, in der mehrere Ausführungsbeispiele des erfindungs- gemäßen Flüssigkeitskühlkörpers schematisch veranschaulicht sind.For further explanation, reference is made to the drawing, in which several exemplary embodiments of the liquid heat sink according to the invention are schematically illustrated.
FIG 1 zeigt einen Querschnitt durch eine erste Ausfüh¬ rungsform des Flüssigkeitskühlkörpers und die FIG 2 zeigt eine zugehörige Draufsicht auf den Flüssig¬ keitskühlkörper nach FIG 1, in FIG 3 ist eine zweite Ausführungsform des Flüssigkeits¬ kühlkörpers dargestellt und in FIG 4 ist eine dritte Ausführungsform des Flüssigkeits- kühlkörpers veranschaulicht. Die Figur 1 veranschaulicht einen Querschnitt durch einen erfindungsgemäßen Flüssigkeitskühlkörper zum Kühlen von wärmeerzeugenden scheibenförmigen Bauelementen. Dieser Flüssigkeitskühlkörper besteht aus einem Grundkörper 2 und wenigstens einer Kühlplatte 4.1 shows a cross section through a first embodiment of the liquid heat sink and FIG. 2 shows an associated top view of the liquid heat sink according to FIG. 1, FIG. 3 shows a second embodiment of the liquid heat sink and FIG. 4 shows a third embodiment of the liquid heat sink illustrated. Figure 1 illustrates a cross section through a liquid heat sink according to the invention for cooling heat-generating disk-shaped components. This liquid heat sink consists of a base body 2 and at least one cooling plate 4.
Der Grundkörper 2 ist in dieser Ausführungsform würfelför- mit und ist mit zwei Befestigungsflanschen 6 und 8 ver¬ sehen. Als Material für diesen Grundkörper 2 kann Metall oder Kunststoff vorgesehen sein. Der Grundkörpers 2 weist für jede Kühlplatte 4 eine korrespondierende Ausnehmung 10 zur Aufnahme der Kühlplatte 4 auf. Der Grundkörper 2 ent¬ hält ferner einen Ein- und Auslaßkanal 12 und 14, von denen in dieser Darstellung nur der Auslaßkanal 14 zu sehen ist, und Durchlaßbohrungen 16. Die Durchlaßbohrungen 16 sind derartig im Grundkörper 2 angeordnet, daß sie den Ein- bzw. Auslaßkanal 12 bzw. 14 mit einer Sammelkammer 18 bzw. 20 der Kühlplatte 4 (FIG 2) strömungsmäßig verbindet. Außerdem weist der Grundkörper 2 noch zusätzliche Gewindebohrungen 22 auf, die zu Befestigungszwecken dienen. Der Ein- bzw. Auslaßkanal 12 bzw. 14, der in eine Durchlaßbohrung 16 mündet, ist mit einem Innengewinde versehen, damit ein Anschluß eines Kühlmittelschlauches mit dem Ein- bzw. Auslaßkanal 12 bzw. 14 lösbar verbunden werden kann. Der Ein- bzw. Auslaßkanal 12 bzw. 14 und die zugehörige Durch¬ laßbohrung 16 sind annähernd rechtwinklig im Grundkörper zueinander angeordnet.In this embodiment, the base body 2 is cube-shaped and is provided with two fastening flanges 6 and 8. Metal or plastic can be provided as the material for this base body 2. The base body 2 has a corresponding recess 10 for receiving the cooling plate 4 for each cooling plate 4. The base body 2 also contains an inlet and outlet channel 12 and 14, of which only the outlet channel 14 can be seen in this illustration, and passage bores 16. The passage bores 16 are arranged in the base body 2 in such a way that they Outlet channel 12 or 14 fluidly connects to a collecting chamber 18 or 20 of the cooling plate 4 (FIG. 2). In addition, the base body 2 also has additional threaded bores 22, which are used for fastening purposes. The inlet or outlet channel 12 or 14, which opens into a through bore 16, is provided with an internal thread so that a connection of a coolant hose can be detachably connected to the inlet or outlet channel 12 or 14. The inlet and outlet channels 12 and 14 and the associated passage bore 16 are arranged approximately at right angles to one another in the base body.
Die Kühlplatte 4, die in der korrespondierenden Ausnehmung 10 des Grundkörpers 2 angeordnet ist, enthält gemäß FIG 2, die eine Draufsicht des Flüssigkeitskühlkörpers nach FIG 1 zeigt, wobei die Kühlplatte 4 aufgeschnitten ist, einen bi- filar geführten Kühlkanal 24. Die Enden dieses bifilar ge¬ führten Kühlkanals 24 münden jeweils in einer Sammelkammer 18 bzw. 20, die strömungsmäßig jeweils mit einer Durchla߬ bohrung 16 des Grundkörpers 2 verbunden sind. Als Material der Kühlplatte 4 ist gut wärmeleitendes Material, bei- spielsweise Aluminium oder Kupfer, vorgesehen. Der bifilar geführte Kühlkanal 24 kann in die Kühlplatte 4 beispiels¬ weise gefräst sein. Damit jede Sammelkammer 18 und 20 strö¬ mungsmäßig mit einer Durchlaßbohrung 16 verbunden ist, ist die Kühlplatte 4 mit einer Zentriervorrichtung 26 versehen. Diese Zentriervorrichtung 26 besteht aus jeweils einer Boh¬ rung in der Kühlplatte 4 und im Grundkörper 2 und einem Stift 28 (FIG 1) , der je zur Hälfte in diesen Bohrungen steckt. Da die Kühlplatte 4 in einer korrespondierenden Ausnehmung 10 des Grundkörpers angeordnet ist, kann mittels eines Zentrierstiftes 28 die Kühlplatte 4 und der Grundkör¬ per 2 einander eindeutig zugeordnet werden. Da die Kühl¬ platte 4 so einfach konstruiert ist, erlaubt diese Kon¬ struktion eine einfache Herstellung als Drehteil in einem Drehautomaten, d.h. in automatischen Drehmaschinen. Eine Weiterverarbeitung findet in Bohrwerken statt, mittels de¬ nen auch der Grundkörper 2 hergestellt wird. Außerdem be¬ steht die Möglichkeit die Kühlplatte 4 als Gußteil herzu¬ stellen.The cooling plate 4, which is arranged in the corresponding recess 10 of the base body 2, contains, according to FIG. 2, which shows a top view of the liquid cooling body according to FIG. 1, the cooling plate 4 being cut open, a bifilar cooling channel 24. The ends of this bifilar ge led cooling channel 24 each open into a collecting chamber 18 or 20, which are each connected in terms of flow to a passage bore 16 of the base body 2. The material of the cooling plate 4 is good heat-conducting material, for example aluminum or copper. The bifilar cooling channel 24 can be milled into the cooling plate 4, for example. So that each collection chamber 18 and 20 is connected in terms of flow to a passage bore 16, the cooling plate 4 is provided with a centering device 26. This centering device 26 consists in each case of a bore in the cooling plate 4 and in the base body 2 and a pin 28 (FIG. 1), each half of which is inserted in these bores. Since the cooling plate 4 is arranged in a corresponding recess 10 of the base body, the cooling plate 4 and the base body 2 can be clearly assigned to one another by means of a centering pin 28. Since the cooling plate 4 is so simply constructed, this construction allows simple manufacture as a turned part in an automatic lathe, ie in automatic lathes. Further processing takes place in boring mills, by means of which the base body 2 is also produced. There is also the possibility of producing the cooling plate 4 as a cast part.
Die Kühlplatte 4 ist auf geeignete Weise mit dem Grund¬ körper 2 verbunden (Löten, Schweißen, Kleben, Kaitverfor¬ men) .The cooling plate 4 is connected in a suitable manner to the base body 2 (soldering, welding, gluing, Kaitverfor¬ men).
Der Verlauf des Kühlmittels ist durch Pfeile angedeutet. Dabei fließt das zugeführte Kühlmittel durch den Einla߬ kanal 12 und der zugehörigen Durchlaßbohrung 16 durch den Grundkörper 2 zu einer ersten Sammelkammer 18 der Kühl¬ platte 4. Von da fließt das Kühlmittel durch den bifilar geführten Kühlkanal 24 zur zweiten Sammelkammer 20, wodurch die Trennwände 30 dieses Kühlkanals 24 entgegengesetzt umströmt werden. Von der zweiten Sammelkammer 20 fließt die Kühlflüssigkeit durch die zugeordnete Durchlaßbohrung 16 und den Auslaßkanal 14 aus den Grundkörper 2 dieses Flüssigkeitskühlkörpers heraus. The course of the coolant is indicated by arrows. The supplied coolant flows through the inlet channel 12 and the associated passage bore 16 through the base body 2 to a first collecting chamber 18 of the cooling plate 4. From there, the coolant flows through the bifilar cooling channel 24 to the second collecting chamber 20, as a result of which the partition walls 30 flow around this cooling channel 24 in the opposite direction. From the second collecting chamber 20, the cooling liquid flows out of the base body 2 of this liquid cooling body through the assigned passage bore 16 and the outlet channel 14.
Auslaßkanal 14 in eine Durchlaßbohrung 16, die jeweils mit einer Sammelkammer 20 bzw. 18 der beiden Kühlplatten 4 strömungsmäßig verbunden sind.Outlet channel 14 into a passage bore 16, each of which is connected in terms of flow to a collecting chamber 20 or 18 of the two cooling plates 4.
In Abhängigkeit der Kühlleistung, der Größe der Kontakt¬ flächen der zu kühlenden scheibenförmigen Leistungshalb¬ leiter-Bauelemente, wie Dioden, Transistoren, Thyristoren, abschaltbare Thyristoren, ... , und der von diesen Bauelemen¬ ten 'erzeugten Abwärme wird die Anzahl der Kühlplatten 4 bzw..32 und deren strömungsmäßige Verschaltung ausgewählt. In Abhängigkeit der Anzahl der Kühlplatten 4 und/oder 32 wird die räumliche Ausdehnung des Grundkörpers 2 ausge¬ wählt, wobei ebenfalls die Verwendung dieses Flüssigkeits- kühlkörpers betrachtet wird.Depending on the cooling capacity, the size of the contact surfaces of the disk-shaped power semiconductor components to be cooled, such as diodes, transistors, thyristors, thyristors that can be switched off, ..., and the waste heat generated by these components, the number of cooling plates becomes 4 or 32 and their flow-related interconnection selected. The spatial extent of the base body 2 is selected as a function of the number of cooling plates 4 and / or 32, the use of this liquid cooling body also being considered.
Somit kann man mit diesem Flüssigkeitskühlkörper mehrere Leistungshalbleiter-Bauelemente mit unterschiedlichen Kon¬ taktflächen bei einer hohen Packungsdichte kühlen, wobei die räumliche Abmessung eines solchen bepackten Flüssig- keitskühlkörpers gegenüber einem herkömmlichen Spannverband sehr kompakt ist. This liquid heat sink can thus be used to cool a plurality of power semiconductor components with different contact areas at a high packing density, the spatial dimension of such a packed liquid heat sink being very compact compared to a conventional clamping assembly.

Claims

Patentansprüche Claims
1. Flüssigkeitskühlkörper zum Kühlen von wärmeerzeugenden scheibenförmigen Bauelementen, bestehend aus einem Grund- körper (2) der mit wenigstens einer Kühlplatte (4, 32) ver¬ sehen ist, die einen bifilar geführten Kühlkanal (24) auf¬ weist, dessen Enden jeweils in einer Sammelkammer (18, 20) münden, wobei dieser Grundkörper (2) wenigstens einen Ein- und 'Auslaßkanal (12, 14) aufweist, die jeweils in einer Durchlaßbohrung (16) münden, die jeweils in strömungsmäßi¬ ger Verbindung mit einer Sammelkammer (18, 20) wenigstens einer Kühlplatte (4, 32) stehen.1. Liquid heat sink for cooling heat-generating disc-shaped components, consisting of a base body (2) which is provided with at least one cooling plate (4, 32) which has a bifilar cooling channel (24), the ends of which are each in a collection chamber (18, 20) open, said base body (2) has at least one input and 'outlet channel (12, 14) each terminate in a through bore (16), each in strömungsmäßi¬ ger conjunction with a collection chamber ( 18, 20) of at least one cooling plate (4, 32).
2. Flüssigkeitskühlkörper nach Anspruch 1, dadurch gekennzeichnet , daß jede Kühlplatte (4, 32) jeweils in einer korrespondierenden Ausnehmung (10) des Grundkör¬ pers (2) angeordnet sind.2. Liquid heat sink according to claim 1, characterized in that each cooling plate (4, 32) are each arranged in a corresponding recess (10) of the basic body (2).
3. Flüssigkeitskühlkörper nach Anspruch 1, dadurch gekennzeichnet , daß die Kühlkanäle (24) der Kühl¬ platten (4, 32) strömungsmäßig in Reihe geschaltet sind.3. Liquid heat sink according to claim 1, characterized in that the cooling channels (24) of the cooling plates (4, 32) are connected in series in terms of flow.
4. Flüssigkeitskühlkörper nach Anspruch 1, dadurch gekennzeichnet, daß die Kühlkanäle (2,4) der Kühl- platten (4, 32) strömungsmäßig parallel geschaltet sind.4. Liquid heat sink according to claim 1, characterized in that the cooling channels (2,4) of the cooling plates (4, 32) are connected in parallel in terms of flow.
5. Flüssigkeitskühlkörper nach Anspruch 1, dadurch gekennzeichnet , daß die Kühlplatte (4, 32) mit dem bifilar geführten Kühlkanal (24) als Drehteil hergestellt und bearbeitet ist.5. Liquid heat sink according to claim 1, characterized in that the cooling plate (4, 32) with the bifilar cooling channel (24) is manufactured and machined as a turned part.
6. Flüssigkeitskühlkörper nach Anspruch 1, dadurch gekennzeichnet , daß die Kühlplatte (4, 32) mit dem bifilar geführten Kühlkanal (24) als Gußteil herstellt und bearbeitet ist. 6. Liquid heat sink according to claim 1, characterized in that the cooling plate (4, 32) with the bifilar cooling channel (24) is manufactured and machined as a casting.
7. Flüssigkeitskühlkörper nach Anspruch 1, dadurch gekennzeichnet , daß der Ein- bzw. Auslaßkanal (12 bzw. 14) und die Durchlaßbohrung (16) annähernd rechtwink¬ lig zueinander angeordnet sind.7. Liquid heat sink according to claim 1, characterized in that the inlet and outlet channels (12 and 14) and the passage bore (16) are arranged approximately perpendicular to each other.
8. Flüssigkeitskühlkörper nach Anspruch 1, dadurch gekennzeichnet , daß die Kühlplatte (4, 32 ) und der Grundkörper (2) mit einer Zentriervorrichtung (26) versehen ist . 8. Liquid heat sink according to claim 1, characterized in that the cooling plate (4, 32) and the base body (2) is provided with a centering device (26).
EP93918970A 1992-09-22 1993-09-09 Liquid-coolant cooling element Ceased EP0662246A1 (en)

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DE9212752U DE9212752U1 (en) 1992-09-22 1992-09-22
DE9212752U 1992-09-22
PCT/DE1993/000833 WO1994007265A1 (en) 1992-09-22 1993-09-09 Liquid-coolant cooling element

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DE9212752U1 (en) 1993-03-04
CA2145081A1 (en) 1994-03-31

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