EP0662246A1 - Dissipateur de chaleur a liquide refrigerant - Google Patents

Dissipateur de chaleur a liquide refrigerant

Info

Publication number
EP0662246A1
EP0662246A1 EP93918970A EP93918970A EP0662246A1 EP 0662246 A1 EP0662246 A1 EP 0662246A1 EP 93918970 A EP93918970 A EP 93918970A EP 93918970 A EP93918970 A EP 93918970A EP 0662246 A1 EP0662246 A1 EP 0662246A1
Authority
EP
European Patent Office
Prior art keywords
cooling
heat sink
liquid heat
liquid
base body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP93918970A
Other languages
German (de)
English (en)
Inventor
Alfred Bochtler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0662246A1 publication Critical patent/EP0662246A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/04—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a liquid heat sink for cooling heat-generating disk-shaped components.
  • Liquid heat sinks are already known today for cooling power semiconductor components. The increase in the switching power of semiconductor components is coupled with the generation of higher heat loss. Liquid heat sinks generally have a greater cooling capacity and more easily withstand the shock and transition states because their thermal inertia makes it possible to compensate for short heat pulses with only a slight increase in temperature.
  • the heat sinks are constructed as cylindrical or cuboid bodies with supply and discharge connections. A system of either parallel or otherwise interconnected channels is formed inside the heat sink.
  • the distribution of the cooling liquid is carried out with the aid of trained partition walls, or different arrangements of pins are put in the way of the liquid flow. All of these arrangements serve to enlarge the contact area which gives off the heat to the cooling liquid.
  • a heat sink arrangement for semiconductor components which consists of a heat sink, a reversing piece and an end piece.
  • the heat sink and the reversing piece are provided with channels.
  • These cooling and reversing ducts preferably have the same shape and dimensions and are offset from one another such that at least two adjacent cooling ducts are connected to one another by a reversing duct.
  • This reversal piece can consist of metal or also of plastic. In addition to the reversal channels, it contains outflow channels on the periphery and a central inflow channel. channel. This reversing piece is enclosed in the end piece and fastened with it to the surface of the heat sink facing away from the semiconductor body.
  • the end piece contains an annular collecting channel, which is arranged in such a way that all drainage channels of the reversing piece open into it. In addition, this collecting duct is connected to an outlet. An inlet in the end piece lies opposite the opening of the inflow channel of the reversing piece. The coolant runs between the inlet and outlet under the surface of the semiconductor body to be cooled by this configuration of the heat sink arrangement in serpentines.
  • the reversing piece and the end piece can also form a structural unit.
  • the contact surfaces between these parts must be machined in such a way that a tight seal results, or corresponding seals must be placed between them.
  • the outlay for producing this heat sink arrangement is very large, since the cooling channels in the heat sink and the reversing channels in the reversing piece must be created very precisely, so that the opening of each reversing channel is directly opposite parts of the opening of at least two cooling channels in the assembled state.
  • a cooling box which is composed of a substantially rectangular connection plate and two cooling pots arranged around it.
  • the cooling pots have comparatively wide and thick collars on the circumference, which are used for screw connection to the connection plate.
  • the part of the connection plate projecting over the cooling pots is also used as a power connection.
  • the interior of the cooling pots contains a liquid distributor in the form of a plurality of webs which are connected to a central passage and an eccentric passage, so that there is an asymmetrical liquid flow with a relatively large pressure drop inside the cooling pots. This reduction in pressure drop creates a relative great thermal resistance.
  • This thermal resistance indicates how much heat can be dissipated from the disk-shaped semiconductor cell to the coolant. Due to the constructive shape of the cooling pots, the heat exchange area is also limited.
  • the heat exchange surface is understood to mean that part of the surface of the cooling pots which is directly swept by the cooling liquid.
  • a cooling box is known from DE-AS-21 60 302, consisting of two round cooling pots with their flat heat transfer surfaces on the disc cells and a plate-shaped connecting piece for cooling liquid and electricity lying between them and tightly connected to them. Connections, the connection piece having inlet and outlet channels directed inwards from the edge, each of which opens into a passage opening which is approximately at right angles to them and penetrates the connection piece.
  • the cooling liquid reaches the outlet channel via the inlet channel, first passage opening, cooling pots and second passage opening.
  • the connector is a circular plate with radially aligned, mutually aligned inlet and outlet channels and through bores arranged symmetrically to the center of the connector.
  • the cooling pots On their side facing the connection part, the cooling pots have uninterrupted concentric ring channels, the partitions of which extend as far as the end faces of the connection piece and each of which is in flow connection with the passage bores.
  • This design of the cooling pots allows simple manufacture of these parts as turned parts in automatic lathes, ie in automatic lathes.
  • a very low thermal resistance of the cooling box is achieved by using concentric and interrupted ring channels for guiding the cooling liquid, with all ring channels parallel to one another being supplied with cooling liquid from the inlet channel simultaneously through the passage bore.
  • the coolant flow in other concentric ring channels, the utilization of the entire surface of the cooling box as a heat exchange surface.
  • the invention is based on the object of specifying a liquid heat sink for cooling heat-generating, disk-shaped components, which makes it possible to cool a plurality of such power semiconductor components with any diameter with a high packing density.
  • the liquid heat sink consists of a base body which is provided with at least one cooling plate which has a bifilar cooling channel, the ends of which each open into a collecting chamber, this base body having at least one inlet and outlet channel , each of which opens into a passage bore, which are each in flow connection with a collecting chamber of at least one cooling plate.
  • liquid heat sink As a result of this configuration of the liquid heat sink according to the invention, a maximum of six disk-shaped power semiconductor components with different diameters can be cooled in a cube-shaped base body (smallest structural unit). Such a liquid heat sink takes up much less space than a tension bandage with six disk-shaped power semiconductor components.
  • other wiring components elements of the power semiconductor components are arranged directly around the liquid heat sink. This results in a compact structure, for example of a converter valve of a high-performance converter.
  • the packing density achieved by the liquid heat sink according to the invention is very high.
  • the cooling plates are each arranged in a corresponding recess in the base body. As a result, only one centering device is required, which simplifies assembly.
  • the cooling channels of the cooling plates are connected in series and / or in parallel in terms of flow. As a result, the number of liquid connections is considerably reduced.
  • FIG. 1 shows a cross section through a first embodiment of the liquid heat sink and FIG. 2 shows an associated top view of the liquid heat sink according to FIG. 1, FIG. 3 shows a second embodiment of the liquid heat sink and FIG. 4 shows a third embodiment of the liquid heat sink illustrated.
  • Figure 1 illustrates a cross section through a liquid heat sink according to the invention for cooling heat-generating disk-shaped components.
  • This liquid heat sink consists of a base body 2 and at least one cooling plate 4.
  • the base body 2 is cube-shaped and is provided with two fastening flanges 6 and 8. Metal or plastic can be provided as the material for this base body 2.
  • the base body 2 has a corresponding recess 10 for receiving the cooling plate 4 for each cooling plate 4.
  • the base body 2 also contains an inlet and outlet channel 12 and 14, of which only the outlet channel 14 can be seen in this illustration, and passage bores 16.
  • the passage bores 16 are arranged in the base body 2 in such a way that they Outlet channel 12 or 14 fluidly connects to a collecting chamber 18 or 20 of the cooling plate 4 (FIG. 2).
  • the base body 2 also has additional threaded bores 22, which are used for fastening purposes.
  • the inlet or outlet channel 12 or 14, which opens into a through bore 16, is provided with an internal thread so that a connection of a coolant hose can be detachably connected to the inlet or outlet channel 12 or 14.
  • the inlet and outlet channels 12 and 14 and the associated passage bore 16 are arranged approximately at right angles to one another in the base body.
  • the cooling plate 4 which is arranged in the corresponding recess 10 of the base body 2, contains, according to FIG. 2, which shows a top view of the liquid cooling body according to FIG. 1, the cooling plate 4 being cut open, a bifilar cooling channel 24.
  • the ends of this bifilar ge led cooling channel 24 each open into a collecting chamber 18 or 20, which are each connected in terms of flow to a passage bore 16 of the base body 2.
  • the material of the cooling plate 4 is good heat-conducting material, for example aluminum or copper.
  • the bifilar cooling channel 24 can be milled into the cooling plate 4, for example. So that each collection chamber 18 and 20 is connected in terms of flow to a passage bore 16, the cooling plate 4 is provided with a centering device 26.
  • This centering device 26 consists in each case of a bore in the cooling plate 4 and in the base body 2 and a pin 28 (FIG. 1), each half of which is inserted in these bores. Since the cooling plate 4 is arranged in a corresponding recess 10 of the base body, the cooling plate 4 and the base body 2 can be clearly assigned to one another by means of a centering pin 28. Since the cooling plate 4 is so simply constructed, this construction allows simple manufacture as a turned part in an automatic lathe, ie in automatic lathes. Further processing takes place in boring mills, by means of which the base body 2 is also produced. There is also the possibility of producing the cooling plate 4 as a cast part.
  • the cooling plate 4 is connected in a suitable manner to the base body 2 (soldering, welding, gluing, Kaitverfor ⁇ men).
  • the course of the coolant is indicated by arrows.
  • the supplied coolant flows through the inlet channel 12 and the associated passage bore 16 through the base body 2 to a first collecting chamber 18 of the cooling plate 4. From there, the coolant flows through the bifilar cooling channel 24 to the second collecting chamber 20, as a result of which the partition walls 30 flow around this cooling channel 24 in the opposite direction. From the second collecting chamber 20, the cooling liquid flows out of the base body 2 of this liquid cooling body through the assigned passage bore 16 and the outlet channel 14.
  • Outlet channel 14 into a passage bore 16, each of which is connected in terms of flow to a collecting chamber 20 or 18 of the two cooling plates 4.
  • the number of cooling plates becomes 4 or 32 and their flow-related interconnection selected.
  • the spatial extent of the base body 2 is selected as a function of the number of cooling plates 4 and / or 32, the use of this liquid cooling body also being considered.
  • This liquid heat sink can thus be used to cool a plurality of power semiconductor components with different contact areas at a high packing density, the spatial dimension of such a packed liquid heat sink being very compact compared to a conventional clamping assembly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention se rapporte à un dissipateur de chaleur à liquide réfrigérant servant à refroidir des composants circulaires dégageant de la chaleur. Selon l'invention, le dissipateur de chaleur à liquide se compose d'un élément de base (2) équipé d'une plaque de refroidissement (4) au moins qui présente un canal de refroidissement (24) bifilaire dont chaque extrémité aboutit dans une chambre collectrice (18, 20), et cet élément de base (2) présente au moins un canal d'admission et d'évacuation (12, 14) aboutissant chacun dans un orifice de passage (16) relié de façon à permettre, l'écoulement du liquide, avec une chambre collectrice (18, 20) d'au moins une plaque de refroidissement (4, 32). On peut ainsi refroidir, avec ce dissipateur de chaleur à liquide, plusieurs composants semi-conducteurs de puissance présentant des surfaces de contact différentes et une densité d'assemblage élevée.
EP93918970A 1992-09-22 1993-09-09 Dissipateur de chaleur a liquide refrigerant Ceased EP0662246A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE9212752U 1992-09-22
DE9212752U DE9212752U1 (de) 1992-09-22 1992-09-22 Flüssigkeitskühlkörper
PCT/DE1993/000833 WO1994007265A1 (fr) 1992-09-22 1993-09-09 Dissipateur de chaleur a liquide refrigerant

Publications (1)

Publication Number Publication Date
EP0662246A1 true EP0662246A1 (fr) 1995-07-12

Family

ID=6884015

Family Applications (1)

Application Number Title Priority Date Filing Date
EP93918970A Ceased EP0662246A1 (fr) 1992-09-22 1993-09-09 Dissipateur de chaleur a liquide refrigerant

Country Status (5)

Country Link
US (1) US5539617A (fr)
EP (1) EP0662246A1 (fr)
CA (1) CA2145081C (fr)
DE (1) DE9212752U1 (fr)
WO (1) WO1994007265A1 (fr)

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Publication number Priority date Publication date Assignee Title
DE9212752U1 (de) * 1992-09-22 1993-03-04 Siemens AG, 8000 München Flüssigkeitskühlkörper
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
FR2787920B1 (fr) * 1998-12-28 2003-10-17 Alstom Procede d'assemblage d'une puce a un element de circuit par brasage
WO2002069065A2 (fr) * 2001-02-28 2002-09-06 Porter Instrument Company, Inc. Regulateur de debit
US6434003B1 (en) * 2001-04-24 2002-08-13 York International Corporation Liquid-cooled power semiconductor device heatsink
US20050259807A1 (en) * 2003-02-28 2005-11-24 Pita Madoch Method and network for providing access to an information network
CN100379038C (zh) * 2004-07-16 2008-04-02 宏齐科技股份有限公司 水冷式发光二极管散热装置
DE102005014513B4 (de) * 2005-03-30 2011-05-12 Att Advanced Temperature Test Systems Gmbh Vorrichtung und Verfahren zum Temperieren eines Substrats, sowie Verfahren zur Herstellung der Vorrichtung
US7262967B2 (en) * 2005-06-29 2007-08-28 Intel Corporation Systems for low cost coaxial liquid cooling
US8495890B2 (en) * 2007-01-22 2013-07-30 Johnson Controls Technology Company Cooling member
US8014110B2 (en) * 2007-01-22 2011-09-06 Johnson Controls Technology Company Variable speed drive with integral bypass contactor
US8149579B2 (en) * 2008-03-28 2012-04-03 Johnson Controls Technology Company Cooling member
US7492594B2 (en) * 2007-05-03 2009-02-17 Hamilton Sundstrand Corporation Electronic circuit modules cooling
US7957166B2 (en) * 2007-10-30 2011-06-07 Johnson Controls Technology Company Variable speed drive
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US20110317369A1 (en) * 2010-06-29 2011-12-29 General Electric Company Heat sinks with millichannel cooling
CN101984507A (zh) * 2010-08-27 2011-03-09 中国电力科学研究院 一种新型的晶闸管水冷散热器
TW201211739A (en) * 2010-09-09 2012-03-16 Asia Vital Components Co Ltd Heat exchanger structure
CN102394230B (zh) * 2011-11-11 2013-07-17 电子科技大学 一种电子元器件散热用多头螺旋流道液体冷却器
EP3459110B1 (fr) * 2016-07-01 2020-08-26 Siemens Aktiengesellschaft Unité de boîte de refroidissement et système électronique de puissance doté d'une unité de boîte de refroidissement
DE102017220278A1 (de) * 2017-11-14 2019-05-16 Robert Bosch Gmbh Kühlelement für Elektronikmodul
JP2024131372A (ja) * 2023-03-16 2024-09-30 株式会社Kelk 除熱板及び熱電発電ユニット

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US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US4183042A (en) * 1977-02-18 1980-01-08 Pavel Kafunek Power semiconductor device
CS233062B1 (en) * 1983-04-20 1985-02-14 Vladimir Motycka Liquid cooler for power semiconductor elements cooling
EP0144579B1 (fr) * 1983-11-02 1987-10-14 BBC Brown Boveri AG Corps de refroidissement par liquide de composants semi-conducteurs de puissance
DE3605554A1 (de) * 1986-02-21 1987-08-27 Licentia Gmbh Verschiessbarer kuehlkoerper
US4700272A (en) * 1986-06-26 1987-10-13 Digital Equipment Corporation Apparatus and method for compensation of thermal expansion of cooling fluid in enclosed electronic packages
CH677293A5 (en) * 1989-01-16 1991-04-30 Asea Brown Boveri Power semiconductor heat sink - has meandering flow path containing insulating hose filled with cooling fluid
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
DE9212752U1 (de) * 1992-09-22 1993-03-04 Siemens AG, 8000 München Flüssigkeitskühlkörper

Non-Patent Citations (1)

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Title
See references of WO9407265A1 *

Also Published As

Publication number Publication date
CA2145081A1 (fr) 1994-03-31
US5539617A (en) 1996-07-23
CA2145081C (fr) 2003-11-11
WO1994007265A1 (fr) 1994-03-31
DE9212752U1 (de) 1993-03-04

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