DE69416288D1 - Elektrostatische Halteplatte mit Isolator aus Oxiden - Google Patents

Elektrostatische Halteplatte mit Isolator aus Oxiden

Info

Publication number
DE69416288D1
DE69416288D1 DE69416288T DE69416288T DE69416288D1 DE 69416288 D1 DE69416288 D1 DE 69416288D1 DE 69416288 T DE69416288 T DE 69416288T DE 69416288 T DE69416288 T DE 69416288T DE 69416288 D1 DE69416288 D1 DE 69416288D1
Authority
DE
Germany
Prior art keywords
holding plate
oxide insulator
electrostatic holding
electrostatic
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69416288T
Other languages
English (en)
Other versions
DE69416288T2 (de
Inventor
Michael Scott Barnes
John Howard Keller
Joseph Skinner Logan
Raymond Robert Ruckel
Robert Eli Tompkins
Jr Robert Peter Westerfield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DOREEY GAGE CO.INC., POUGHKEEPSIE, N.Y., US
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69416288D1 publication Critical patent/DE69416288D1/de
Publication of DE69416288T2 publication Critical patent/DE69416288T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
DE69416288T 1993-12-20 1994-11-08 Elektrostatische Halteplatte mit Isolator aus Oxiden Expired - Lifetime DE69416288T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/169,911 US5535507A (en) 1993-12-20 1993-12-20 Method of making electrostatic chuck with oxide insulator

Publications (2)

Publication Number Publication Date
DE69416288D1 true DE69416288D1 (de) 1999-03-11
DE69416288T2 DE69416288T2 (de) 1999-08-19

Family

ID=22617724

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69416288T Expired - Lifetime DE69416288T2 (de) 1993-12-20 1994-11-08 Elektrostatische Halteplatte mit Isolator aus Oxiden

Country Status (4)

Country Link
US (1) US5535507A (de)
EP (1) EP0660378B1 (de)
JP (1) JP2614422B2 (de)
DE (1) DE69416288T2 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
US5592358A (en) * 1994-07-18 1997-01-07 Applied Materials, Inc. Electrostatic chuck for magnetic flux processing
EP0764979A3 (de) * 1995-09-20 1998-07-15 Hitachi, Ltd. Elektrostatische Anziehungselektrode und Herstellungsverfahren dafür
US5835333A (en) * 1995-10-30 1998-11-10 Lam Research Corporation Negative offset bipolar electrostatic chucks
US5812361A (en) * 1996-03-29 1998-09-22 Lam Research Corporation Dynamic feedback electrostatic wafer chuck
US5761023A (en) * 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
US5793192A (en) * 1996-06-28 1998-08-11 Lam Research Corporation Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system
US5740009A (en) * 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
US5904779A (en) * 1996-12-19 1999-05-18 Lam Research Corporation Wafer electrical discharge control by wafer lifter system
US5835335A (en) * 1997-03-26 1998-11-10 Lam Research Corporation Unbalanced bipolar electrostatic chuck power supplies and methods thereof
US5880923A (en) * 1997-06-09 1999-03-09 Applied Materials Inc. Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system
JP4130255B2 (ja) * 1998-04-08 2008-08-06 キヤノンアネルバ株式会社 プラズマ処理装置
US5905626A (en) * 1998-04-12 1999-05-18 Dorsey Gage, Inc. Electrostatic chuck with ceramic pole protection
US6639783B1 (en) * 1998-09-08 2003-10-28 Applied Materials, Inc. Multi-layer ceramic electrostatic chuck with integrated channel
US6228278B1 (en) 1998-09-30 2001-05-08 Lam Research Corporation Methods and apparatus for determining an etch endpoint in a plasma processing system
WO2000041229A1 (fr) * 1998-12-28 2000-07-13 Tokyo Electron Limited Appareil a plasma et electrode inferieure associee
US6362946B1 (en) * 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
KR100502268B1 (ko) * 2000-03-01 2005-07-22 가부시끼가이샤 히다치 세이사꾸쇼 플라즈마처리장치 및 방법
US6583980B1 (en) * 2000-08-18 2003-06-24 Applied Materials Inc. Substrate support tolerant to thermal expansion stresses
TW478026B (en) 2000-08-25 2002-03-01 Hitachi Ltd Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
US6554954B2 (en) * 2001-04-03 2003-04-29 Applied Materials Inc. Conductive collar surrounding semiconductor workpiece in plasma chamber
US6986865B2 (en) * 2002-07-10 2006-01-17 Watlow Electric Manufacturing Company Method for manufacturing an electrostatic chuck
US20040079289A1 (en) * 2002-10-23 2004-04-29 Kellerman Peter L. Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging
CN100390955C (zh) * 2003-03-19 2008-05-28 东京毅力科创株式会社 使用静电卡盘的基板保持机构及其制造方法
EP1635388A4 (de) * 2003-06-17 2009-10-21 Creative Tech Corp Dipolare elektrostatische einspannvorrichtung
WO2005004229A1 (ja) * 2003-07-08 2005-01-13 Future Vision Inc. 基板ステージ用静電チャック及びそれに用いる電極ならびにそれらを備えた処理システム
JP4514587B2 (ja) * 2004-11-29 2010-07-28 京セラ株式会社 基板保持部材
WO2007066572A1 (ja) * 2005-12-06 2007-06-14 Creative Technology Corporation 静電チャック用電極シート及び静電チャック
WO2009014846A1 (en) * 2007-07-20 2009-01-29 Applied Materials, Inc. Rf choke for gas delivery to an rf driven electrode in a plasma processing apparatus
US8336891B2 (en) * 2008-03-11 2012-12-25 Ngk Insulators, Ltd. Electrostatic chuck
JP5609663B2 (ja) * 2011-01-18 2014-10-22 旭硝子株式会社 ガラス基板保持手段、およびそれを用いたｅｕｖマスクブランクスの製造方法
US9472444B2 (en) 2012-08-23 2016-10-18 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer support device
US10727092B2 (en) * 2012-10-17 2020-07-28 Applied Materials, Inc. Heated substrate support ring
US20140265165A1 (en) * 2013-03-14 2014-09-18 International Business Machines Corporation Wafer-to-wafer fusion bonding chuck
KR102155512B1 (ko) * 2017-05-22 2020-09-14 (주)코미코 반도체 제조용 정전척의 아킹 현상 개선방법
CN108321103A (zh) * 2018-03-12 2018-07-24 中国电子科技集团公司第十三研究所 晶圆夹具及电感耦合等离子刻蚀系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
DD143131A1 (de) * 1979-04-26 1980-07-30 Ute Bergner Vorrichtung zum elektrostatischen halten von werkstuecken,insbesondere halbleiterscheiben
JP2680338B2 (ja) * 1988-03-31 1997-11-19 株式会社東芝 静電チャック装置
FR2661039B1 (fr) * 1990-04-12 1997-04-30 Commissariat Energie Atomique Porte-substrat electrostatique.
US5055964A (en) * 1990-09-07 1991-10-08 International Business Machines Corporation Electrostatic chuck having tapered electrodes
US5213349A (en) * 1991-12-18 1993-05-25 Elliott Joe C Electrostatic chuck
US5350479A (en) * 1992-12-02 1994-09-27 Applied Materials, Inc. Electrostatic chuck for high power plasma processing
US5384682A (en) * 1993-03-22 1995-01-24 Toto Ltd. Electrostatic chuck

Also Published As

Publication number Publication date
DE69416288T2 (de) 1999-08-19
EP0660378A1 (de) 1995-06-28
US5535507A (en) 1996-07-16
EP0660378B1 (de) 1999-01-27
JPH07201962A (ja) 1995-08-04
JP2614422B2 (ja) 1997-05-28

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: DOREEY GAGE CO.INC., POUGHKEEPSIE, N.Y., US

8328 Change in the person/name/address of the agent

Free format text: SCHWAN SCHWAN SCHORER, 81739 MUENCHEN