DE69409422D1 - Automatisches Waschsystem und Verfahren - Google Patents

Automatisches Waschsystem und Verfahren

Info

Publication number
DE69409422D1
DE69409422D1 DE69409422T DE69409422T DE69409422D1 DE 69409422 D1 DE69409422 D1 DE 69409422D1 DE 69409422 T DE69409422 T DE 69409422T DE 69409422 T DE69409422 T DE 69409422T DE 69409422 D1 DE69409422 D1 DE 69409422D1
Authority
DE
Germany
Prior art keywords
automatic washing
washing system
automatic
washing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69409422T
Other languages
English (en)
Other versions
DE69409422T2 (de
Inventor
Daniel B Doran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
NCR International Inc
Original Assignee
NCR International Inc
Hyundai Electronics America Inc
Symbios Logic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCR International Inc, Hyundai Electronics America Inc, Symbios Logic Inc filed Critical NCR International Inc
Application granted granted Critical
Publication of DE69409422D1 publication Critical patent/DE69409422D1/de
Publication of DE69409422T2 publication Critical patent/DE69409422T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69409422T 1993-03-05 1994-02-25 Automatisches Waschsystem und Verfahren Expired - Fee Related DE69409422T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/026,669 US6017397A (en) 1993-03-05 1993-03-05 Automated washing method

Publications (2)

Publication Number Publication Date
DE69409422D1 true DE69409422D1 (de) 1998-05-14
DE69409422T2 DE69409422T2 (de) 1998-12-10

Family

ID=21833166

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69409422T Expired - Fee Related DE69409422T2 (de) 1993-03-05 1994-02-25 Automatisches Waschsystem und Verfahren

Country Status (4)

Country Link
US (2) US6017397A (de)
EP (1) EP0614213B1 (de)
JP (1) JP3631775B2 (de)
DE (1) DE69409422T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19503718A1 (de) * 1995-02-04 1996-08-08 Leybold Ag UV-Strahler
JPH11274282A (ja) 1998-03-23 1999-10-08 Toshiba Corp 基板収納容器、基板収納容器清浄化装置、基板収納容器清浄化方法および基板処理装置
US6663722B1 (en) 1998-03-25 2003-12-16 Daikin Industries, Ltd. Method of cleaning fluorine-containing rubber molded article for semiconductor production apparatuses and cleaned molded article
DE19830438A1 (de) * 1998-07-08 2000-01-13 Zeiss Carl Fa Verfahren zur Dekontamination von Mikrolithographie-Projektionsbelichtungsanlagen
US6904920B2 (en) * 1998-07-10 2005-06-14 Semitool, Inc. Method and apparatus for cleaning containers
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
US6343425B1 (en) * 1999-05-06 2002-02-05 Intecon Systems, Inc. Measurement and cleaning of elastomeric articles having particulate adhered thereto
US6412502B1 (en) * 1999-07-28 2002-07-02 Semitool, Inc. Wafer container cleaning system
JP4007766B2 (ja) * 2000-02-29 2007-11-14 東京エレクトロン株式会社 液処理装置および液処理方法
US6725868B2 (en) * 2000-11-14 2004-04-27 Tokyo Electron Limited Liquid processing apparatus
US20030063271A1 (en) * 2001-08-17 2003-04-03 Nicholes Mary Kristin Sampling and measurement system with multiple slurry chemical manifold
JP4753596B2 (ja) * 2004-05-19 2011-08-24 大日本スクリーン製造株式会社 基板処理装置
US20060201541A1 (en) * 2005-03-11 2006-09-14 Semiconductor Energy Laboratory Co., Ltd. Cleaning-drying apparatus and cleaning-drying method
US8776391B1 (en) * 2007-04-13 2014-07-15 Align Technology, Inc. System for post-processing orthodontic appliance molds
US9514972B2 (en) * 2008-05-28 2016-12-06 Air Products And Chemicals, Inc. Fixture drying apparatus and method
CN102139270B (zh) * 2010-12-23 2013-01-23 西安隆基硅材料股份有限公司 硅片清洗烘干器及多线切割中的断线硅片清洗烘干方法
CN104368547B (zh) * 2013-08-13 2017-06-30 安徽宝辉清洗设备制造有限公司 步进式全方位阀体清洗机

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028135A (en) * 1976-04-22 1977-06-07 The United States Of America As Represented By The Secretary Of The Army Method of cleaning surfaces by irradiation with ultraviolet light
JPS5865433A (ja) * 1981-10-14 1983-04-19 Hitachi Chem Co Ltd アルカリ型感光性フイルムの現像又ははく離方法および現像又ははく離装置
US4560417A (en) * 1981-12-30 1985-12-24 Technomex Development, Ltd. Decontamination method for semiconductor wafer handling equipment
US4569695A (en) * 1983-04-21 1986-02-11 Nec Corporation Method of cleaning a photo-mask
US4728389A (en) * 1985-05-20 1988-03-01 Applied Materials, Inc. Particulate-free epitaxial process
JPH0533006Y2 (de) * 1985-10-28 1993-08-23
JPS6314434A (ja) * 1986-07-04 1988-01-21 Dainippon Screen Mfg Co Ltd 基板表面処理方法および装置
US4760014A (en) * 1986-08-01 1988-07-26 Great Lakes Chemical Corporation Method for treating mixtures containing photopolymeric resin and compositions therefor
US4832753A (en) * 1987-05-21 1989-05-23 Tempress Measurement & Control Corporation High-purity cleaning system, method, and apparatus
US5024968A (en) * 1988-07-08 1991-06-18 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5068040A (en) * 1989-04-03 1991-11-26 Hughes Aircraft Company Dense phase gas photochemical process for substrate treatment
JPH069195B2 (ja) * 1989-05-06 1994-02-02 大日本スクリーン製造株式会社 基板の表面処理方法
US5151135A (en) * 1989-09-15 1992-09-29 Amoco Corporation Method for cleaning surfaces using UV lasers
US5039349A (en) * 1990-05-18 1991-08-13 Veriflo Corporation Method and apparatus for cleaning surfaces to absolute or near-absolute cleanliness
US5301700A (en) * 1992-03-05 1994-04-12 Tokyo Electron Limited Washing system
KR0144949B1 (ko) * 1994-07-26 1998-08-17 김광호 웨이퍼 카세트 및 이를 사용한 세정장치
US5749975A (en) * 1995-12-28 1998-05-12 Micron Technology, Inc. Process for dry cleaning wafer surfaces using a surface diffusion layer

Also Published As

Publication number Publication date
JPH0758075A (ja) 1995-03-03
DE69409422T2 (de) 1998-12-10
EP0614213B1 (de) 1998-04-08
JP3631775B2 (ja) 2005-03-23
US6017397A (en) 2000-01-25
EP0614213A1 (de) 1994-09-07
US6039057A (en) 2000-03-21

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: NCR INTERNATIONAL, INC., DAYTON, OHIO, US HYUNDAI

8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: V. BEZOLD & SOZIEN, 80799 MUENCHEN

8339 Ceased/non-payment of the annual fee
8327 Change in the person/name/address of the patent owner

Owner name: HYNIX SEMICONDUCTOR INC., ICHON, KYONGGI, KR

Owner name: NCR INTERNATIONAL, INC., DAYTON, OHIO, US