DE69404923D1 - Fassung mit verbessertem Kontaktelement - Google Patents

Fassung mit verbessertem Kontaktelement

Info

Publication number
DE69404923D1
DE69404923D1 DE69404923T DE69404923T DE69404923D1 DE 69404923 D1 DE69404923 D1 DE 69404923D1 DE 69404923 T DE69404923 T DE 69404923T DE 69404923 T DE69404923 T DE 69404923T DE 69404923 D1 DE69404923 D1 DE 69404923D1
Authority
DE
Germany
Prior art keywords
socket
contact element
improved contact
improved
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69404923T
Other languages
English (en)
Other versions
DE69404923T2 (de
Inventor
Kiyokazu Ikeya
Osamu Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69404923D1 publication Critical patent/DE69404923D1/de
Application granted granted Critical
Publication of DE69404923T2 publication Critical patent/DE69404923T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE69404923T 1993-09-20 1994-09-19 Fassung mit verbessertem Kontaktelement Expired - Fee Related DE69404923T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5256559A JPH0794252A (ja) 1993-09-20 1993-09-20 ソケット

Publications (2)

Publication Number Publication Date
DE69404923D1 true DE69404923D1 (de) 1997-09-18
DE69404923T2 DE69404923T2 (de) 1998-02-05

Family

ID=17294327

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69404923T Expired - Fee Related DE69404923T2 (de) 1993-09-20 1994-09-19 Fassung mit verbessertem Kontaktelement

Country Status (5)

Country Link
US (1) US5562473A (de)
EP (1) EP0644611B1 (de)
JP (1) JPH0794252A (de)
KR (1) KR100340779B1 (de)
DE (1) DE69404923T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5869976A (en) * 1996-12-13 1999-02-09 Cirrus Logic, Inc. Fine alignment IC handler and method for assembling same
US6019612A (en) * 1997-02-10 2000-02-01 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus for electrically connecting a device to be tested
US5888075A (en) * 1997-02-10 1999-03-30 Kabushiki Kaisha Nihon Micronics Auxiliary apparatus for testing device
SG88739A1 (en) * 1997-05-15 2002-05-21 Nihon Micronics Kk Auxiliary apparatus for testing device
KR19990005516A (ko) * 1997-06-30 1999-01-25 윤종용 반도체 칩 패키지 테스트용 테스트 소켓
JP2000150095A (ja) * 1998-11-06 2000-05-30 Itabashi Giken Kk Ｉｃデバイス用ソケット
US6441315B1 (en) 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
JP3810977B2 (ja) * 2000-02-25 2006-08-16 株式会社エンプラス 電気部品用ソケット
JP4044792B2 (ja) * 2002-06-21 2008-02-06 新日本無線株式会社 半導体装置のテスト用電極装置
US7167167B2 (en) * 2002-12-02 2007-01-23 Eastman Kodak Company Write head for a display tag having a liquid crystal display
US6969270B2 (en) * 2003-06-26 2005-11-29 Intel Corporation Integrated socket and cable connector
TWM298775U (en) * 2006-03-17 2006-10-01 Giga Byte Tech Co Ltd Structure of chip adapter
TWM328132U (en) * 2007-06-25 2008-03-01 Hon Hai Prec Ind Co Ltd Electrical connector
DE112009000035B4 (de) * 2008-06-12 2015-04-16 Multitest Elektronische Systeme Gmbh Kontaktfeder und Kontaktsockel mit einer Mehrzahl von solchen Kontaktfedern
KR101126690B1 (ko) * 2009-07-02 2012-04-02 남재우 Ｍｅｍｓ 기술을 이용한 테스트 소켓 및 그 제조방법
CN103390826B (zh) * 2012-05-08 2016-02-24 赛恩倍吉科技顾问（深圳）有限公司 电连接器
EP2725363B9 (de) 2012-10-24 2015-03-25 Multitest elektronische Systeme GmbH Kontaktfeder für einen Prüfsockel für die Hochstrom-Prüfung eines elektronischen Bauteils
EP2866036B1 (de) * 2013-10-28 2016-08-10 Multitest elektronische Systeme GmbH Schraubenloser Kontaktfederaustausch
US10537434B2 (en) * 2016-08-08 2020-01-21 Wu Jau Ching Intervertebral implant
KR102040009B1 (ko) * 2018-10-01 2019-11-04 주식회사 세인블루텍 테스트 소켓 체결장치
KR102132662B1 (ko) * 2019-09-16 2020-07-13 주식회사 마이크로컨텍솔루션 반도체 칩 테스트 소켓

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317550A (ja) * 1986-07-10 1988-01-25 Yamaichi Electric Mfg Co Ltd Ｉｃ載接形ソケツト
US4940432A (en) * 1989-09-08 1990-07-10 Amp Incorporated Contact element for test socket for flat pack electronic packages
JP3022593B2 (ja) * 1990-10-31 2000-03-21 株式会社秩父富士 Ｉｃソケット
US5120238A (en) * 1991-03-15 1992-06-09 Wells Electronics, Inc. Latching IC connector
US5336096A (en) * 1991-03-22 1994-08-09 Enplas Corporation IC socket and its contact pin
US5329227A (en) * 1993-05-18 1994-07-12 Aries Electronics, Inc. Test socket assembly for testing LCC packages of both rectangular and square configuration

Also Published As

Publication number Publication date
EP0644611A1 (de) 1995-03-22
EP0644611B1 (de) 1997-08-13
DE69404923T2 (de) 1998-02-05
KR950009278A (ko) 1995-04-21
US5562473A (en) 1996-10-08
JPH0794252A (ja) 1995-04-07
KR100340779B1 (ko) 2002-11-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee