DE69404923D1 - Fassung mit verbessertem Kontaktelement - Google Patents
Fassung mit verbessertem KontaktelementInfo
- Publication number
- DE69404923D1 DE69404923D1 DE69404923T DE69404923T DE69404923D1 DE 69404923 D1 DE69404923 D1 DE 69404923D1 DE 69404923 T DE69404923 T DE 69404923T DE 69404923 T DE69404923 T DE 69404923T DE 69404923 D1 DE69404923 D1 DE 69404923D1
- Authority
- DE
- Germany
- Prior art keywords
- socket
- contact element
- improved contact
- improved
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5256559A JPH0794252A (ja) | 1993-09-20 | 1993-09-20 | ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69404923D1 true DE69404923D1 (de) | 1997-09-18 |
DE69404923T2 DE69404923T2 (de) | 1998-02-05 |
Family
ID=17294327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69404923T Expired - Fee Related DE69404923T2 (de) | 1993-09-20 | 1994-09-19 | Fassung mit verbessertem Kontaktelement |
Country Status (5)
Country | Link |
---|---|
US (1) | US5562473A (de) |
EP (1) | EP0644611B1 (de) |
JP (1) | JPH0794252A (de) |
KR (1) | KR100340779B1 (de) |
DE (1) | DE69404923T2 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5869976A (en) * | 1996-12-13 | 1999-02-09 | Cirrus Logic, Inc. | Fine alignment IC handler and method for assembling same |
US6019612A (en) * | 1997-02-10 | 2000-02-01 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus for electrically connecting a device to be tested |
US5888075A (en) * | 1997-02-10 | 1999-03-30 | Kabushiki Kaisha Nihon Micronics | Auxiliary apparatus for testing device |
SG88739A1 (en) * | 1997-05-15 | 2002-05-21 | Nihon Micronics Kk | Auxiliary apparatus for testing device |
KR19990005516A (ko) * | 1997-06-30 | 1999-01-25 | 윤종용 | 반도체 칩 패키지 테스트용 테스트 소켓 |
JP2000150095A (ja) * | 1998-11-06 | 2000-05-30 | Itabashi Giken Kk | Icデバイス用ソケット |
US6441315B1 (en) * | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
JP3810977B2 (ja) * | 2000-02-25 | 2006-08-16 | 株式会社エンプラス | 電気部品用ソケット |
JP4044792B2 (ja) * | 2002-06-21 | 2008-02-06 | 新日本無線株式会社 | 半導体装置のテスト用電極装置 |
US7167167B2 (en) * | 2002-12-02 | 2007-01-23 | Eastman Kodak Company | Write head for a display tag having a liquid crystal display |
US6969270B2 (en) * | 2003-06-26 | 2005-11-29 | Intel Corporation | Integrated socket and cable connector |
TWM298775U (en) * | 2006-03-17 | 2006-10-01 | Giga Byte Tech Co Ltd | Structure of chip adapter |
TWM328132U (en) * | 2007-06-25 | 2008-03-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
WO2009149949A1 (de) * | 2008-06-12 | 2009-12-17 | Multitest Elektronische Systeme Gmbh | Kontaktsockel |
KR101126690B1 (ko) * | 2009-07-02 | 2012-04-02 | 남재우 | Mems 기술을 이용한 테스트 소켓 및 그 제조방법 |
CN103390826B (zh) * | 2012-05-08 | 2016-02-24 | 赛恩倍吉科技顾问(深圳)有限公司 | 电连接器 |
EP2725363B9 (de) | 2012-10-24 | 2015-03-25 | Multitest elektronische Systeme GmbH | Kontaktfeder für einen Prüfsockel für die Hochstrom-Prüfung eines elektronischen Bauteils |
EP2866036B1 (de) * | 2013-10-28 | 2016-08-10 | Multitest elektronische Systeme GmbH | Schraubenloser Kontaktfederaustausch |
US10537434B2 (en) * | 2016-08-08 | 2020-01-21 | Wu Jau Ching | Intervertebral implant |
KR102040009B1 (ko) * | 2018-10-01 | 2019-11-04 | 주식회사 세인블루텍 | 테스트 소켓 체결장치 |
KR102132662B1 (ko) * | 2019-09-16 | 2020-07-13 | 주식회사 마이크로컨텍솔루션 | 반도체 칩 테스트 소켓 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6317550A (ja) * | 1986-07-10 | 1988-01-25 | Yamaichi Electric Mfg Co Ltd | Ic載接形ソケツト |
US4940432A (en) * | 1989-09-08 | 1990-07-10 | Amp Incorporated | Contact element for test socket for flat pack electronic packages |
JP3022593B2 (ja) * | 1990-10-31 | 2000-03-21 | 株式会社秩父富士 | Icソケット |
US5120238A (en) * | 1991-03-15 | 1992-06-09 | Wells Electronics, Inc. | Latching IC connector |
US5336096A (en) * | 1991-03-22 | 1994-08-09 | Enplas Corporation | IC socket and its contact pin |
US5329227A (en) * | 1993-05-18 | 1994-07-12 | Aries Electronics, Inc. | Test socket assembly for testing LCC packages of both rectangular and square configuration |
-
1993
- 1993-09-20 JP JP5256559A patent/JPH0794252A/ja active Pending
-
1994
- 1994-08-23 US US08/294,299 patent/US5562473A/en not_active Expired - Fee Related
- 1994-09-16 KR KR1019940023534A patent/KR100340779B1/ko not_active IP Right Cessation
- 1994-09-19 EP EP94306841A patent/EP0644611B1/de not_active Expired - Lifetime
- 1994-09-19 DE DE69404923T patent/DE69404923T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0794252A (ja) | 1995-04-07 |
DE69404923T2 (de) | 1998-02-05 |
US5562473A (en) | 1996-10-08 |
KR100340779B1 (ko) | 2002-11-29 |
KR950009278A (ko) | 1995-04-21 |
EP0644611B1 (de) | 1997-08-13 |
EP0644611A1 (de) | 1995-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |