DE69403538D1 - Vorrichtung zur reaktiven Plasmagasphasenabscheidung eines elektrisch nichtleitenden Materials unter Verwendung einer abgeschirmten Sekundäranode - Google Patents

Vorrichtung zur reaktiven Plasmagasphasenabscheidung eines elektrisch nichtleitenden Materials unter Verwendung einer abgeschirmten Sekundäranode

Info

Publication number
DE69403538D1
DE69403538D1 DE69403538T DE69403538T DE69403538D1 DE 69403538 D1 DE69403538 D1 DE 69403538D1 DE 69403538 T DE69403538 T DE 69403538T DE 69403538 T DE69403538 T DE 69403538T DE 69403538 D1 DE69403538 D1 DE 69403538D1
Authority
DE
Germany
Prior art keywords
sputtering
plasma
electrically insulating
sputtered
secondary anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69403538T
Other languages
English (en)
Other versions
DE69403538T2 (de
Inventor
Homoyoun Talieh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69403538D1 publication Critical patent/DE69403538D1/de
Publication of DE69403538T2 publication Critical patent/DE69403538T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Polymerisation Methods In General (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
DE69403538T 1993-04-02 1994-03-25 Vorrichtung zur reaktiven Plasmagasphasenabscheidung eines elektrisch nichtleitenden Materials unter Verwendung einer abgeschirmten Sekundäranode Expired - Fee Related DE69403538T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/042,035 US6296743B1 (en) 1993-04-02 1993-04-02 Apparatus for DC reactive plasma vapor deposition of an electrically insulating material using a shielded secondary anode

Publications (2)

Publication Number Publication Date
DE69403538D1 true DE69403538D1 (de) 1997-07-10
DE69403538T2 DE69403538T2 (de) 1998-01-29

Family

ID=21919699

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69403538T Expired - Fee Related DE69403538T2 (de) 1993-04-02 1994-03-25 Vorrichtung zur reaktiven Plasmagasphasenabscheidung eines elektrisch nichtleitenden Materials unter Verwendung einer abgeschirmten Sekundäranode

Country Status (7)

Country Link
US (1) US6296743B1 (de)
EP (1) EP0618606B1 (de)
JP (1) JPH06346236A (de)
KR (1) KR100326503B1 (de)
AT (1) ATE154162T1 (de)
DE (1) DE69403538T2 (de)
ES (1) ES2105386T3 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH691686A5 (de) * 1995-11-16 2001-09-14 Unaxis Balzers Ag Vakuumbehandlungskammer.
US6254746B1 (en) 1996-05-09 2001-07-03 Applied Materials, Inc. Recessed coil for generating a plasma
TW324831B (en) * 1996-05-09 1998-01-11 Applied Materials Inc Plasma generating device
DE19757353C1 (de) * 1997-12-22 1999-07-29 Fraunhofer Ges Forschung Einrichtung zum Betreiben einer Niederdruckentladung
JP4717186B2 (ja) * 2000-07-25 2011-07-06 株式会社アルバック スパッタリング装置
JP4703828B2 (ja) * 2000-09-07 2011-06-15 株式会社アルバック スパッタリング装置及び薄膜製造方法
US6495000B1 (en) * 2001-07-16 2002-12-17 Sharp Laboratories Of America, Inc. System and method for DC sputtering oxide films with a finned anode
JP2004018896A (ja) * 2002-06-13 2004-01-22 Matsushita Electric Ind Co Ltd スパッタ膜の成膜方法
DE102006028977B4 (de) * 2006-06-23 2012-04-12 Qimonda Ag Sputterdepositions-Vorrichtung
CN107614737A (zh) * 2015-03-18 2018-01-19 视觉缓解公司 阳极防护罩

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038171A (en) * 1976-03-31 1977-07-26 Battelle Memorial Institute Supported plasma sputtering apparatus for high deposition rate over large area
DE3427587A1 (de) * 1984-07-26 1986-02-06 Leybold-Heraeus GmbH, 5000 Köln Zerstaeubungseinrichtung fuer katodenzerstaeubungsanlagen
DE3611492A1 (de) * 1986-04-05 1987-10-22 Leybold Heraeus Gmbh & Co Kg Verfahren und vorrichtung zum beschichten von werkzeugen fuer die zerspanungs- und umformtechnik mit hartstoffschichten
DE3612721C3 (de) 1986-04-16 1994-07-14 Ver Glaswerke Gmbh Durchlauf-Kathodenzerstäubungsanlage
DE4042289A1 (de) * 1990-12-31 1992-07-02 Leybold Ag Verfahren und vorrichtung zum reaktiven beschichten eines substrats
DE4125365C1 (de) 1991-07-31 1992-05-21 Multi-Arc Oberflaechentechnik Gmbh, 5060 Bergisch Gladbach, De

Also Published As

Publication number Publication date
JPH06346236A (ja) 1994-12-20
EP0618606A1 (de) 1994-10-05
US6296743B1 (en) 2001-10-02
DE69403538T2 (de) 1998-01-29
KR100326503B1 (ko) 2002-06-20
ATE154162T1 (de) 1997-06-15
ES2105386T3 (es) 1997-10-16
EP0618606B1 (de) 1997-06-04

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee