DE69401134D1 - Verfahren zum Herstellen eines thermischen Farbstrahldruckkopfs - Google Patents

Verfahren zum Herstellen eines thermischen Farbstrahldruckkopfs

Info

Publication number
DE69401134D1
DE69401134D1 DE69401134T DE69401134T DE69401134D1 DE 69401134 D1 DE69401134 D1 DE 69401134D1 DE 69401134 T DE69401134 T DE 69401134T DE 69401134 T DE69401134 T DE 69401134T DE 69401134 D1 DE69401134 D1 DE 69401134D1
Authority
DE
Germany
Prior art keywords
manufacturing
ink jet
thermal ink
jet printhead
printhead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69401134T
Other languages
English (en)
Other versions
DE69401134T2 (de
Inventor
Howard H Taub
Joan P Gallicano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69401134D1 publication Critical patent/DE69401134D1/de
Application granted granted Critical
Publication of DE69401134T2 publication Critical patent/DE69401134T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14387—Front shooter

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
DE69401134T 1993-01-25 1994-01-19 Verfahren zum Herstellen eines thermischen Farbstrahldruckkopfs Expired - Lifetime DE69401134T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/009,181 US5308442A (en) 1993-01-25 1993-01-25 Anisotropically etched ink fill slots in silicon

Publications (2)

Publication Number Publication Date
DE69401134D1 true DE69401134D1 (de) 1997-01-30
DE69401134T2 DE69401134T2 (de) 1997-04-03

Family

ID=21736058

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69401134T Expired - Lifetime DE69401134T2 (de) 1993-01-25 1994-01-19 Verfahren zum Herstellen eines thermischen Farbstrahldruckkopfs

Country Status (5)

Country Link
US (1) US5308442A (de)
EP (1) EP0609011B1 (de)
JP (1) JP3850043B2 (de)
DE (1) DE69401134T2 (de)
HK (1) HK91597A (de)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387314A (en) * 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
US5484507A (en) * 1993-12-01 1996-01-16 Ford Motor Company Self compensating process for aligning an aperture with crystal planes in a substrate
US5519423A (en) * 1994-07-08 1996-05-21 Hewlett-Packard Company Tuned entrance fang configuration for ink-jet printers
US5431775A (en) * 1994-07-29 1995-07-11 Eastman Kodak Company Method of forming optical light guides through silicon
FR2727648B1 (fr) * 1994-12-01 1997-01-03 Commissariat Energie Atomique Procede de fabrication micromecanique de buses pour jets de liquide
JP2795213B2 (ja) * 1995-04-04 1998-09-10 日本電気株式会社 インクジェットプリントヘッド
JPH08309986A (ja) * 1995-05-24 1996-11-26 Nec Corp インクジェット式プリントヘッド
US5992769A (en) * 1995-06-09 1999-11-30 The Regents Of The University Of Michigan Microchannel system for fluid delivery
JP3343875B2 (ja) * 1995-06-30 2002-11-11 キヤノン株式会社 インクジェットヘッドの製造方法
US5711891A (en) * 1995-09-20 1998-01-27 Lucent Technologies Inc. Wafer processing using thermal nitride etch mask
US5658471A (en) * 1995-09-22 1997-08-19 Lexmark International, Inc. Fabrication of thermal ink-jet feed slots in a silicon substrate
AUPN623895A0 (en) * 1995-10-30 1995-11-23 Eastman Kodak Company A manufacturing process for lift print heads with nozzle rim heaters
EP0771656A3 (de) * 1995-10-30 1997-11-05 Eastman Kodak Company Streuung der Düsen zur Verminderung der elektrostatischen Wechselwirkung zwischen gleichzeitig ausgestossenen Tröpfchen
US5891354A (en) * 1996-07-26 1999-04-06 Fujitsu Limited Methods of etching through wafers and substrates with a composite etch stop layer
US5793393A (en) * 1996-08-05 1998-08-11 Hewlett-Packard Company Dual constriction inklet nozzle feed channel
JP3713921B2 (ja) 1996-10-24 2005-11-09 セイコーエプソン株式会社 インクジェット式記録ヘッドの製造方法
US5971527A (en) * 1996-10-29 1999-10-26 Xerox Corporation Ink jet channel wafer for a thermal ink jet printhead
DE69730667T2 (de) * 1996-11-11 2005-09-22 Canon K.K. Verfahren zur Herstellung eines Durchgangslochs, Gebrauch dieses Verfahrens zur Herstellung eines Slikonsubstrates mit einem solchen Durchgangsloch oder eine Vorrichtung mit diesem Substrat, Verfahren zur Herstellung eines Tintenstrahl-Druckkopfes und Gebrauch dieses Verfahrens zur Herstellung eines Tintenstrahldruckkopfes
JP3984689B2 (ja) * 1996-11-11 2007-10-03 キヤノン株式会社 インクジェットヘッドの製造方法
US7195339B2 (en) 1997-07-15 2007-03-27 Silverbrook Research Pty Ltd Ink jet nozzle assembly with a thermal bend actuator
US6648453B2 (en) 1997-07-15 2003-11-18 Silverbrook Research Pty Ltd Ink jet printhead chip with predetermined micro-electromechanical systems height
US6682174B2 (en) 1998-03-25 2004-01-27 Silverbrook Research Pty Ltd Ink jet nozzle arrangement configuration
US7337532B2 (en) 1997-07-15 2008-03-04 Silverbrook Research Pty Ltd Method of manufacturing micro-electromechanical device having motion-transmitting structure
US6935724B2 (en) 1997-07-15 2005-08-30 Silverbrook Research Pty Ltd Ink jet nozzle having actuator with anchor positioned between nozzle chamber and actuator connection point
US6712453B2 (en) 1997-07-15 2004-03-30 Silverbrook Research Pty Ltd. Ink jet nozzle rim
US6855264B1 (en) 1997-07-15 2005-02-15 Kia Silverbrook Method of manufacture of an ink jet printer having a thermal actuator comprising an external coil spring
US7465030B2 (en) 1997-07-15 2008-12-16 Silverbrook Research Pty Ltd Nozzle arrangement with a magnetic field generator
US7381340B2 (en) * 1997-07-15 2008-06-03 Silverbrook Research Pty Ltd Ink jet printhead that incorporates an etch stop layer
US7468139B2 (en) 1997-07-15 2008-12-23 Silverbrook Research Pty Ltd Method of depositing heater material over a photoresist scaffold
US7556356B1 (en) 1997-07-15 2009-07-07 Silverbrook Research Pty Ltd Inkjet printhead integrated circuit with ink spread prevention
US6019907A (en) * 1997-08-08 2000-02-01 Hewlett-Packard Company Forming refill for monolithic inkjet printhead
US6042222A (en) * 1997-08-27 2000-03-28 Hewlett-Packard Company Pinch point angle variation among multiple nozzle feed channels
US6322201B1 (en) * 1997-10-22 2001-11-27 Hewlett-Packard Company Printhead with a fluid channel therethrough
US6264309B1 (en) * 1997-12-18 2001-07-24 Lexmark International, Inc. Filter formed as part of a heater chip for removing contaminants from a fluid and a method for forming same
US6267251B1 (en) * 1997-12-18 2001-07-31 Lexmark International, Inc. Filter assembly for a print cartridge container for removing contaminants from a fluid
JP3408130B2 (ja) * 1997-12-19 2003-05-19 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法
US6273557B1 (en) 1998-03-02 2001-08-14 Hewlett-Packard Company Micromachined ink feed channels for an inkjet printhead
ITTO980562A1 (it) 1998-06-29 1999-12-29 Olivetti Lexikon Spa Testina di stampa a getto di inchiostro
US6310641B1 (en) 1999-06-11 2001-10-30 Lexmark International, Inc. Integrated nozzle plate for an inkjet print head formed using a photolithographic method
IT1310099B1 (it) * 1999-07-12 2002-02-11 Olivetti Lexikon Spa Testina di stampa monolitica e relativo processo di fabbricazione.
JP4161493B2 (ja) * 1999-12-10 2008-10-08 ソニー株式会社 エッチング方法およびマイクロミラーの製造方法
US6260957B1 (en) 1999-12-20 2001-07-17 Lexmark International, Inc. Ink jet printhead with heater chip ink filter
US6425804B1 (en) 2000-03-21 2002-07-30 Hewlett-Packard Company Pressurized delivery system for abrasive particulate material
US6971170B2 (en) * 2000-03-28 2005-12-06 Microjet Technology Co., Ltd Method of manufacturing printhead
US6482574B1 (en) 2000-04-20 2002-11-19 Hewlett-Packard Co. Droplet plate architecture in ink-jet printheads
KR100413677B1 (ko) * 2000-07-24 2003-12-31 삼성전자주식회사 버블 젯 방식의 잉크 젯 프린트 헤드
IT1320599B1 (it) * 2000-08-23 2003-12-10 Olivetti Lexikon Spa Testina di stampa monolitica con scanalatura autoallineata e relativoprocesso di fabbricazione.
US6848773B1 (en) 2000-09-15 2005-02-01 Spectra, Inc. Piezoelectric ink jet printing module
US6402301B1 (en) 2000-10-27 2002-06-11 Lexmark International, Inc Ink jet printheads and methods therefor
US6675476B2 (en) * 2000-12-05 2004-01-13 Hewlett-Packard Development Company, L.P. Slotted substrates and techniques for forming same
US6648732B2 (en) 2001-01-30 2003-11-18 Hewlett-Packard Development Company, L.P. Thin film coating of a slotted substrate and techniques for forming slotted substrates
US7160806B2 (en) * 2001-08-16 2007-01-09 Hewlett-Packard Development Company, L.P. Thermal inkjet printhead processing with silicon etching
TW526142B (en) * 2001-08-28 2003-04-01 Nanodynamics Inc Ink supply structure of ink-jet print head
US6818464B2 (en) * 2001-10-17 2004-11-16 Hymite A/S Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
US6627467B2 (en) 2001-10-31 2003-09-30 Hewlett-Packard Development Company, Lp. Fluid ejection device fabrication
US7125731B2 (en) 2001-10-31 2006-10-24 Hewlett-Packard Development Company, L.P. Drop generator for ultra-small droplets
US6641745B2 (en) 2001-11-16 2003-11-04 Hewlett-Packard Development Company, L.P. Method of forming a manifold in a substrate and printhead substructure having the same
US7011392B2 (en) * 2002-01-24 2006-03-14 Industrial Technology Research Institute Integrated inkjet print head with rapid ink refill mechanism and off-shooter heater
US6942320B2 (en) * 2002-01-24 2005-09-13 Industrial Technology Research Institute Integrated micro-droplet generator
US7051426B2 (en) * 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
US6871942B2 (en) * 2002-04-15 2005-03-29 Timothy R. Emery Bonding structure and method of making
US6520624B1 (en) * 2002-06-18 2003-02-18 Hewlett-Packard Company Substrate with fluid passage supports
US6951622B2 (en) * 2002-08-08 2005-10-04 Industrial Technology Research Institute Method for fabricating an integrated nozzle plate and multi-level micro-fluidic devices fabricated
JP4107096B2 (ja) * 2003-02-10 2008-06-25 ヤマハ株式会社 ウェットエッチング方法
US6916090B2 (en) * 2003-03-10 2005-07-12 Hewlett-Packard Development Company, L.P. Integrated fluid ejection device and filter
EP1515364B1 (de) 2003-09-15 2016-04-13 Nuvotronics, LLC Gehäuse und Verfahren zu seiner Herstellung und zu seiner Prüfung
EP1684861B1 (de) * 2003-10-21 2014-12-03 The Regents Of The University Of Michigan Intrakranielles neurales schnittstellensystem
US7040016B2 (en) * 2003-10-22 2006-05-09 Hewlett-Packard Development Company, L.P. Method of fabricating a mandrel for electroformation of an orifice plate
KR100537522B1 (ko) 2004-02-27 2005-12-19 삼성전자주식회사 압전 방식의 잉크젯 프린트헤드와 그 노즐 플레이트의제조 방법
US7681306B2 (en) * 2004-04-28 2010-03-23 Hymite A/S Method of forming an assembly to house one or more micro components
US7267431B2 (en) * 2004-06-30 2007-09-11 Lexmark International, Inc. Multi-fluid ejection device
TWI250629B (en) * 2005-01-12 2006-03-01 Ind Tech Res Inst Electronic package and fabricating method thereof
WO2006138358A2 (en) 2005-06-14 2006-12-28 The Regents Of The University Of Michigan Technology Management Office Flexible polymer microelectrode with fluid delivery capability and methods for making same
CN100428415C (zh) * 2005-07-22 2008-10-22 中国科学院微电子研究所 基于氮化硅镂空掩模的纳米电极制备方法
CN101583309B (zh) * 2005-10-07 2012-07-04 神经连结科技公司 模块化多通道微电极阵列及其制造方法
US8195267B2 (en) 2006-01-26 2012-06-05 Seymour John P Microelectrode with laterally extending platform for reduction of tissue encapsulation
US7909434B2 (en) * 2006-10-27 2011-03-22 Hewlett-Packard Development Company, L.P. Printhead and method of printing
US8731673B2 (en) 2007-02-26 2014-05-20 Sapiens Steering Brain Stimulation B.V. Neural interface system
DE102007027434A1 (de) * 2007-06-14 2008-12-18 X-Fab Semiconductor Foundries Ag Verfahren zur Herstellung von Justagestrukturen für eine strukturierte Schichtabscheidung auf einem Mikrosystemtechnikwafer mittels einer Beschichtungsmaske
US8047156B2 (en) 2007-07-02 2011-11-01 Hewlett-Packard Development Company, L.P. Dice with polymer ribs
US8224417B2 (en) * 2007-10-17 2012-07-17 Neuronexus Technologies, Inc. Guide tube for an implantable device system
US8958862B2 (en) * 2007-10-17 2015-02-17 Neuronexus Technologies, Inc. Implantable device including a resorbable carrier
US8565894B2 (en) * 2007-10-17 2013-10-22 Neuronexus Technologies, Inc. Three-dimensional system of electrode leads
US8498720B2 (en) 2008-02-29 2013-07-30 Neuronexus Technologies, Inc. Implantable electrode and method of making the same
US9289142B2 (en) 2008-03-24 2016-03-22 Neuronexus Technologies, Inc. Implantable electrode lead system with a three dimensional arrangement and method of making the same
US20090240314A1 (en) * 2008-03-24 2009-09-24 Kong K C Implantable electrode lead system with a three dimensional arrangement and method of making the same
CN102202797A (zh) * 2008-10-31 2011-09-28 富士胶卷迪马蒂克斯股份有限公司 成形喷嘴出口
US8197029B2 (en) 2008-12-30 2012-06-12 Fujifilm Corporation Forming nozzles
BR112012008971A2 (pt) * 2009-10-16 2018-02-27 Neuroneux Tech Inc "sistema de interface neural e método para fabricação"
CN102686147B (zh) 2009-11-05 2016-01-20 格雷特巴奇有限公司 波导神经接口装置
US9155861B2 (en) 2010-09-20 2015-10-13 Neuronexus Technologies, Inc. Neural drug delivery system with fluidic threads
JP5645863B2 (ja) * 2012-03-14 2014-12-24 富士フイルム株式会社 ノズルプレートの製造方法
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US32572A (en) * 1861-06-18 Safety-guard for steam-boilers
USRE32572E (en) * 1985-04-03 1988-01-05 Xerox Corporation Thermal ink jet printhead and process therefor
US4601777A (en) * 1985-04-03 1986-07-22 Xerox Corporation Thermal ink jet printhead and process therefor
US4612554A (en) * 1985-07-29 1986-09-16 Xerox Corporation High density thermal ink jet printhead
US4638337A (en) * 1985-08-02 1987-01-20 Xerox Corporation Thermal ink jet printhead
US4789425A (en) * 1987-08-06 1988-12-06 Xerox Corporation Thermal ink jet printhead fabricating process
US4882595A (en) * 1987-10-30 1989-11-21 Hewlett-Packard Company Hydraulically tuned channel architecture
CA1300974C (en) * 1987-10-30 1992-05-19 Kenneth E. Trueba Hydraulically tuned channel architecture
US4829324A (en) * 1987-12-23 1989-05-09 Xerox Corporation Large array thermal ink jet printhead
US4808260A (en) * 1988-02-05 1989-02-28 Ford Motor Company Directional aperture etched in silicon
US4863560A (en) * 1988-08-22 1989-09-05 Xerox Corp Fabrication of silicon structures by single side, multiple step etching process
US4851371A (en) * 1988-12-05 1989-07-25 Xerox Corporation Fabricating process for large array semiconductive devices
US4899181A (en) * 1989-01-30 1990-02-06 Xerox Corporation Large monolithic thermal ink jet printhead
US4875968A (en) * 1989-02-02 1989-10-24 Xerox Corporation Method of fabricating ink jet printheads
US4899178A (en) * 1989-02-02 1990-02-06 Xerox Corporation Thermal ink jet printhead with internally fed ink reservoir
IT1234800B (it) * 1989-06-08 1992-05-27 C Olivetti & C Spa Sede Via Je Procedimento di fabbricazione di testine termiche di stampa a getto d'inchiostro e testine cosi' ottenute
US5131978A (en) * 1990-06-07 1992-07-21 Xerox Corporation Low temperature, single side, multiple step etching process for fabrication of small and large structures
US5141596A (en) * 1991-07-29 1992-08-25 Xerox Corporation Method of fabricating an ink jet printhead having integral silicon filter

Also Published As

Publication number Publication date
HK91597A (en) 1997-08-01
JPH071738A (ja) 1995-01-06
EP0609011B1 (de) 1996-12-18
DE69401134T2 (de) 1997-04-03
JP3850043B2 (ja) 2006-11-29
EP0609011A2 (de) 1994-08-03
US5308442A (en) 1994-05-03
EP0609011A3 (de) 1994-09-14

Similar Documents

Publication Publication Date Title
DE69401134D1 (de) Verfahren zum Herstellen eines thermischen Farbstrahldruckkopfs
DE69403352D1 (de) Verfahren zum Herstellen eines thermischen Farbstrahldruckkopfs
DE69603639D1 (de) Verfahren zum Herstellen eines Tintenstrahlkopfes
DE69406580D1 (de) Verfahren zum Betrieb eines Thermo-Farbstrahldruckers
DE69504975D1 (de) Verfahren zum antreiben eines tintenstrahldruckkopfes
DE69529317D1 (de) Farbstrahldruckkopf, Farbstrahldruckkopfpatrone, Farbstrahlauszeichnungsapparat und Verfahren zum Herstellen des Kopfes
DE69735214D1 (de) Verfahren zum Ansteuern eines Tintenstrahlaufzeichnungskopfes
DE69515572D1 (de) Verfahren zum Herstellen eines Substrates eines Tintenstrahldruckkopfes, Tintenstrahldruckkopf und Tintenstrahlaufzeichnungsapparat
DE69223584D1 (de) Verfahren und Vorrichtung zum Farbnachtränken eines Farbstrahlkopfes
DE69525329D1 (de) Verfahren zum Übergang zwischen Tintenstrahldruckbetriebsverfahren
DE69728336D1 (de) Verfahren und Vorrichtung zum Herstellen eines Tintenstrahldruckkopfes
DE69307000D1 (de) Verfahren zum Kleben von Bauteilen eines Farbstrahl-Thermodruckkopfes
DE69721854D1 (de) Verfahren zum Herstellen eines Flüssigkeitstrahlaufzeichnungskopfes
DE69405885D1 (de) Gerät und Verfahren zum Antreiben eines Tintenstrahlaufzeichnungskopfes
DE69308939D1 (de) Herstellungsverfahren einer Düse für einen Tintenstrahldruckkopf
DE68918410D1 (de) Herstellungsverfahren eines Farbstrahldruckkopfes.
DE69117825D1 (de) Verfahren zum Betrieb eines auf Abruf arbeitenden Tintenstrahldruckkopfes
DE69702965D1 (de) Verfahren zum betrieben eines tintenstrahldruckers
DE69205350D1 (de) Verfahren zur Herstellung eines Tintenstrahl-Druckerkopfes.
DE69504493D1 (de) Tintenstrahlkopf und verfahren zu dessen herstellung
DE69605161D1 (de) Tintenstrahlkopfverbindungseinheit, Tintenstrahlpatrone und Verfahren zum Zusammenbau der Tintenstrahlkopfverbindungseinheit
DE69905316D1 (de) Verfahren zum Ansteuern eines Tintenstrahldruckkopfes
DE69903491D1 (de) Verfahren zum Ansteuern eines Tintenstrahldruckkopfes
DE69212564D1 (de) Gerät und Verfahren zum Antreiben eines Tintenstrahlaufzeichnungskopfes
DE69204611D1 (de) Tintenstrahlkopf und ein Verfahren zu seiner Herstellung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE