DE69333837D1 - Verfahren zur Hybridisierung und Positionierung eines optoelektrischen Bauelements hinsichtlich eines integrierten Lichtwellenleiters - Google Patents

Verfahren zur Hybridisierung und Positionierung eines optoelektrischen Bauelements hinsichtlich eines integrierten Lichtwellenleiters

Info

Publication number
DE69333837D1
DE69333837D1 DE69333837T DE69333837T DE69333837D1 DE 69333837 D1 DE69333837 D1 DE 69333837D1 DE 69333837 T DE69333837 T DE 69333837T DE 69333837 T DE69333837 T DE 69333837T DE 69333837 D1 DE69333837 D1 DE 69333837D1
Authority
DE
Germany
Prior art keywords
hybridizing
regard
positioning
optical waveguide
integrated optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69333837T
Other languages
English (en)
Other versions
DE69333837T2 (de
Inventor
Serge Valette
Michel Ravetto
Gerard Destefanis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Application granted granted Critical
Publication of DE69333837D1 publication Critical patent/DE69333837D1/de
Publication of DE69333837T2 publication Critical patent/DE69333837T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10165—Alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/81139—Guiding structures on the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S359/00—Optical: systems and elements
    • Y10S359/90—Methods

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
DE69333837T 1992-08-14 1993-08-11 Verfahren zur Hybridisierung und Positionierung eines optoelektrischen Bauelements hinsichtlich eines integrierten Lichtwellenleiters Expired - Lifetime DE69333837T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9210040A FR2694841B1 (fr) 1992-08-14 1992-08-14 Procédé d'hybridation et de positionnement d'un composant opto-électronique et application de ce procédé au positionnement de ce composant par rapport à un guide optique intégré.
FR9210040 1992-08-14

Publications (2)

Publication Number Publication Date
DE69333837D1 true DE69333837D1 (de) 2005-08-04
DE69333837T2 DE69333837T2 (de) 2006-05-04

Family

ID=9432865

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69333837T Expired - Lifetime DE69333837T2 (de) 1992-08-14 1993-08-11 Verfahren zur Hybridisierung und Positionierung eines optoelektrischen Bauelements hinsichtlich eines integrierten Lichtwellenleiters

Country Status (4)

Country Link
US (1) US5321786A (de)
EP (1) EP0588675B1 (de)
DE (1) DE69333837T2 (de)
FR (1) FR2694841B1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774343A (ja) * 1993-08-31 1995-03-17 Fujitsu Ltd 集積化光装置及びその製造方法
JP3302458B2 (ja) * 1993-08-31 2002-07-15 富士通株式会社 集積化光装置及び製造方法
DE4423112A1 (de) * 1994-07-01 1996-01-04 Bosch Gmbh Robert Verfahren zum Herstellen und Justieren eines Halbleiterbauelements
JPH0990173A (ja) * 1995-09-27 1997-04-04 Furukawa Electric Co Ltd:The 表面実装モジュールとその製造方法
FR2748853A1 (fr) * 1996-05-20 1997-11-21 Commissariat Energie Atomique Systeme de composants a hybrider et procede d'hybridation autorisant un defaut de planeite des composants
FR2749672B1 (fr) * 1996-06-06 1998-07-03 Commissariat Energie Atomique Positionnement vertical d'un composant optoelectronique sur un support, en regard d'un guide optique integre a ce support
JP3792358B2 (ja) * 1997-07-30 2006-07-05 京セラ株式会社 光接続部品及びその製造方法
EP1122567A1 (de) 2000-02-02 2001-08-08 Corning Incorporated Passive Ausrichtung unter Verwendung von geneigter Sockelwand
US6614966B2 (en) * 2000-03-22 2003-09-02 Matsushita Electric Industrial Co., Ltd. Optical waveguide device integrated module and method of manufacturing the same
GB2381082A (en) * 2001-10-17 2003-04-23 Marconi Caswell Ltd Optical waveguide with alignment feature in core layer
WO2005004295A2 (en) * 2003-06-27 2005-01-13 Applied Materials, Inc. Pulsed quantum dot laser system with low jitter
US20060222024A1 (en) * 2005-03-15 2006-10-05 Gray Allen L Mode-locked semiconductor lasers with quantum-confined active region
US20060227825A1 (en) * 2005-04-07 2006-10-12 Nl-Nanosemiconductor Gmbh Mode-locked quantum dot laser with controllable gain properties by multiple stacking
GB0511300D0 (en) * 2005-06-03 2005-07-13 Ct For Integrated Photonics Th Control of vertical axis for passive alignment of optical components with wave guides
US8411711B2 (en) * 2005-12-07 2013-04-02 Innolume Gmbh Semiconductor laser with low relative intensity noise of individual longitudinal modes and optical transmission system incorporating the laser
US7561607B2 (en) * 2005-12-07 2009-07-14 Innolume Gmbh Laser source with broadband spectrum emission
US7835408B2 (en) * 2005-12-07 2010-11-16 Innolume Gmbh Optical transmission system
JP2009518833A (ja) * 2005-12-07 2009-05-07 インノルメ ゲゼルシャフト ミット ベシュレンクテル ハフツング 広帯域スペクトル発光を有するレーザ光源
US20090317033A1 (en) * 2008-06-20 2009-12-24 Industrial Technology Research Institute Integrated circuit and photonic board thereof
US11181688B2 (en) 2009-10-13 2021-11-23 Skorpios Technologies, Inc. Integration of an unprocessed, direct-bandgap chip into a silicon photonic device
US9882073B2 (en) * 2013-10-09 2018-01-30 Skorpios Technologies, Inc. Structures for bonding a direct-bandgap chip to a silicon photonic device
FR2994331B1 (fr) 2012-07-31 2014-09-12 Commissariat Energie Atomique Procede d'assemblage de deux composants electroniques entre eux, de type flip-chip
US9217836B2 (en) * 2012-10-23 2015-12-22 Kotura, Inc. Edge coupling of optical devices
US9608403B2 (en) 2014-11-03 2017-03-28 International Business Machines Corporation Dual bond pad structure for photonics
US20160291269A1 (en) 2015-04-01 2016-10-06 Coriant Advanced Technology, LLC Photonic integrated circuit chip packaging
CN113555449B (zh) * 2020-04-03 2024-03-15 华为技术有限公司 半导体器件及其制备方法和通信设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54142988A (en) * 1978-04-28 1979-11-07 Hitachi Ltd Photo semiconductor device
JPS60188913A (ja) * 1984-03-08 1985-09-26 Matsushita Electric Ind Co Ltd 光回路デバイス
JP2539406B2 (ja) * 1987-02-04 1996-10-02 株式会社日立製作所 固体光ピツクアツプ
FR2646558B1 (fr) * 1989-04-26 1994-04-01 Commissariat A Energie Atomique Procede et machine d'interconnexion de composants electriques par elements de soudure
US5023881A (en) * 1990-06-19 1991-06-11 At&T Bell Laboratories Photonics module and alignment method
US5230030A (en) * 1992-04-24 1993-07-20 Motorola, Inc. Interface coupling electronic circuitry

Also Published As

Publication number Publication date
EP0588675B1 (de) 2005-06-29
FR2694841A1 (fr) 1994-02-18
DE69333837T2 (de) 2006-05-04
EP0588675A1 (de) 1994-03-23
US5321786A (en) 1994-06-14
FR2694841B1 (fr) 1994-09-09

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