DE69330967T2 - Herstellung einer kombinierten starren/flexiblen mehrschichtigen leiterplatte - Google Patents

Herstellung einer kombinierten starren/flexiblen mehrschichtigen leiterplatte

Info

Publication number
DE69330967T2
DE69330967T2 DE69330967T DE69330967T DE69330967T2 DE 69330967 T2 DE69330967 T2 DE 69330967T2 DE 69330967 T DE69330967 T DE 69330967T DE 69330967 T DE69330967 T DE 69330967T DE 69330967 T2 DE69330967 T2 DE 69330967T2
Authority
DE
Germany
Prior art keywords
manufacture
circuit board
flexible multi
layered circuit
combined rigid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69330967T
Other languages
English (en)
Other versions
DE69330967D1 (de
Inventor
J Millette
Roland Caron
A Thoman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDY Industries LLC
Original Assignee
Teledyne Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teledyne Industries Inc filed Critical Teledyne Industries Inc
Application granted granted Critical
Publication of DE69330967D1 publication Critical patent/DE69330967D1/de
Publication of DE69330967T2 publication Critical patent/DE69330967T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
DE69330967T 1993-12-02 1993-12-02 Herstellung einer kombinierten starren/flexiblen mehrschichtigen leiterplatte Expired - Lifetime DE69330967T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1993/011684 WO1995015673A1 (en) 1993-12-02 1993-12-02 Fabrication multilayer combined rigid/flex printed circuit board

Publications (2)

Publication Number Publication Date
DE69330967D1 DE69330967D1 (de) 2001-11-22
DE69330967T2 true DE69330967T2 (de) 2002-07-04

Family

ID=22237255

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69330967T Expired - Lifetime DE69330967T2 (de) 1993-12-02 1993-12-02 Herstellung einer kombinierten starren/flexiblen mehrschichtigen leiterplatte

Country Status (5)

Country Link
EP (1) EP0732039B1 (de)
JP (1) JPH09509283A (de)
CA (1) CA2177275C (de)
DE (1) DE69330967T2 (de)
WO (1) WO1995015673A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012205439A1 (de) 2012-04-03 2013-10-10 Zf Friedrichshafen Ag Schaltungsträger und Verfahren zur Herstellung desselben

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62214939A (ja) * 1986-03-15 1987-09-21 Matsushita Electric Works Ltd 積層板の製法
US4800461A (en) * 1987-11-02 1989-01-24 Teledyne Industries, Inc. Multilayer combined rigid and flex printed circuits
US4918812A (en) * 1988-06-29 1990-04-24 International Business Machines Corporation Processing of cores for circuit boards or cards
JPH0756909B2 (ja) * 1988-11-30 1995-06-14 新神戸電機株式会社 片面印刷回路板の製造法および製造装置ならびに前記製造に用いる金属箔張積層板
JPH04154188A (ja) * 1990-10-18 1992-05-27 Cmk Corp 片面プリント配線板の製造法
US5144742A (en) * 1991-02-27 1992-09-08 Zycon Corporation Method of making rigid-flex printed circuit boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012205439A1 (de) 2012-04-03 2013-10-10 Zf Friedrichshafen Ag Schaltungsträger und Verfahren zur Herstellung desselben

Also Published As

Publication number Publication date
EP0732039B1 (de) 2001-10-17
CA2177275A1 (en) 1995-06-08
EP0732039A1 (de) 1996-09-18
WO1995015673A1 (en) 1995-06-08
JPH09509283A (ja) 1997-09-16
CA2177275C (en) 2004-07-06
DE69330967D1 (de) 2001-11-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition