DE69325729D1 - Verfahren und Anordnung zur Prüfung einer gedruckten Leiterplatte - Google Patents
Verfahren und Anordnung zur Prüfung einer gedruckten LeiterplatteInfo
- Publication number
- DE69325729D1 DE69325729D1 DE69325729T DE69325729T DE69325729D1 DE 69325729 D1 DE69325729 D1 DE 69325729D1 DE 69325729 T DE69325729 T DE 69325729T DE 69325729 T DE69325729 T DE 69325729T DE 69325729 D1 DE69325729 D1 DE 69325729D1
- Authority
- DE
- Germany
- Prior art keywords
- images
- processed
- acquired
- printed circuit
- video
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Analytical Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Input (AREA)
- Image Processing (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/839,831 US5260779A (en) | 1992-02-21 | 1992-02-21 | Method and apparatus for inspecting a printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69325729D1 true DE69325729D1 (de) | 1999-09-02 |
DE69325729T2 DE69325729T2 (de) | 2000-03-16 |
Family
ID=25280732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69325729T Expired - Fee Related DE69325729T2 (de) | 1992-02-21 | 1993-02-19 | Verfahren und Anordnung zur Prüfung einer gedruckten Leiterplatte |
Country Status (6)
Country | Link |
---|---|
US (1) | US5260779A (de) |
EP (1) | EP0557227B1 (de) |
JP (1) | JP3253397B2 (de) |
AT (1) | ATE182681T1 (de) |
CA (1) | CA2089917C (de) |
DE (1) | DE69325729T2 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5550583A (en) * | 1994-10-03 | 1996-08-27 | Lucent Technologies Inc. | Inspection apparatus and method |
JPH09172299A (ja) * | 1995-12-20 | 1997-06-30 | Matsushita Electric Ind Co Ltd | 基板認識装置 |
US5859924A (en) * | 1996-07-12 | 1999-01-12 | Robotic Vision Systems, Inc. | Method and system for measuring object features |
US6219442B1 (en) * | 1996-10-08 | 2001-04-17 | International Business Machines Corporation | Apparatus and method for measuring distortion of a visible pattern on a substrate by viewing predetermined portions thereof |
US6075883A (en) | 1996-11-12 | 2000-06-13 | Robotic Vision Systems, Inc. | Method and system for imaging an object or pattern |
US5760893A (en) * | 1996-12-24 | 1998-06-02 | Teradyne, Inc. | Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture |
US5862973A (en) * | 1997-01-30 | 1999-01-26 | Teradyne, Inc. | Method for inspecting solder paste in printed circuit board manufacture |
JP3893184B2 (ja) * | 1997-03-12 | 2007-03-14 | 松下電器産業株式会社 | 電子部品実装装置 |
US6084663A (en) * | 1997-04-07 | 2000-07-04 | Hewlett-Packard Company | Method and an apparatus for inspection of a printed circuit board assembly |
US6173071B1 (en) | 1997-12-16 | 2001-01-09 | Harold Wasserman | Apparatus and method for processing video data in automatic optical inspection |
US6941006B1 (en) * | 1998-03-05 | 2005-09-06 | Dupont Photomasks, Inc. | Method and system for calibrating the scan amplitude of an electron beam lithography instrument |
US7075565B1 (en) * | 2000-06-14 | 2006-07-11 | Landrex Technologies Co., Ltd. | Optical inspection system |
US6760471B1 (en) * | 2000-06-23 | 2004-07-06 | Teradyne, Inc. | Compensation system and related techniques for use in a printed circuit board inspection system |
US6930770B2 (en) | 2002-08-08 | 2005-08-16 | Applied Materials, Israel, Ltd. | High throughput inspection system and method for generating transmitted and/or reflected images |
IL162650A (en) * | 2004-06-21 | 2014-09-30 | Camtek Ltd | Incorrect unit mapping system for mapping multiple layers of single board and associated method |
US20110175997A1 (en) * | 2008-01-23 | 2011-07-21 | Cyberoptics Corporation | High speed optical inspection system with multiple illumination imagery |
US8670031B2 (en) * | 2009-09-22 | 2014-03-11 | Cyberoptics Corporation | High speed optical inspection system with camera array and compact, integrated illuminator |
US8388204B2 (en) * | 2009-09-22 | 2013-03-05 | Cyberoptics Corporation | High speed, high resolution, three dimensional solar cell inspection system |
US8681211B2 (en) * | 2009-09-22 | 2014-03-25 | Cyberoptics Corporation | High speed optical inspection system with adaptive focusing |
US8872912B2 (en) * | 2009-09-22 | 2014-10-28 | Cyberoptics Corporation | High speed distributed optical sensor inspection system |
US8894259B2 (en) * | 2009-09-22 | 2014-11-25 | Cyberoptics Corporation | Dark field illuminator with large working area |
JP5419761B2 (ja) | 2010-03-12 | 2014-02-19 | アズビル株式会社 | デバイス制御装置およびcpu |
FR3004881B1 (fr) | 2013-04-19 | 2015-04-17 | Kolor | Procede de generation d'un flux video de sortie a partir d'un flux video large champ |
US10033928B1 (en) | 2015-10-29 | 2018-07-24 | Gopro, Inc. | Apparatus and methods for rolling shutter compensation for multi-camera systems |
CN105352960B (zh) * | 2015-11-06 | 2017-12-29 | 浙江中烟工业有限责任公司 | 一种吸烟机烟支燃烧速率测定装置 |
CN105352961B (zh) * | 2015-11-06 | 2018-01-30 | 浙江中烟工业有限责任公司 | 一种烟支燃烧速率测定方法 |
US9792709B1 (en) | 2015-11-23 | 2017-10-17 | Gopro, Inc. | Apparatus and methods for image alignment |
US9973696B1 (en) | 2015-11-23 | 2018-05-15 | Gopro, Inc. | Apparatus and methods for image alignment |
US9848132B2 (en) * | 2015-11-24 | 2017-12-19 | Gopro, Inc. | Multi-camera time synchronization |
US9602795B1 (en) | 2016-02-22 | 2017-03-21 | Gopro, Inc. | System and method for presenting and viewing a spherical video segment |
US9973746B2 (en) | 2016-02-17 | 2018-05-15 | Gopro, Inc. | System and method for presenting and viewing a spherical video segment |
US10432855B1 (en) | 2016-05-20 | 2019-10-01 | Gopro, Inc. | Systems and methods for determining key frame moments to construct spherical images |
US9934758B1 (en) | 2016-09-21 | 2018-04-03 | Gopro, Inc. | Systems and methods for simulating adaptation of eyes to changes in lighting conditions |
US10268896B1 (en) | 2016-10-05 | 2019-04-23 | Gopro, Inc. | Systems and methods for determining video highlight based on conveyance positions of video content capture |
US10194101B1 (en) | 2017-02-22 | 2019-01-29 | Gopro, Inc. | Systems and methods for rolling shutter compensation using iterative process |
CN113109350A (zh) * | 2021-03-23 | 2021-07-13 | 深圳中科飞测科技股份有限公司 | 检测方法、系统、设备及计算机可读存储介质 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1438293A (en) * | 1972-09-28 | 1976-06-03 | Post Office | Television system for transmitting two or more pictures along a common communication channel |
US4161000A (en) * | 1977-10-28 | 1979-07-10 | Video Systems Research, Inc. | High speed television camera control system |
JPS63177274A (ja) * | 1987-01-17 | 1988-07-21 | Mitsubishi Electric Corp | パタ−ン認識装置 |
US4970597A (en) * | 1990-01-22 | 1990-11-13 | The United States Of America As Represented By The Secretary Of The Army | Method to image high speed events using a standard video camera |
US5060065A (en) * | 1990-02-23 | 1991-10-22 | Cimflex Teknowledge Corporation | Apparatus and method for illuminating a printed circuit board for inspection |
-
1992
- 1992-02-21 US US07/839,831 patent/US5260779A/en not_active Expired - Lifetime
-
1993
- 1993-02-19 DE DE69325729T patent/DE69325729T2/de not_active Expired - Fee Related
- 1993-02-19 CA CA002089917A patent/CA2089917C/en not_active Expired - Fee Related
- 1993-02-19 EP EP93470006A patent/EP0557227B1/de not_active Expired - Lifetime
- 1993-02-19 AT AT93470006T patent/ATE182681T1/de active
- 1993-02-22 JP JP03224893A patent/JP3253397B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH06222011A (ja) | 1994-08-12 |
JP3253397B2 (ja) | 2002-02-04 |
EP0557227B1 (de) | 1999-07-28 |
EP0557227A2 (de) | 1993-08-25 |
ATE182681T1 (de) | 1999-08-15 |
DE69325729T2 (de) | 2000-03-16 |
CA2089917C (en) | 2003-01-14 |
EP0557227A3 (en) | 1994-08-17 |
CA2089917A1 (en) | 1993-08-22 |
US5260779A (en) | 1993-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |