DE69325664D1 - Kapazitiver drucksensor auf sockel - Google Patents

Kapazitiver drucksensor auf sockel

Info

Publication number
DE69325664D1
DE69325664D1 DE69325664T DE69325664T DE69325664D1 DE 69325664 D1 DE69325664 D1 DE 69325664D1 DE 69325664 T DE69325664 T DE 69325664T DE 69325664 T DE69325664 T DE 69325664T DE 69325664 D1 DE69325664 D1 DE 69325664D1
Authority
DE
Germany
Prior art keywords
base
pressure sensor
capacitive pressure
capacitive
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69325664T
Other languages
English (en)
Other versions
DE69325664T2 (de
Inventor
Charles Willcox
Kevin Levy
Eric Petersen
Larry Peitersen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosemount Inc
Original Assignee
Rosemount Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosemount Inc filed Critical Rosemount Inc
Publication of DE69325664D1 publication Critical patent/DE69325664D1/de
Application granted granted Critical
Publication of DE69325664T2 publication Critical patent/DE69325664T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
DE69325664T 1992-09-01 1993-08-27 Kapazitiver drucksensor auf sockel Expired - Lifetime DE69325664T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93886992A 1992-09-01 1992-09-01
PCT/US1993/008097 WO1994005988A1 (en) 1992-09-01 1993-08-27 Pedestal mount capacitive pressure sensor

Publications (2)

Publication Number Publication Date
DE69325664D1 true DE69325664D1 (de) 1999-08-19
DE69325664T2 DE69325664T2 (de) 1999-12-09

Family

ID=25472103

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69325664T Expired - Lifetime DE69325664T2 (de) 1992-09-01 1993-08-27 Kapazitiver drucksensor auf sockel

Country Status (8)

Country Link
US (2) US5515732A (de)
EP (1) EP0672239B1 (de)
JP (1) JP3410095B2 (de)
CA (1) CA2141689C (de)
DE (1) DE69325664T2 (de)
IL (1) IL106790A (de)
RU (1) RU2120117C1 (de)
WO (1) WO1994005988A1 (de)

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US20040041254A1 (en) * 2002-09-04 2004-03-04 Lewis Long Packaged microchip
US7166911B2 (en) 2002-09-04 2007-01-23 Analog Devices, Inc. Packaged microchip with premolded-type package
US6768196B2 (en) * 2002-09-04 2004-07-27 Analog Devices, Inc. Packaged microchip with isolation
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US7361593B2 (en) * 2002-12-17 2008-04-22 Finisar Corporation Methods of forming vias in multilayer substrates
US20050056870A1 (en) * 2002-12-19 2005-03-17 Karpman Maurice S. Stress sensitive microchip with premolded-type package
US6923068B2 (en) * 2003-06-19 2005-08-02 Dynisco, Inc. Pressure transducer
US7153759B2 (en) * 2004-04-20 2006-12-26 Agency For Science Technology And Research Method of fabricating microelectromechanical system structures
US7115182B2 (en) * 2004-06-15 2006-10-03 Agency For Science, Technology And Research Anodic bonding process for ceramics
FR2871904B1 (fr) 2004-06-22 2006-09-22 Airbus Groupement D Interet Ec Dispostif de commande de fermeture d'un coffre a bagages
US6928878B1 (en) * 2004-09-28 2005-08-16 Rosemount Aerospace Inc. Pressure sensor
US7691723B2 (en) * 2005-01-07 2010-04-06 Honeywell International Inc. Bonding system having stress control
US8344487B2 (en) * 2006-06-29 2013-01-01 Analog Devices, Inc. Stress mitigation in packaged microchips
US20080222884A1 (en) * 2007-03-14 2008-09-18 Honeywell International Inc. Packaging for chip-on-board pressure sensor
US7694610B2 (en) * 2007-06-27 2010-04-13 Siemens Medical Solutions Usa, Inc. Photo-multiplier tube removal tool
US7434474B1 (en) * 2007-07-13 2008-10-14 Honeywell International Inc. Hermetic attachment method for pressure sensors
US7647835B2 (en) * 2007-09-19 2010-01-19 Honeywell International Inc. Pressure sensor stress isolation pedestal
US7798010B2 (en) * 2007-10-11 2010-09-21 Honeywell International Inc. Sensor geometry for improved package stress isolation
US7784366B2 (en) * 2008-07-29 2010-08-31 Motorola, Inc. Single sided capacitive force sensor for electronic devices
WO2010114465A1 (en) * 2009-03-30 2010-10-07 Ge Healthcare Bio-Sciences Ab Pressure sensor
US8516897B1 (en) * 2012-02-21 2013-08-27 Honeywell International Inc. Pressure sensor
EP2637007B1 (de) * 2012-03-08 2020-01-22 ams international AG Kapazitativer MEMS-Drucksensor
RU2511282C1 (ru) * 2012-10-31 2014-04-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана (МГТУ им. Н.Э. Баумана) Способ изготовления микроэлектромеханических структур и устройство для его осуществления
US9069959B2 (en) 2012-12-21 2015-06-30 Nxp B.V. Cryptographic circuit protection from differential power analysis
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
US8701496B1 (en) 2013-02-27 2014-04-22 Honeywell International Inc. Systems and methods for a pressure sensor having a two layer die structure
US10151647B2 (en) 2013-06-19 2018-12-11 Honeywell International Inc. Integrated SOI pressure sensor having silicon stress isolation member
JP2015175833A (ja) * 2014-03-18 2015-10-05 セイコーエプソン株式会社 物理量センサー、高度計、電子機器および移動体
BR112016028209A2 (pt) * 2014-06-23 2017-08-22 Microsoft Technology Licensing Llc sensor digitalizador com base capacitiva
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
DE102014119396A1 (de) * 2014-12-22 2016-06-23 Endress + Hauser Gmbh + Co. Kg Druckmesseinrichtung
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
DE102015117736A1 (de) 2015-10-19 2017-04-20 Endress+Hauser Gmbh+Co. Kg Druckmesseinrichtung
US10065853B2 (en) * 2016-05-23 2018-09-04 Rosemount Aerospace Inc. Optimized epoxy die attach geometry for MEMS die
US10676216B2 (en) * 2018-04-25 2020-06-09 International Business Machines Corporation Non-intrusive unmanned entity inspection
US10629009B2 (en) 2018-04-25 2020-04-21 International Business Machines Corporation Non-intrusive unmanned entity inspection
WO2019222598A1 (en) 2018-05-17 2019-11-21 Rosemount Inc. Measuring element and measuring device comprising the same
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
US11573145B2 (en) 2020-03-31 2023-02-07 Rosemount Aerospace Inc. Capacitive MEMS pressure sensor and method of manufacture
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture
US11656138B2 (en) 2020-06-19 2023-05-23 Rosemount Inc. Pressure sensor assembly
US11692895B2 (en) * 2021-03-30 2023-07-04 Rosemount Aerospace Inc. Differential pressure sensor

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Also Published As

Publication number Publication date
US5695590A (en) 1997-12-09
JPH08500902A (ja) 1996-01-30
EP0672239A4 (de) 1996-09-04
IL106790A0 (en) 1994-08-26
IL106790A (en) 1996-08-04
US5515732A (en) 1996-05-14
RU95106596A (ru) 1996-11-20
CA2141689A1 (en) 1994-03-17
EP0672239A1 (de) 1995-09-20
WO1994005988A1 (en) 1994-03-17
RU2120117C1 (ru) 1998-10-10
CA2141689C (en) 2005-03-01
EP0672239B1 (de) 1999-07-14
DE69325664T2 (de) 1999-12-09
JP3410095B2 (ja) 2003-05-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition