DE69325636T2 - Entlötband - Google Patents

Entlötband

Info

Publication number
DE69325636T2
DE69325636T2 DE69325636T DE69325636T DE69325636T2 DE 69325636 T2 DE69325636 T2 DE 69325636T2 DE 69325636 T DE69325636 T DE 69325636T DE 69325636 T DE69325636 T DE 69325636T DE 69325636 T2 DE69325636 T2 DE 69325636T2
Authority
DE
Germany
Prior art keywords
desoldering
tape
desoldering tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69325636T
Other languages
English (en)
Other versions
DE69325636D1 (de
Inventor
George M Kent
William H Strater
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TECH SPRAY L.P., AMARILLO, TEX., US
Original Assignee
Plato Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plato Products Inc filed Critical Plato Products Inc
Publication of DE69325636D1 publication Critical patent/DE69325636D1/de
Application granted granted Critical
Publication of DE69325636T2 publication Critical patent/DE69325636T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Nonwoven Fabrics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
DE69325636T 1992-12-28 1993-12-27 Entlötband Expired - Fee Related DE69325636T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/998,119 US5305941A (en) 1992-12-28 1992-12-28 Desoldering wick

Publications (2)

Publication Number Publication Date
DE69325636D1 DE69325636D1 (de) 1999-08-19
DE69325636T2 true DE69325636T2 (de) 1999-10-28

Family

ID=25544786

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69325636T Expired - Fee Related DE69325636T2 (de) 1992-12-28 1993-12-27 Entlötband

Country Status (4)

Country Link
US (1) US5305941A (de)
EP (1) EP0604966B1 (de)
JP (1) JP3383393B2 (de)
DE (1) DE69325636T2 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172254A (ja) * 1995-12-19 1997-06-30 Taiyo Denki Sangyo Kk ハンダ吸取線
US5746367A (en) * 1996-04-08 1998-05-05 Ceridan Corporation Method and apparatus to wick solder from conductive surfaces
DE19642627C2 (de) * 1996-10-16 1999-12-02 Frank Bergler Feinlöteinrichtung
US5901898A (en) * 1997-05-14 1999-05-11 Easy-Braid Company System for removing solder
DE19741144C1 (de) * 1997-09-18 1999-04-15 Siemens Matsushita Components Stromübertragungselement
US6208156B1 (en) * 1998-09-03 2001-03-27 Micron Technology, Inc. Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems
US6604644B1 (en) * 1999-05-25 2003-08-12 Ronald L. Fenton Filler element for a tank
ES2182646B1 (es) * 1999-10-27 2004-01-16 Bautista Andres Gesti Trenza de cobre aplicable para la extraccion del estaño incorporado en los circuitos impresos.
US20020150783A1 (en) * 2001-04-13 2002-10-17 Hougham Gareth Geoffrey Deformable coated wick liquid spilled material transfer
US6730848B1 (en) 2001-06-29 2004-05-04 Antaya Technologies Corporation Techniques for connecting a lead to a conductor
US20070175145A1 (en) * 2001-08-13 2007-08-02 Sacks Abraham J Lath with Barrier Material
US6655576B2 (en) * 2002-03-26 2003-12-02 United Technologies Corporation Process for disassembling a brazed structure
CN1575900A (zh) 2003-07-04 2005-02-09 白光株式会社 焊料加热工具
US7353983B2 (en) * 2003-10-28 2008-04-08 Temic Automotive Of North America, Inc. Vertical removal of excess solder from a circuit substrate
US7285173B2 (en) * 2003-11-21 2007-10-23 Illinois Tool Works, Inc. Desoldering systems and processes
US7134590B2 (en) * 2004-03-16 2006-11-14 Moon Gul Choi Desoldering sheath
US20050274488A1 (en) * 2004-05-28 2005-12-15 A-Loops Thermal Solution Corporation Heat-pipe engine structure
US20060081680A1 (en) * 2004-10-14 2006-04-20 Kayoko Yoshimura Desoldering wick for lead-free solder
US7608805B2 (en) * 2005-01-14 2009-10-27 Hakko Corporation Control system for battery powered heating device
US20060186172A1 (en) * 2005-02-18 2006-08-24 Illinois Tool Works, Inc. Lead free desoldering braid
KR100620213B1 (ko) * 2005-05-31 2006-09-06 어플라이드 사이언스(주) 스퍼터링 타겟의 솔더 본딩 방법
US7910855B2 (en) * 2005-09-23 2011-03-22 Lasx Industries, Inc. No gap laser welding of coated steel
TW200800453A (en) * 2006-06-22 2008-01-01 Asia Vital Component Co Plate heat pipe manufacturing method using ultrasound welding technique
DE102007017746B4 (de) * 2007-04-12 2011-03-31 Siemens Ag Vorrichtung und Verfahren zum Entfernen von Lotresten
US20090047496A1 (en) * 2007-08-16 2009-02-19 Hansen Robert A Multilayer fabric and manufacturing method thereof
US7958738B2 (en) * 2008-06-06 2011-06-14 Colmac Coil Mfg., Inc. Direct expansion ammonia refrigeration system and a method of direct expansion ammonia refrigeration
US8167189B2 (en) * 2010-03-30 2012-05-01 Lockheed Martin Corporation Methods for rework of a solder
US8413320B2 (en) * 2011-01-28 2013-04-09 Raytheon Company Method of gold removal from electronic components
TW201350760A (zh) * 2012-06-12 2013-12-16 Pro Iroda Ind Inc 金屬燈芯結構
KR101382168B1 (ko) * 2012-07-25 2014-04-10 한국기계연구원 주름진 격자형 와이어 메쉬의 브레이징 접합장치 및 이를 이용한 제조방법
TW201413175A (zh) 2012-09-26 2014-04-01 Pro Iroda Ind Inc 能夠調整火焰規模之燈芯
US9708816B2 (en) 2014-05-30 2017-07-18 Sacks Industrial Corporation Stucco lath and method of manufacture
US9752323B2 (en) 2015-07-29 2017-09-05 Sacks Industrial Corporation Light-weight metal stud and method of manufacture
US9797142B1 (en) 2016-09-09 2017-10-24 Sacks Industrial Corporation Lath device, assembly and method
MX2020001798A (es) 2017-08-14 2020-09-25 Vigas metálicas de longitud variada.
US10307850B2 (en) * 2017-08-24 2019-06-04 Micron Technology, Inc. Solder removal from semiconductor devices
US11351593B2 (en) 2018-09-14 2022-06-07 Structa Wire Ulc Expanded metal formed using rotary blades and rotary blades to form such
AU2019200674B1 (en) * 2019-01-03 2020-01-23 Pro-Iroda Industries, Inc. Metallic wick
DE102019126364A1 (de) * 2019-09-30 2021-04-01 Umfotec Gmbh Lagerbuchse und Verfahren zur Herstellung einer Lagerbuchse
CN113319396A (zh) * 2021-06-15 2021-08-31 西安微电子技术研究所 一种3d叠层封装器件的无损返修装置及方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2530552A (en) * 1946-01-08 1950-11-21 Champion Paper & Fibre Co Soldering method for positioning strip material
US3627191A (en) * 1968-03-18 1971-12-14 Jesse Carl Hood Jr Solder wick
US3726464A (en) * 1969-11-28 1973-04-10 T Howell Solder wick device
US3715797A (en) * 1970-10-23 1973-02-13 Wik It Electronics Corp Method for solder removal
US3941283A (en) * 1972-02-16 1976-03-02 The Nilodor Company, Inc. Timed drop applicator
CH595930A5 (en) * 1975-07-29 1978-02-28 Howag Ag Heated wick for melting and removing solder from joints
GB2082952B (en) * 1980-09-05 1984-04-18 Spiring Ernst Solder removing device
GB2094692B (en) * 1981-03-16 1985-08-07 Spirig Ernst Desoldering wicks
US4746050A (en) * 1987-01-20 1988-05-24 Frank Brown Solder removal devices
JPS6431573A (en) * 1987-07-27 1989-02-01 Mitsubishi Electric Corp Solder removing method
US4934582A (en) * 1989-09-20 1990-06-19 Microelectronics And Computer Technology Corporation Method and apparatus for removing solder mounted electronic components
US5094139A (en) * 1990-02-26 1992-03-10 Solder Removal Company Desoldering braid
US5083698A (en) * 1990-02-26 1992-01-28 Solder Removal Company Vacuum tip surmo-wick removal system
US5072874A (en) * 1991-01-31 1991-12-17 Microelectronics And Computer Technology Corporation Method and apparatus for using desoldering material

Also Published As

Publication number Publication date
DE69325636D1 (de) 1999-08-19
JP3383393B2 (ja) 2003-03-04
EP0604966B1 (de) 1999-07-14
JPH06297138A (ja) 1994-10-25
US5305941A (en) 1994-04-26
EP0604966A1 (de) 1994-07-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: TECH SPRAY L.P., AMARILLO, TEX., US

8339 Ceased/non-payment of the annual fee