DE69323356D1 - Bearbeitungsexcimerlaserverfahren und -vorrichtung - Google Patents

Bearbeitungsexcimerlaserverfahren und -vorrichtung

Info

Publication number
DE69323356D1
DE69323356D1 DE69323356T DE69323356T DE69323356D1 DE 69323356 D1 DE69323356 D1 DE 69323356D1 DE 69323356 T DE69323356 T DE 69323356T DE 69323356 T DE69323356 T DE 69323356T DE 69323356 D1 DE69323356 D1 DE 69323356D1
Authority
DE
Germany
Prior art keywords
machining
excimer laser
laser method
excimer
machining excimer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69323356T
Other languages
English (en)
Other versions
DE69323356T2 (de
Inventor
Yasuo Yamagishi
Kanae Shimizu
Daisuke Mizutani
Tamotsu Owada
Yoshikatsu Ishizuki
Hideya Hashii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69323356D1 publication Critical patent/DE69323356D1/de
Application granted granted Critical
Publication of DE69323356T2 publication Critical patent/DE69323356T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE69323356T 1992-07-20 1993-07-20 Bearbeitungsexcimerlaserverfahren und -vorrichtung Expired - Fee Related DE69323356T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19244692 1992-07-20
JP05898993A JP3212405B2 (ja) 1992-07-20 1993-03-18 エキシマレーザ加工方法及び装置

Publications (2)

Publication Number Publication Date
DE69323356D1 true DE69323356D1 (de) 1999-03-18
DE69323356T2 DE69323356T2 (de) 1999-06-10

Family

ID=26400008

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69323356T Expired - Fee Related DE69323356T2 (de) 1992-07-20 1993-07-20 Bearbeitungsexcimerlaserverfahren und -vorrichtung

Country Status (4)

Country Link
US (1) US5386430A (de)
EP (1) EP0580408B1 (de)
JP (1) JP3212405B2 (de)
DE (1) DE69323356T2 (de)

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US5614114A (en) * 1994-07-18 1997-03-25 Electro Scientific Industries, Inc. Laser system and method for plating vias
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
JPH0866781A (ja) * 1994-08-30 1996-03-12 Mitsubishi Electric Corp エキシマレーザビーム照射装置
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US5843363A (en) * 1995-03-31 1998-12-01 Siemens Aktiengesellschaft Ablation patterning of multi-layered structures
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US6067163A (en) * 1995-10-31 2000-05-23 Texas Instruments Incorporated Automated substrate pattern recognition system
US5877551A (en) * 1996-11-18 1999-03-02 Olin Corporation Semiconductor package having a ground or power ring and a metal substrate
US5989989A (en) * 1996-05-31 1999-11-23 Texas Instruments Incorporated Die and cube reroute process
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JP3292058B2 (ja) * 1996-10-01 2002-06-17 三菱電機株式会社 レーザ光による配線基板の加工方法及びその装置
US5731047A (en) * 1996-11-08 1998-03-24 W.L. Gore & Associates, Inc. Multiple frequency processing to improve electrical resistivity of blind micro-vias
US5868950A (en) * 1996-11-08 1999-02-09 W. L. Gore & Associates, Inc. Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques
US5965043A (en) * 1996-11-08 1999-10-12 W. L. Gore & Associates, Inc. Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias
US6025256A (en) * 1997-01-06 2000-02-15 Electro Scientific Industries, Inc. Laser based method and system for integrated circuit repair or reconfiguration
US6057180A (en) * 1998-06-05 2000-05-02 Electro Scientific Industries, Inc. Method of severing electrically conductive links with ultraviolet laser output
KR100282393B1 (ko) * 1998-06-17 2001-02-15 구자홍 유기이엘(el)디스플레이소자제조방법
US6140604A (en) * 1998-06-18 2000-10-31 General Electric Company Laser drilling breakthrough detector
DE19827414C2 (de) * 1998-06-19 2000-05-31 Schulz Harder Juergen Verfahren zum Herstellen eines Metall-Keramik-Substrates
US6070901A (en) * 1998-10-19 2000-06-06 Ford Global Technologies, Inc. Automotive instrument panel having an integral airbag
JP2000228439A (ja) * 1999-02-05 2000-08-15 Advantest Corp ステージ上のパーティクル除去方法及び清掃板
US6080959A (en) * 1999-03-12 2000-06-27 Lexmark International, Inc. System and method for feature compensation of an ablated inkjet nozzle plate
US6159659A (en) * 1999-04-26 2000-12-12 Creo Srl Method for processless flexographic printing and flexographic printing plate
JP3756723B2 (ja) * 1999-07-27 2006-03-15 松下電工株式会社 プリント配線板の加工方法
JP4133816B2 (ja) * 2001-08-09 2008-08-13 オーボテック リミテッド 多層電気回路内に埋め込まれたターゲットを露出させるためのシステムおよび方法
US20040022947A1 (en) * 2002-08-01 2004-02-05 Duignan Michael T. Method for creating microstructure patterns by contact transfer technique
JP4140440B2 (ja) * 2003-05-13 2008-08-27 住友電気工業株式会社 半導体装置の製造方法
DE102004005300A1 (de) * 2004-01-29 2005-09-08 Atotech Deutschland Gmbh Verfahren zum Behandeln von Trägermaterial zur Herstellung von Schltungsträgern und Anwendung des Verfahrens
US7556334B2 (en) * 2004-11-04 2009-07-07 Applied Materials, Inc. Methods and apparatus for aligning print heads
US20070065571A1 (en) * 2005-09-19 2007-03-22 Applied Materials. Inc. Method and apparatus for manufacturing a pixel matrix of a color filter for a flat panel display
US8290239B2 (en) * 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
US7923059B2 (en) * 2007-09-26 2011-04-12 Intel Corporation Method of enabling selective area plating on a substrate
US20090135348A1 (en) * 2007-10-26 2009-05-28 Applied Materials, Inc. Methods and apparatus for forming color filter on array flat panel displays
US7496885B1 (en) * 2008-04-02 2009-02-24 International Business Machines Corporation Method of compensating for defective pattern generation data in a variable shaped electron beam system
TWI417017B (zh) * 2009-07-30 2013-11-21 Unimicron Technology Corp 線路板的基材及其鑽孔方法
US8201928B2 (en) 2009-12-15 2012-06-19 Xerox Corporation Inkjet ejector having an improved filter
KR101108162B1 (ko) * 2010-01-11 2012-01-31 서울대학교산학협력단 고해상도 유기 박막 패턴 형성 방법
WO2012005816A2 (en) * 2010-06-30 2012-01-12 Resonetics Llc Precision laser ablation
DE102010046966B4 (de) * 2010-09-29 2018-05-24 Infineon Technologies Ag Baustein und Verfahren zur Herstellung eines Bausteins
JP2012117933A (ja) * 2010-12-01 2012-06-21 Denso Corp 接着構造体の製造方法
KR20120097893A (ko) * 2011-02-25 2012-09-05 삼성전자주식회사 포토 마스크 세정 장치 및 이를 이용한 포토 마스크 세정 방법
DE102011109449B9 (de) * 2011-08-04 2013-04-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum kalibrieren eines laserscanners, verwendung des verfahrens und bearbeitungssystem mit laserscanner
JP2013198905A (ja) * 2012-03-23 2013-10-03 Disco Corp レーザー加工装置
CN103909351A (zh) * 2013-01-04 2014-07-09 欣兴电子股份有限公司 线路板以及此线路板的激光钻孔方法
KR102391793B1 (ko) * 2014-10-03 2022-04-28 니혼 이타가라스 가부시키가이샤 관통 전극이 달린 유리 기판의 제조 방법 및 유리 기판
JP2020201221A (ja) * 2019-06-13 2020-12-17 株式会社ブイ・テクノロジー レーザ修正方法、レーザ修正装置
CN117500631A (zh) * 2021-08-31 2024-02-02 极光先进雷射株式会社 激光加工装置、激光加工方法和电子器件的制造方法
DE102021212893A1 (de) 2021-11-17 2023-05-17 Volkswagen Aktiengesellschaft Verfahren und Vorrichtung zur Herstellung einer Elektrode

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Also Published As

Publication number Publication date
EP0580408B1 (de) 1999-02-03
JP3212405B2 (ja) 2001-09-25
EP0580408A1 (de) 1994-01-26
DE69323356T2 (de) 1999-06-10
US5386430A (en) 1995-01-31
JPH0687087A (ja) 1994-03-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee